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    METHODS AND APPARATUS FOR CLEANING A SUBSTRATE EDGE USING CHEMICAL AND MECHANICAL POLISHING
    1.
    发明申请
    METHODS AND APPARATUS FOR CLEANING A SUBSTRATE EDGE USING CHEMICAL AND MECHANICAL POLISHING 审中-公开
    清洗使用化学和机械抛光的基板边缘的方法和装置

    公开(公告)号：US20080207093A1

    公开(公告)日：2008-08-28

    申请号：US12039418

    申请日：2008-02-28

    申请人： Sen-Hou Ko ,  Zhenhua Zhang ,  Yufei Chen ,  Wei-Yung Hsu

    发明人： Sen-Hou Ko ,  Zhenhua Zhang ,  Yufei Chen ,  Wei-Yung Hsu

    IPC分类号： B24B9/02 ,  B24B57/02

    CPC分类号： B24B9/065 ,  B24B57/02

    摘要： Methods and apparatus are provided for concurrently chemically and mechanically polishing a substrate edge. The invention includes a substrate support adapted to rotate a substrate; a polishing head adapted to contact an edge of the substrate, the polishing head including a first channel adapted to apply a first fluid to the edge of the substrate; a second channel adapted to direct a second fluid onto a major surface of the rotating substrate; and a third channel adapted to direct a third fluid at the major surface of the substrate and to prevent the second fluid from diluting the first fluid. Numerous other aspects are provided.

    摘要翻译： 提供了用于同时化学和机械抛光衬底边缘的方法和装置。 本发明包括适于旋转衬底的衬底支撑件; 抛光头，其适于接触所述基底的边缘，所述抛光头包括适于将第一流体施加到所述基底的边缘的第一通道; 第二通道，其适于将第二流体引导到所述旋转基板的主表面上; 以及第三通道，其适于在基底的主表面处引导第三流体并防止第二流体稀释第一流体。 提供了许多其他方面。

    METHODS AND APPARATUS FOR LOW COST AND HIGH PERFORMANCE POLISHING TAPE FOR SUBSTRATE BEVEL AND EDGE POLISHING IN SEMINCONDUCTOR MANUFACTURING
    2.
    发明申请
    METHODS AND APPARATUS FOR LOW COST AND HIGH PERFORMANCE POLISHING TAPE FOR SUBSTRATE BEVEL AND EDGE POLISHING IN SEMINCONDUCTOR MANUFACTURING 审中-公开
    低成本和高性能抛光胶带的方法和装置，用于在晶体管制造中进行基板水平和边缘抛光

    公开(公告)号：US20080293331A1

    公开(公告)日：2008-11-27

    申请号：US12124153

    申请日：2008-05-21

    申请人： Yufei Chen ,  Zhenhua Zhang ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Makoto Matsuo

    发明人： Yufei Chen ,  Zhenhua Zhang ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Makoto Matsuo

    IPC分类号： B24B9/06 ,  C08J5/14

    CPC分类号： B24B9/065 ,  B24B21/002

    摘要： Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device may be formed to include a base, a resin layer adhering to the base, and a plurality of embossed abrasive particles and/or abrasive beads affixed to the base by the resin layer. The plurality of abrasive particles and/or beads may be embossed in the resin layer. The plurality of abrasive beads may include a plurality of abrasive particles suspended in binder material. The plurality of abrasive particles and/or beads and the resin layer combine to form an abrasive side of the polishing device adapted to contact the substrate. Polishing of the substrate preferably includes polishing an edge of the substrate while the substrate is rotated by a holding device such that no apparatus other than the polishing tape contacts the edge while the substrate is rotating.

    摘要翻译： 提供的装置和方法涉及使用诸如抛光带的抛光装置来抛光衬底。 抛光装置可以形成为包括基底，粘附到基底的树脂层和由树脂层固定到基底的多个压花磨料颗粒和/或研磨珠。 多个研磨颗粒和/或珠可以在树脂层中压花。 多个研磨珠可以包括悬挂在粘合剂材料中的多个磨料颗粒。 多个研磨颗粒和/或珠粒和树脂层组合形成适于接触基底的抛光装置的研磨侧。 衬底的抛光优选包括在通过保持装置旋转衬底的同时抛光衬底的边缘，使得除了研磨带之外的其它装置在衬底旋转时不接触边缘。

    METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE
    5.
    发明申请
    METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE 审中-公开
    用于抛光衬底边缘的方法和装置

    公开(公告)号：US20070238393A1

    公开(公告)日：2007-10-11

    申请号：US11693695

    申请日：2007-03-29

    申请人： Ho Shin ,  Gary Ettinger ,  Donald Olgado ,  Erik Wasinger ,  Sen-Hou Ko ,  Charles Dodds ,  Yufei Chen ,  Wei-Yung Hsu

    发明人： Ho Shin ,  Gary Ettinger ,  Donald Olgado ,  Erik Wasinger ,  Sen-Hou Ko ,  Charles Dodds ,  Yufei Chen ,  Wei-Yung Hsu

    IPC分类号： B24B51/00 ,  B24B49/00 ,  B24B7/30

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/067 ,  B24B49/16 ,  B24B57/02

    摘要： Methods of and systems for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of one of energy and torque exerted in rotating the substrate against the polishing film. The invention may further include determining an amount of material removed from the edge of the substrate based on the detected energy or torque exerted in rotating the substrate against the polishing film; ascertaining a difference between the determined amount of material removed and a preset polish level; and determining an amount of energy or torque to be exerted in rotating the substrate adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level. Numerous other aspects are provided.

    摘要翻译： 提供了抛光衬底边缘的方法和系统。 本发明包括将衬底旋转抵靠抛光膜，以便从衬底的边缘去除材料; 并且检测在将衬底旋转抛光膜时施加的能量和扭矩中的一个的量。 本发明还可以包括基于在将衬底旋转抛光膜时所检测到的能量或扭矩确定从衬底边缘去除的材料量; 确定确定的去除材料量与预设抛光水平之间的差异; 以及基于所确定的所移除的材料量与所述预设的抛光水平之间的差来确定在旋转所述基板时施加的能量或扭矩的量，所述能量或扭矩适于实现预设的抛光水平。 提供了许多其他方面。

    Methods for reducing delamination during chemical mechanical polishing
    9.
    发明授权
    Methods for reducing delamination during chemical mechanical polishing 失效
    在化学机械抛光过程中减少分层的方法

    公开(公告)号：US07037174B2

    公开(公告)日：2006-05-02

    申请号：US10678906

    申请日：2003-10-03

    申请人： Yufei Chen ,  Lizhong Sun ,  Doohan Lee ,  Wei-Yung Hsu

    发明人： Yufei Chen ,  Lizhong Sun ,  Doohan Lee ,  Wei-Yung Hsu

    IPC分类号： B49D1/00

    CPC分类号： B24B37/042 ,  B24B49/006 ,  H01L21/02074 ,  H01L21/3212 ,  Y02P70/605

    摘要： Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.

    摘要翻译： 提供了用于抛光衬底的方法和装置，其包括具有降低或最小衬底表面损伤和分层的导电和低k电介质材料。 一方面，提供了一种处理衬底的方法，包括在具有旋转载体头和可旋转压板的抛光装置中定位其上具有导电材料的衬底，其中衬底设置在旋转载体头部中，并且压板具有 设置在其上的抛光制品，以第一载体头旋转速率旋转第一载体头并以第一压板旋转速率旋转压板，使基板和抛光制品接触，将第一载体头旋转速率加速到第二载体头旋转 速度并将第一压板转速加速到第二压板旋转速率，并以第二承载头转速和第二压板旋转速率抛光衬底。

    Methods for reducing delamination during chemical mechanical polishing
    10.
    发明授权
    Methods for reducing delamination during chemical mechanical polishing 失效
    在化学机械抛光过程中减少分层的方法

    公开(公告)号：US07244168B2

    公开(公告)日：2007-07-17

    申请号：US11393278

    申请日：2006-03-30

    申请人： Yufei Chen ,  Lizhong Sun ,  Doohan Lee ,  Wei-Yung Hsu

    发明人： Yufei Chen ,  Lizhong Sun ,  Doohan Lee ,  Wei-Yung Hsu

    IPC分类号： B24B49/00 ,  B24B1/00

    CPC分类号： B24B37/042 ,  B24B49/006 ,  H01L21/02074 ,  H01L21/3212 ,  Y02P70/605

    摘要： Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.

    摘要翻译： 提供了用于抛光衬底的方法和装置，其包括具有降低或最小衬底表面损伤和分层的导电和低k电介质材料。 一方面，提供了一种处理衬底的方法，包括在具有旋转载体头和可旋转压板的抛光装置中定位其上具有导电材料的衬底，其中衬底设置在旋转载体头部中，并且压板具有 设置在其上的抛光制品，以第一载体头旋转速率旋转第一载体头并以第一压板旋转速率旋转压板，使基板和抛光制品接触，将第一载体头旋转速率加速到第二载体头旋转 速度并将第一压板转速加速到第二压板旋转速率，并以第二承载头转速和第二压板旋转速率抛光衬底。