公开(公告)号：US20150014397A1

公开(公告)日：2015-01-15

申请号：US14500139

申请日：2014-09-29

申请人： Zimmer, Inc.

发明人： Gregory M. Hippensteel ,  Lawrence F. Peek ,  Jeffrey P. Anderson ,  Devendra Gorhe ,  Steve M. Allen ,  Clarence M. Panchison ,  David M. Miller ,  Joel G. Scrafton ,  Casey Harmon

IPC分类号： B23K20/02 ,  B23K20/24

CPC分类号： B23K20/023 ,  A61F2/30767 ,  A61F2/3859 ,  A61F2002/3092 ,  A61F2002/30929 ,  A61F2310/00029 ,  A61F2310/00544 ,  A61L27/045 ,  A61L27/047 ,  A61L27/50 ,  A61L27/56 ,  B23K20/02 ,  B23K20/16 ,  B23K20/233 ,  B23K20/24 ,  B23K35/005 ,  B23K35/3026 ,  B23K35/322 ,  B23K35/325 ,  B23K2103/08 ,  B23K2103/18 ,  B23K2103/26

摘要： Methods for bonding a porous tantalum structure to a substrate are provided. The method includes placing a compressible or porous interlayer between a porous tantalum structure and a cobalt or cobalt-chromium substrate to form an assembly. The interlayer comprising a metal or metal alloy that has solid state solubility with both the substrate and the porous tantalum structure. Heat and pressure are applied to the assembly to achieve solid state diffusion between the substrate and the interlayer and the between the porous tantalum structure and the interlayer.

摘要翻译： 提供了将多孔钽结构粘合到基底上的方法。 该方法包括在多孔钽结构和钴或钴 - 铬基底之间放置可压缩或多孔的中间层以形成组件。 该中间层包括与基底和多孔钽结构具有固态溶解度的金属或金属合金。 将热和压力施加到组件以实现衬底和中间层之间以及多孔钽结构和中间层之间的固态扩散。

公开(公告)号：US20140131925A1

公开(公告)日：2014-05-15

申请号：US14156726

申请日：2014-01-16

申请人： Zimmer, Inc.

发明人： Kirt Case ,  Oludele O. Popoola ,  Robby Kissling ,  Brion R. Mimnaugh ,  Archie Newsome ,  Clarence M. Panchison ,  Dirk Pletcher ,  Randy Schlemmer ,  Zhibin Fang ,  Juan Vivanco ,  Alicia Rufner

IPC分类号： B29C70/68 ,  B29C45/14 ,  B29C43/18

CPC分类号： B29C70/682 ,  A61B17/86 ,  A61F2/30942 ,  A61F2/34 ,  A61F2002/30329 ,  A61F2002/305 ,  A61F2002/3092 ,  A61F2002/3096 ,  A61F2002/30981 ,  A61F2002/3291 ,  A61F2002/3401 ,  A61F2002/3411 ,  A61F2220/0025 ,  A61F2310/00131 ,  A61L27/18 ,  A61L27/50 ,  A61L27/56 ,  B29C43/18 ,  B29C45/14 ,  C08L71/00

摘要： An orthopedic component having multiple layers that are selected to provide an overall modulus that is substantially lower than the modulus of known orthopedic components to more closely approximate the modulus of the bone into which the orthopedic component is implanted. In one exemplary embodiment, the orthopedic component is an acetabular shell. For example, the acetabular shell may include an outer layer configured for securement to the natural acetabulum of a patient and an inner layer configured to receive an acetabular liner. The head of a femoral prosthesis articulates against the acetabular liner to replicate the function of a natural hip joint. Alternatively, the inner layer of the acetabular shell may act as an integral acetabular liner against which the head of the femoral prosthesis articulates.

摘要翻译： 具有多个层的整形外科组件被选择以提供基本上低于已知矫形部件的模量的总模量，以更接近地将骨骼部件植入其中的骨的模数近似近似。 在一个示例性实施例中，矫形部件是髋臼壳。 例如，髋臼壳可以包括被配置用于固定到患者的天然髋臼的外层和构造成接收髋臼衬垫的内层。 股骨假体的头部与髋臼衬垫铰接以复制天然髋关节的功能。 或者，髋臼壳的内层可以作为整体的髋臼衬垫，股骨假体的头与该髋臼衬垫铰接。

公开(公告)号：US09718241B2

公开(公告)日：2017-08-01

申请号：US14156726

申请日：2014-01-16

申请人： Zimmer, Inc.

发明人： Kirt Case ,  Oludele O. Popoola ,  Robby Kissling ,  Brion R. Mimnaugh ,  Archie Newsome ,  Clarence M. Panchison ,  Dirk Pletcher ,  Randy Schlemmer ,  Zhibin Fang ,  Juan Vivanco ,  Alicia Rufner ,  John Knight

IPC分类号： B29C43/18 ,  B29C70/68 ,  A61F2/34 ,  A61L27/18 ,  A61L27/50 ,  A61L27/56 ,  B29C45/14 ,  A61B17/86 ,  A61F2/30 ,  A61F2/32

CPC分类号： B29C70/682 ,  A61B17/86 ,  A61F2/30942 ,  A61F2/34 ,  A61F2002/30329 ,  A61F2002/305 ,  A61F2002/3092 ,  A61F2002/3096 ,  A61F2002/30981 ,  A61F2002/3291 ,  A61F2002/3401 ,  A61F2002/3411 ,  A61F2220/0025 ,  A61F2310/00131 ,  A61L27/18 ,  A61L27/50 ,  A61L27/56 ,  B29C43/18 ,  B29C45/14 ,  C08L71/00

摘要： An orthopedic component having multiple layers that are selected to provide an overall modulus that is substantially lower than the modulus of known orthopedic components to more closely approximate the modulus of the bone into which the orthopedic component is implanted. In one exemplary embodiment, the orthopedic component is an acetabular shell. For example, the acetabular shell may include an outer layer configured for securement to the natural acetabulum of a patient and an inner layer configured to receive an acetabular liner. The head of a femoral prosthesis articulates against the acetabular liner to replicate the function of a natural hip joint. Alternatively, the inner layer of the acetabular shell may act as an integral acetabular liner against which the head of the femoral prosthesis articulates.

公开(公告)号：US20140151342A1

公开(公告)日：2014-06-05

申请号：US14175036

申请日：2014-02-07

申请人： Zimmer, Inc.

发明人： Joseph R. Vargas ,  Steven Seelman ,  Clarence M. Panchison

IPC分类号： A61F2/30 ,  B23K11/18 ,  B23K11/16

摘要： An apparatus and method are provided for manufacturing an orthopedic prosthesis by resistance welding a porous metal layer of the orthopedic prosthesis onto an underlying metal substrate of the orthopedic prosthesis. The resistance welding process involves directing an electrical current through the porous layer and the substrate, which dissipates as heat to cause softening and/or melting of the materials, especially along the interface between the porous layer and the substrate. The softened and/or melted materials undergo metallurgical bonding at points of contact between the porous layer and the substrate to fixedly secure the porous layer onto the substrate.

摘要翻译： 提供了一种用于通过将矫形假体的多孔金属层电阻焊到矫形假体的下面的金属基底上来制造整形外科假体的装置和方法。 电阻焊接工艺涉及引导电流通过多孔层和衬底，其消散为热量以引起材料的软化和/或熔化，特别是沿着多孔层和衬底之间的界面。 软化和/或熔化的材料在多孔层和基底之间的接触点处进行冶金结合，以将多孔层牢固地固定到基底上。

公开(公告)号：US11440118B2

公开(公告)日：2022-09-13

申请号：US16544103

申请日：2019-08-19

申请人： Zimmer, Inc.

发明人： Joseph R. Vargas ,  Steven Seelman ,  Clarence M. Panchison ,  Emmanuel L. Uzuyem ,  Carlos Holguin

IPC分类号： B23K9/00 ,  A61F2/30 ,  A61F2/36

摘要： An apparatus and method are provided for manufacturing an orthopedic prosthesis by resistance welding a porous metal layer of the orthopedic prosthesis onto an underlying metal substrate of the orthopedic prosthesis. The resistance welding process involves directing an electrical current through the porous layer and the substrate, which dissipates as heat to cause softening and/or melting of the materials, especially along the interface between the porous layer and the substrate. The softened and/or melted materials undergo metallurgical bonding at points of contact between the porous layer and the substrate to fixedly secure the porous layer onto the substrate.

公开(公告)号：US10537961B2

公开(公告)日：2020-01-21

申请号：US14175036

申请日：2014-02-07

申请人： Zimmer, Inc.

发明人： Joseph R. Vargas ,  Steven Seelman ,  Clarence M. Panchison

IPC分类号： A61F2/30 ,  B23K11/18 ,  B23K11/16 ,  A61F2/36

摘要： Methods are provided for manufacturing an orthopedic prosthesis by resistance welding a porous metal layer of the orthopedic prosthesis onto an underlying metal substrate of the orthopedic prosthesis. The resistance welding process involves directing an electrical current through the porous layer and the substrate, which dissipates as heat to cause softening and/or melting of the materials, especially along the interface between the porous layer and the substrate. The softened and/or melted materials undergo metallurgical bonding at points of contact between the porous layer and the substrate to fixedly secure the porous layer onto the substrate.

公开(公告)号：US10427235B2

公开(公告)日：2019-10-01

申请号：US13787150

申请日：2013-03-06

申请人： Zimmer, Inc.

发明人： Joseph R. Vargas ,  Steven Seelman ,  Clarence M. Panchison ,  Emmanuel L. Uzuyem ,  Carlos Holguin

IPC分类号： B23K9/00 ,  A61F2/30 ,  A61F2/36

摘要： An apparatus and method are provided for manufacturing an orthopedic prosthesis by resistance welding a porous metal layer of the orthopedic prosthesis onto an underlying metal substrate of the orthopedic prosthesis. The resistance welding process involves directing an electrical current through the porous layer and the substrate, which dissipates as heat to cause softening and/or melting of the materials, especially along the interface between the porous layer and the substrate. The softened and/or melted materials undergo metallurgical bonding at points of contact between the porous layer and the substrate to fixedly secure the porous layer onto the substrate.

公开(公告)号：US20130180970A1

公开(公告)日：2013-07-18

申请号：US13787150

申请日：2013-03-06

申请人： Zimmer, Inc.

发明人： Joseph R. Vargas ,  Steven Seelman ,  Clarence M. Panchison ,  Emmanuel L. Uzuyem ,  Carlos Holguin

IPC分类号： B23K9/00

CPC分类号： B23K9/0008 ,  A61F2/30907 ,  A61F2/3094 ,  A61F2/36 ,  A61F2002/30451 ,  A61F2002/3092 ,  A61F2002/30981 ,  A61F2310/00023 ,  A61F2310/00407

摘要： An apparatus and method are provided for manufacturing an orthopedic prosthesis by resistance welding a porous metal layer of the orthopedic prosthesis onto an underlying metal substrate of the orthopedic prosthesis. The resistance welding process involves directing an electrical current through the porous layer and the substrate, which dissipates as heat to cause softening and/or melting of the materials, especially along the interface between the porous layer and the substrate. The softened and/or melted materials undergo metallurgical bonding at points of contact between the porous layer and the substrate to fixedly secure the porous layer onto the substrate.

摘要翻译： 提供了一种用于通过将矫形假体的多孔金属层电阻焊到矫形假体的下面的金属基底上来制造整形外科假体的装置和方法。 电阻焊接工艺涉及引导电流通过多孔层和衬底，其消散为热量以引起材料的软化和/或熔化，特别是沿着多孔层和衬底之间的界面。 软化和/或熔化的材料在多孔层和基底之间的接触点处进行冶金结合，以将多孔层牢固地固定到基底上。