RAZOR BLADES
    5.
    发明申请
    RAZOR BLADES 审中-公开

    公开(公告)号:US20170341250A1

    公开(公告)日:2017-11-30

    申请号:US15665639

    申请日:2017-08-01

    IPC分类号: B26B21/56 B26B21/60 B26B21/58

    CPC分类号: B26B21/56 B26B21/58 B26B21/60

    摘要: A razor blade having a substrate with a cutting edge being defined by a sharpened tip. The substrate has thicknesses of 1.60-1.75 micrometers and 9.25-10.00 micrometers measured at a distance of four and forty micrometers from the blade tip, respectively. A ratio of the thickness measured at four micrometers to the thickness measured at forty micrometers is between 0.165-0.185. The substrate thickness is about 2.70-3.00 micrometers at eight micrometers from the blade tip, about 4.44-5.00 micrometers at sixteen micrometers from the blade tip with a thickness ratio measured at four micrometers and eight micrometers between 0.56-0.62, and a thickness ratio measured at four micrometers and sixteen micrometers between 0.32-0.40. The blade edge shape is defined by equation w=adn where “a” is between 0.50-0.62 and “n” is between 0.76-0.80. An included angle of less than 7° is measured at a distance of forty micrometers or greater from the blade tip. A nitrided substrate may also be provided.

    Methods Of Manufacturing Silicon Blades For Shaving Razors
    8.
    发明申请
    Methods Of Manufacturing Silicon Blades For Shaving Razors 有权
    制造剃刀刀片的方法

    公开(公告)号:US20150360376A1

    公开(公告)日:2015-12-17

    申请号:US14306702

    申请日:2014-06-17

    IPC分类号: B26B21/40 B26B21/56 B26B21/60

    摘要: Methods are provided for the manufacture of razor blades from silicon material. In some implementations, the method includes aligning a mono-crystalline silicon wafer comprising a {100} surface at an angle where {111} planes intersect the {100} surface parallel and perpendicular to the wafer; etching the mono-crystalline silicon wafer to expose an {111} plane and a second plane to provide a blade edge having between about a 20 degree included blade angle and about a 35 degree included blade angle; applying a hard coating on the blade edge; providing a radius of curvature of the blade edge between about 20 nanometers and about 100 nanometers after deposition of the hard coating; applying a soft coating on the blade edge; and removing the razor blade from the mono-crystalline silicon wafer.

    摘要翻译: 提供了用于从硅材料制造剃刀刀片的方法。 在一些实施方式中,该方法包括使{100}表面以{111}平面与{100}表面平行并垂直于晶片相交的角度对准包含{100}表面的单晶硅晶片; 蚀刻单晶硅晶片以露出{111}平面和第二平面,以提供具有约20度刀片角度和约35度刀片角度之间的刀片边缘; 在刀刃上施加硬涂层; 在硬涂层沉积之后提供叶片边缘的曲率半径在约20纳米和约100纳米之间; 在刀刃上施加柔软的涂层; 以及从单晶硅晶片去除剃刀刀片。