摘要:
An injection molding machine includes an electric ejector configured to eject a molding product from a mold, and an assist actuator configured to assist ejection of the molding product by the electric ejector.
摘要:
The invention relates to an ejector pin receivable in a mold part of a mold for encapsulating electronic components mounted on a carrier, wherein the substantially cylindrical ejector pin is provided with a side wall in which at least one recess is arranged close to the end which makes contact with the product for ejecting. The invention also relates to a mold part in which an opening is arranged for guiding an ejector pin, wherein at least one recess is arranged in the wall of the opening. The invention further includes a mold for encapsulating electronic components, in addition to a method for sealing an interspace between an ejector pin and an opening in a mold part.
摘要:
An injection molding machine comprising a processing pin provided in a fixed mold side is provided. A movable member is arranged in a space between the fixed mold and a fixed plate, the processing pin can be moved forward and backward together with the movable member with rear end portion thereof fixed to the movable member. An end portion of the processing pin is inserted into a mold plate so that it can go in and out of a gate or a cavity by the forward and backward movement of the movable member moved by a drive unit. The above construction can eliminate positional limitation due to a position of a projecting pin in a conventional injection molding machine.
摘要:
A molding apparatus for plastic parts which includes a stationary core plate and a moveable cavity plate used to form a mold cavity, and an ejector plate with pins utilized to eject the molded part from the apparatus. The valve used to inject the liquid plastic, which may be coupled to the core plate or the cavity plate, is always located on the same side of the plastic part as the ejector plate.
摘要:
A projection mechanism of a molding die configured to mold a molded article by a fixed-side die and a movable-side die, the projection mechanism including: a projection pin using a reaction force of a spring as a drive source; and a first spring and a second spring configured to project the projection pin, wherein the first spring has a maximum reaction force in a die clamping state, and projects the projection pin while gradually reducing the reaction force in a projection process, and the second spring projects the projection pin with a constant reaction force while projecting the projection pin from the die clamping state, where stop of movement of the second projection pin during the projection process causes compression of the second spring to increase the reaction force of the second spring, thereby energizing the projection pin to further project the projection pin.
摘要:
An exemplary ejection mechanism includes a first plate and a second plate opposite to the first plate, an ejector plate, ejectors, an actuator with a driving shaft, and a drive mechanism. The ejector plate and the drive mechanism are located between the first plate and the second plate. The ejection mechanism further defines first through holes which pass through the first plate and the second plate. The ejector plate defines a second through hole which is coaxial with the first through holes. The ejector extends from the ejecting plate to the first plate and aligns with the ejector hole of the first plate. The drive mechanism links with the driving shaft and the ejector plate, and the actuator drives the ejector plate between the first plate and the second plate via a drive mechanism, which makes the ejector eject or retract.
摘要:
Improved lifter (32) for injection molding apparatus and method of use thereof are disclosed. To inhibit the unsightly blemishes that may be formed in plastic parts wherein the lifter (32) comprises a leading edge (44) that is perpendicularly oriented relative to the longitudinal axis of the molded part, a lifter plate is provided wherein the leading edge (44) thereof is obliquely angled relative to the longitudinal axis of the molded part.
摘要:
A method for forming a part in an injection mold includes heating a polymer material to a temperature greater than or equal to a polymer glass transition temperature; injecting the polymer material into the injection molding apparatus of any of the preceding claims while pressing together the stationary half mold surface and the moving half mold surface to form the molding cavity; cooling a surface of the molding cavity with the cooling system; separating the stationary half mold surface and the moving half mold surface; and moving the ejection block relative to the stationary half thereby pushing the part away from the stationary half molding surface and ejecting the part from the injection molding apparatus.
摘要:
An exemplary ejection mechanism includes a first plate and a second plate opposite to the first plate, an ejector plate, ejectors, an actuator with a driving shaft, and a drive mechanism. The ejector plate and the drive mechanism are located between the first plate and the second plate. The ejection mechanism further defines first through holes which pass through the first plate and the second plate. The ejector plate defines a second through hole which is coaxial with the first through holes. The ejector extends from the ejecting plate to the first plate and aligns with the ejector hole of the first plate. The drive mechanism links with the driving shaft and the ejector plate, and the actuator drives the ejector plate between the first plate and the second plate via a drive mechanism, which makes the ejector eject or retract.
摘要:
An apparatus of the multiplunger type having a stationary die and a movable die opposed thereto includes stationary and movable cavity blocks and ejector plates removably mounted on stationary and movable die bases, respectively. The lower one of the die bases is removably provided with a plunger holder on which plungers are arranged at an adjustingly variable spacing. The above components on the die bases are easily changeable, while the spacing between the plungers is readily adjustable to the spacing between the pots in the cavity block to be used upon a change. The apparatus is suited to the production of various kinds of semiconductor devices in small quantities.