公开(公告)号：US20240191868A1

公开(公告)日：2024-06-13

申请号：US18287845

申请日：2022-04-21

Applicant: ams-OSRAM International GmbH

Inventor： Patrick HOERNER ,  Marc PHILIPPENS ,  Erwin LANG ,  Igor STANKE

IPC: F21V23/04 ,  F21V3/00 ,  F21V11/08 ,  H01L33/62

CPC classification number: F21V23/0485 ,  F21V3/00 ,  F21V11/08 ,  H01L33/62

Abstract: A control element includes a carrier element, a luminous foil in which or on which at least two optoelectronic components for generating light along a first main radiation direction as well as contact lines connected thereto are arranged, a diffuser layer downstream of the at least two optoelectronic components with respect to the first main radiation direction, a structured symbol element which is not in front of the diffuser layer with respect to the first main radiation direction and designed to form at least one symbol when the at least two optoelectronic components are operated and in a top view of the diffuser layer when viewed along the first main radiation direction, and a tactile sensor adapted to detect contact or pressure exerted along or opposite to the first main radiation direction to generate an electrical signal.

公开(公告)号：US20250056941A1

公开(公告)日：2025-02-13

申请号：US18717553

申请日：2022-11-24

Applicant: ams-OSRAM International GmbH

Inventor： Erwin LANG ,  Simon SCHWALENBERG ,  Igor STANKE ,  Patrick HÖRNER ,  Marc PHILIPPENS

IPC: H01L33/60 ,  H01L33/54 ,  H01L33/56

Abstract: An optoelectronic element includes a carrier, a semiconductor chip with an active layer for generating electromagnetic radiation, and an encapsulation element. The semiconductor chip is arranged on a main surface of the carrier. The encapsulation element is arranged on the main surface of the carrier, such that the optoelectronic element includes an intermediate space between the main surface of the carrier and the encapsulation element. The semiconductor chip is arranged in the intermediate space. The intermediate space is at least partially filled with hollow beads.

公开(公告)号：US20240006385A1

公开(公告)日：2024-01-04

申请号：US18267920

申请日：2021-12-10

Applicant: ams-OSRAM International GmbH

Inventor： Erwin LANG

IPC: H01L25/075 ,  H01L33/46 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/46 ,  H01L33/62 ,  H01L2933/0066 ,  H01L2933/0025

Abstract: A mirror display includes a mirror surface having a mirror layer with a first plurality of spaced apart recesses. The mirror display also includes a second plurality of optoelectronic components disposed on a drive layer having at least leads for driving the optoelectronic components. The mirror layer is arranged in an electrically insulated manner on the drive layer. In a top view of the mirror surface, in each case at least one optoelectronic component of the second plurality is arranged in a recess of the first plurality, the emission surface of which projects beyond the mirror surface.

公开(公告)号：US20250056944A1

公开(公告)日：2025-02-13

申请号：US18721679

申请日：2022-12-16

Applicant: ams-OSRAM International GmbH

Inventor： Igor STANKE ,  Marc PHILIPPENS ,  Erwin LANG

IPC: H01L33/62 ,  G06F3/041 ,  G06F3/042 ,  G06F3/044 ,  H01L25/075

Abstract: A touch-sensitive arrangement includes a carrier, an electrode layer, at least one light-emitting semiconductor body, and an encapsulation layer. The electrode layer is arranged between the carrier and the encapsulation layer and includes a first number N of detection areas and a second number M of illuminating areas. A detection area of the first number N of detection areas includes a first electrode. An illuminating area of the second number M of illuminating areas includes a first and a second contact connection line. The first contact connection line is coupled to a first terminal of the at least one light-emitting semiconductor body and the second contact connection line is coupled to a second terminal of the at least one light-emitting semiconductor body.