公开(公告)号：US5627913A

公开(公告)日：1997-05-06

申请号：US592599

申请日：1996-01-26

Applicant: Donald J. Spigarelli ,  John M. DeCarlo ,  Ernest LaFleur ,  Bryan R. Pinette

Inventor： Donald J. Spigarelli ,  John M. DeCarlo ,  Ernest LaFleur ,  Bryan R. Pinette

IPC: H05K13/08 ,  G06K9/00

CPC classification number: H05K13/08

Abstract: A placement apparatus for placing and mounting circuit components or devices in aligned combination with circuit boards. The apparatus includes an imaging system, a first stage moveable in first and second opposite directions between first and second predetermined positions, for positioning the circuit board onto which the component is to be placed within a field of view of the imaging system. A second stage, for holding the circuit component, is movably coupled to the first stage. The apparatus further includes a component pick-up system disposed about the first stage for picking up the circuit component from the second stage and placing the circuit component in a predetermined position on the first stage. The imaging system is coupled to a graphical user interface system for providing a position indicator on a monitor screen, wherein the position indicator identifies the location of a particular feature of the circuit board or the circuit component.

Abstract translation: 一种放置和安装与电路板对准的电路部件或装置的放置装置。 该装置包括成像系统，可在第一和第二预定位置之间的第一和第二相反方向上移动的第一阶段，用于将成像系统的视野内的组件放置在其上的电路板。 用于保持电路部件的第二级可移动地耦合到第一级。 该装置还包括一个组件拾取系统，该组件拾取系统设置在第一级周围，用于从第二级拾取电路部件，并将电路部件放置在第一级上的预定位置。 成像系统耦合到用于在监视器屏幕上提供位置指示器的图形用户界面系统，其中位置指示器识别电路板或电路部件的特定特征的位置。

公开(公告)号：US5060288A

公开(公告)日：1991-10-22

申请号：US573500

申请日：1990-08-27

Applicant: Donald J. Spigarelli ,  John M. DeCarlo ,  Karl E. Bahr

Inventor： Donald J. Spigarelli ,  John M. DeCarlo ,  Karl E. Bahr

IPC: B23K1/005 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K13/0465 ,  B23K1/0053 ,  H01L24/75 ,  H01L2924/14 ,  H05K3/3421 ,  H05K3/3494

Abstract: An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes a rectangular frame member having four radiation slits, a rectangular array of four IR lamps and associated lamp envelopes mounted in combination outside the frame member, X and Y pairs of reflecting members rotatably mounted within the frame member, and control subsystems for operating the IR lamps and aligning the focused IR radiation generated thereby. The radiation generated by the IR lamps is convergingly reflected by the associated lamp envelopes to pass through the radiation slits toward the rotational axis of the X and Y pairs of reflecting members. The X and Y pairs of reflecting members are rotationally oriented to reflect IR radiation onto the bonding sites to effect bonding of the FPD to the circuit board.

Abstract translation: 一种红外（IR）加热器阵列装置，其提供聚焦线的IR辐射用于焊接集成电路部件或装置，特别是精细间距集成电路装置（FPD），与印刷电路板对齐。 该装置被配置为与放置装置的放置头组合同心安装，其中，通过放置装置将装置固定在适当位置时，FPD和其它IC装置可以结合到电路板。 该装置的一个优选实施例包括具有四个辐射狭缝的矩形框架构件，四个IR灯的矩形阵列和组合在框架构件外部安装的相关灯泡信封，可旋转地安装在框架构件内的X和Y对反射构件，以及 控制子系统用于操作IR灯并对准由此产生的聚焦IR辐射。 由IR灯产生的辐射由相关联的灯包络会聚地反射，以朝向X和Y对反射构件的旋转轴线穿过辐射狭缝。 X和Y对的反射构件被旋转地定向以将IR辐射反射到结合位置上，以实现FPD与电路板的接合。

公开(公告)号：US5042571A

公开(公告)日：1991-08-27

申请号：US227353

申请日：1988-08-02

Applicant: William F. Drislane

Inventor： William F. Drislane

IPC: B23K1/012 ,  B23K3/047 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K3/3494 ,  B23K1/012 ,  B23K3/047 ,  H05K13/0465 ,  H05K2203/087

Abstract: A variable parameter heater for applying heat in a predetermined profile to a work surface. The heater has a plurality of elongated members which are interconnected to form a frame. Elongated members are slidingly adjustable to provide the intended heat profile. Each elongated member contains first and second rows of apertures. Heated air is delivered to the work surface past selectively energized heating elements disposed in the first row of apertures. Cool air where required is delivered to the work surface through the second row of apertures. The heater may include a vacuum probe for depositing or removing components relative to the work surface. The vacuum probe may also direct cool air to the work surface. Mirrors may be mounted upon elongated members to provide enhanced viewing of the work surface. In case of disablement, elongated members are individually removeble for repair or replacement.

Abstract translation: 一种用于将预定轮廓中的热量施加到工作表面的可变参数加热器。 加热器具有互连以形成框架的多个细长构件。 细长的构件是可滑动调节的，以提供预期的热分布。 每个细长构件包含第一和第二排孔。 加热的空气通过设置在第一排孔中的选择性激励的加热元件传送到工作表面。 需要时的冷空气通过第二排孔传送到工作表面。 加热器可以包括用于相对于工作表面沉积或去除部件的真空探针。 真空探头也可以将冷空气引导到工作表面。 镜子可以安装在细长构件上以提供对工作表面的增强的观察。 在失效的情况下，细长的构件可单独移除以进行修理或更换。

公开(公告)号：US5471310A

公开(公告)日：1995-11-28

申请号：US64426

申请日：1993-05-20

Applicant: Donald J. Spigarelli ,  John M. DeCarlo

Inventor： Donald J. Spigarelli ,  John M. DeCarlo

IPC: H05K13/08 ,  G01B11/27

CPC classification number: H05K13/08

Abstract: A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes an image acquisition processing subsystem. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective.

Abstract translation: 一种用于将集成电路（IC）部件或装置，特别是微型间距集成电路装置（FPD）放置和安装的引导型放置装置，与印刷电路板对齐。 该装置包括图像采集处理子系统。 图像采集子系统可操作以从相同的光学透视图生成放置位置和IC器件的至少一对斜对角的图像。

公开(公告)号：USD312646S

公开(公告)日：1990-12-04

申请号：US63635

申请日：1987-06-17

Applicant: Donald J. Spigarelli ,  William F. Drislane ,  H. Patrick Thornton ,  Bryan R. Hotaling

Designer： Donald J. Spigarelli ,  William F. Drislane ,  H. Patrick Thornton ,  Bryan R. Hotaling

公开(公告)号：US5317803A

公开(公告)日：1994-06-07

申请号：US962066

申请日：1992-10-16

Applicant: Donald J. Spigarelli ,  John M. DeCarlo ,  Karl E. Bahr

Inventor： Donald J. Spigarelli ,  John M. DeCarlo ,  Karl E. Bahr

IPC: H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0465 ,  H05K13/0408 ,  Y10T29/49144 ,  Y10T29/53191

Abstract: An integrated circuit device support tool which includes a device for providing a vacuum for holding an integrated circuit device to be soldered to a printed circuit board. The tool also includes a plurality of thin, pressure transferring members for pressing the leads of the integrated circuit device against a printed circuit board during soldering. The pressure transferring members are of a thin material so as not to provide a heat sink during the soldering operation.

Abstract translation: 一种集成电路器件支持工具，其包括用于提供用于保持待焊接到印刷电路板的集成电路器件的真空的器件。 该工具还包括多个薄的压力传递构件，用于在焊接期间将集成电路装置的引线压靠印刷电路板。 压力传递构件是薄的材料，以便在焊接操作期间不提供散热器。

公开(公告)号：US5309545A

公开(公告)日：1994-05-03

申请号：US749116

申请日：1991-08-23

Applicant: Donald J. Spigarelli ,  John M. DeCarlo ,  John A. Romano ,  William F. Drislane

Inventor： Donald J. Spigarelli ,  John M. DeCarlo ,  John A. Romano ,  William F. Drislane

IPC: B23K1/005 ,  H05K3/34 ,  H05K13/04 ,  B23K1/012

CPC classification number: B23K1/0053 ,  H05K13/0465 ,  H05K3/3421 ,  H05K3/3494

Abstract: A combined radiative and convective rework system is provided for repair, replacement, removal and rework of an electronic component on a printed circuit board. The system includes a guide for guiding heat-inducing radiation and heated gas towards at least one lead of the electronic component, and for preventing the heat-inducing radiation from damaging the body of the component. A heater, including a source of infrared radiation, provides the heat-inducing radiation and the heated gas. In one embodiment, the guide includes a single funnel cooperative with apparatus for reducing component body heating. In second and third embodiments, the guide includes two concentric funnels which form a volume which is traversed by the heat-inducing radiation and heated gas, and which provide at least one narrow region of heat energy to at least one of the leads, but not directly to the component body. In another embodiment, a plurality of removable guides are provided, each being specialized for use with a variety of different component types and sizes. The system also includes a viewing system for viewing the component along a central axis of symmetry of the guide.

Abstract translation: 提供组合的辐射和对流返修系统用于印刷电路板上的电子部件的修理，更换，移除和返修。 该系统包括用于将导热辐射和加热气体引向电子部件的至少一个引线的引导件，并且用于防止热诱导辐射损坏部件的主体。 包括红外辐射源的加热器提供导热辐射和加热的气体。 在一个实施例中，引导件包括与用于减少部件主体加热的装置协作的单漏斗。 在第二和第三实施例中，引导件包括形成体积的两个同心漏斗，该体积由导热辐射和加热气体穿过，并且向至少一个引线提供至少一个狭窄的热能区域，但不包括 直接到组件体。 在另一个实施例中，提供了多个可移除的引导件，每个引导件专门用于各种不同的部件类型和尺寸。 该系统还包括用于沿导向件的中心对称轴线观察部件的观察系统。

公开(公告)号：US5251266A

公开(公告)日：1993-10-05

申请号：US873581

申请日：1992-04-21

Applicant: Donald J. Spigarelli ,  John M. DeCarlo

Inventor： Donald J. Spigarelli ,  John M. DeCarlo

IPC: H05K13/08 ,  G06K9/00 ,  B23P19/00 ,  B25J19/00 ,  G02B27/32

CPC classification number: H05K13/08 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53261

Abstract: A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes a mechanical positioning subsystem, an image acquisition/processing subsystem, a master control subsystem, and optionally, a heater array subsystem. The mechanical positioning subsystem is sequentially operative to position the circuit board and IC device for the generation of images thereof, to align the IC device with a designated placement site on the board, and to mount the IC device in aligned combination with the board. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective. Images generated by the image acquisition subsystem provide feedback control to regulate the placement process to attain and verify lead-to-pad alignment. The heater array subsystem is utilized to bond the IC device to the circuit board while the mechanical positioning subsystem maintains the IC device in aligned combination with the board.

Abstract translation: 一种用于将集成电路（IC）部件或装置，特别是微型间距集成电路装置（FPD）放置和安装的引导型放置装置，与印刷电路板对齐。 该装置包括机械定位子系统，图像采集/处理子系统，主控制子系统以及可选的加热器阵列子系统。 机械定位子系统依次操作以定位电路板和IC器件以产生其图像，以使IC器件与板上的指定放置位置对准，并将IC器件与板对准地组装。 图像采集子系统可操作以从相同的光学透视图生成放置位置和IC器件的至少一对斜对角的图像。 由图像采集子系统产生的图像提供反馈控制，以调节放置过程以获得和验证引线对焊盘对准。 加热器阵列子系统用于将IC器件连接到电路板，同时机械定位子系统将IC器件与板对齐组合。

公开(公告)号：US5235407A

公开(公告)日：1993-08-10

申请号：US713966

申请日：1991-06-11

Applicant: Donald J. Spigarelli ,  John M. DeCarlo

Inventor： Donald J. Spigarelli ,  John M. DeCarlo

IPC: H05K13/08

CPC classification number: H05K13/08

Abstract: A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes an image acquisition/processing subsystem. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective. Images generated by the image acquisition subsystem provide feedback control to regulate the placement process to attain and verify lead-to-pad alignment.

Abstract translation: 一种用于将集成电路（IC）部件或装置，特别是微型间距集成电路装置（FPD）放置和安装的引导型放置装置，与印刷电路板对齐。 该装置包括图像采集/处理子系统。 图像采集子系统可操作以从相同的光学透视图生成放置位置和IC器件的至少一对斜对角的图像。 由图像采集子系统产生的图像提供反馈控制，以调节放置过程以获得和验证引线对焊盘对准。

公开(公告)号：US5278938A

公开(公告)日：1994-01-11

申请号：US660657

申请日：1991-02-22

Applicant: Donald J. Spigarelli ,  John M. DeCarlo ,  Karl E. Bahr

Inventor： Donald J. Spigarelli ,  John M. DeCarlo ,  Karl E. Bahr

IPC: B23K1/005 ,  H05K3/34 ,  H05K13/04 ,  F26B3/30

CPC classification number: H05K13/0465 ,  B23K1/0053 ,  H01L24/75 ,  H01L2924/14 ,  H05K3/3421 ,  H05K3/3494

Abstract: An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes an array of IR lamps and associated lamp envelopes and lenses, together with control apparatus for operating the IR lamps and aligning the focused IR radiation generated thereby. The radiation generated by the IR lamps is configured to provide a desired line pattern of energy which is directed onto the leads of a device being soldered. The perimeter of the energy pattern is programmably alterable to suit particular device lead sizes and configurations.

Abstract translation: 一种红外（IR）加热器阵列装置，其提供聚焦线的IR辐射用于焊接集成电路部件或装置，特别是精细间距集成电路装置（FPD），与印刷电路板对齐。 该装置被配置为与放置装置的放置头组合同心安装，其中，通过放置装置将装置固定在适当位置时，FPD和其它IC装置可以结合到电路板。 该装置的一个优选实施例包括一组IR灯和相关联的灯泡信封和透镜，以及用于操作IR灯并对准由此产生的聚焦IR辐射的控制装置。 由IR灯产生的辐射被配置为提供被引导到被焊接的设备的引线上的期望的能量线。 能量图案的周长可编程地可变，以适应特定的设备导线尺寸和配置。