摘要:
A system for assessing grip security, the system comprising: a contact surface having at least a first contact surface region and a second contact surface region, the first contact surface region being configured to resist slip less than the second contact surface region, a sensor for detecting slip in the first contact region.
摘要:
An information processing device according to one aspect of the present technology detects a slip generated in an object being gripped by a finger portion constituting a grip portion, and estimates an external force and an external moment applied to the object on the basis of the slip generated in the object. In addition, the information processing device controls the operation of an arm portion on the basis of the estimated external force and external moment to adjust at least one of the position or the posture of the finger portion constituting the grip portion provided in the arm portion. The present technology can be applied to a control device of a robot hand.
摘要:
An end-effector may include a base, a plurality of underactuated fingers coupled to the base; and an adhesion gripper coupled to the base. An end-effector may include a base, an actuator, a first underactuated finger comprising a proximal link and a distal link, the proximal link including a distal end, a guide for a first tendon spaced a first distance away from the distal end of the proximal link and the distal link including a lever arm disposed on a proximal side to the distal pad and which extends in a volar direction from a first axis, and a node disposed on the lever arm sized and shaped to receive a first tendon. The end-effector may include a first revolute joint compliant in a first direction disposed between the base and the proximal link; and a second revolute joint compliant in the first direction disposed between the proximal link and the distal link.
摘要:
A wafer handling traction control system is provided that is able to detect slippage of a semiconductor wafer with respect to an end effector and is able to adjust the end effector's movement in order to minimize further slippage. Upon the detection of relative motion of the semiconductor wafer with respect to the end effector past a threshold amount, the end effector's movements are adjusted to minimize slippage of the semiconductor wafer. The wafer handling traction control system may include a sensor that detects relative motion between the semiconductor wafer and the end effector.
摘要:
A wafer handling traction control system is provided that is able to detect slippage of a semiconductor wafer with respect to an end effector and is able to adjust the end effector's movement in order to minimize further slippage. Upon the detection of relative motion of the semiconductor wafer with respect to the end effector past a threshold amount, the end effector's movements are adjusted to minimize slippage of the semiconductor wafer. The wafer handling traction control system may include a sensor that detects relative motion between the semiconductor wafer and the end effector.
摘要:
A capacitive shear force sensor and a method for fabricating thereof are provided. The capacitive shear force sensor includes a first electric field shielding layer, a second electric field shielding layer, a driving electrode, a first sensing electrode, a second sensing electrode and a dielectric layer. The second electric field shielding layer is disposed under the first electric field shielding layer. The driving electrode is disposed between the first electric field shielding layer and the second electric field shielding layer. The first and the second sensing electrodes are disposed between the driving electrode and the second electric field shielding layer. The dielectric layer is disposed between the driving electrode and the first sensing electrode, and between the driving electrode and the second sensing electrode. The first sensing electrode and the driving electrode form a first capacitor. The second sensing electrode and the driving electrode form a second capacitor.
摘要:
A method (400) of processing signal outputs of a plurality of topologically distinct sensors in response to stimuli is described. The method comprises obtaining (402) a plurality of temporal sensor outputs in parallel. Thereafter, features are extracted (406), the features having dynamic behavior pattern. The extraction is performed in a topology consistent way by arithmetic processing in parallel of neighboring temporal sensor outputs. Furthermore, a quality of the extracted features is being determined.
摘要:
A first substrate that includes pressure sensors which are disposed in plural around a reference point; an approximately hemispherical elastic protrusion that is positioned so that the center of the elastic protrusion is approximately disposed in a position which is overlapped with the reference point, and is elastically deformed by an external force; and a second substrate that is separated from the elastic protrusion and installed on a side which is opposite to the first substrate are provided. When the external force is applied, a predetermined calculation is performed by using a pressure value which is detected through each pressure sensor, and the direction and the intensity of the applied external force are obtained.
摘要:
A load is gripped between a pair of load-engaging surfaces while the magnitude of any slippage between the load and the surfaces is variably sensed. A slip-correcting system variably predetermines an increase in the grip sufficient at least to decelerate the sensed magnitude of slippage, and the grip is automatically variably increased accordingly. Preferably, the magnitude of slippage sensed is a magnitude of relative movement between the load and the load-engaging surfaces, and preferably the magnitude of relative movement is a time-based magnitude such acceleration. The predetermined increase in the grip resulting from the sensed magnitude of slippage is preferably a predetermined increase in the proximity of the load-engaging surfaces, rather than any particular increase in the gripping force applied by the surfaces. A preferred fluid-powered embodiment of the clamp apparatus is disclosed for use on lift trucks in handling paper rolls and the like.
摘要:
A manipulator having a grasping mechanism for grasping an object and an arm mechanism for lifting the grasped object, is disclosed. A weight detector is provided which detects a force that the top of the arm mechanism receives in the gravitational direction when the grasped object is being lifted. In order to find the minimum grasping force sufficient to lift the object, a grasp detector is provided for detecting, from the output of the weight detector, that the object cannot be lifted up with the present grasping force and a desired grasping force selector for selecting successively a desired value of grasping force starting from a predetermined minimum desired value until it is detected that the object is lifted. A grasping force control circuit controls the grasping force to the selected desired value.