公开(公告)号：US10961119B1

公开(公告)日：2021-03-30

申请号：US15877999

申请日：2018-01-23

Applicant: mCube, Inc.

Inventor： Shih-Wei Lee ,  Wen-Chih Chen

IPC: B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  B81B7/00

Abstract: A MEMS device comprising a substrate comprising a die and a plurality of side-walls disposed upon the MEMS die, a proof-mass coupled to the substrate, the proof-mass is configured to be displaced within a first plane that is parallel to the die, wherein the proof-mass is configured to contact at least a sidewall, wherein the proof-mass is configured to adhere to the side-wall as a result of stiction forces, a driving circuit configured to provide a driving voltage in response to a driving signal indicating that the proof-mass is adhered to the side-wall, and an actuator coupled to the driving circuit disposed upon the side-wall, wherein the actuator is configured to receive a driving voltage and to provide an actuator force to the proof mass within the first plane in a direction away from the side-wall in response to the driving voltage, wherein the actuator force exceeds the stiction forces.

公开(公告)号：US10479676B2

公开(公告)日：2019-11-19

申请号：US16102592

申请日：2018-08-13

Applicant: mCube, Inc.

Inventor： Ben Lee ,  Ming Hong Kuo ,  Wen-Chih Chen ,  Wensen Tsai

IPC: G01R31/02 ,  B81C99/00 ,  G01R1/04 ,  G01R31/26 ,  H01L21/67

Abstract: A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.

公开(公告)号：US10046966B2

公开(公告)日：2018-08-14

申请号：US15479154

申请日：2017-04-04

Applicant: mCube, Inc.

Inventor： Ben Lee ,  Ming Hong Kuo ,  Wen-Chih Chen ,  Wensen Tsai

IPC: G01R31/26 ,  B81C99/00 ,  G01R1/04

Abstract: A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.