公开(公告)号：US20240063047A1

公开(公告)日：2024-02-22

申请号：US17820428

申请日：2022-08-17

申请人： Micron Technology, Inc.

发明人： Brandon P. WIRZ ,  Sui Chi HUANG ,  Youngrae KIM

IPC分类号： H01L21/683 ,  H01L21/78 ,  C09J7/30 ,  C09J7/25 ,  C09J7/28 ,  C09J7/20

CPC分类号： H01L21/6836 ,  H01L21/78 ,  C09J7/30 ,  C09J7/25 ,  C09J7/28 ,  C09J7/20 ,  C09J2203/366 ,  C09J2203/326 ,  C09J2301/1242 ,  C09J2400/143 ,  C09J2400/163 ,  C09J2400/10 ,  C09J2479/086

摘要： Implementations described herein relate to a mount tape and methods of using the mount tape for semiconductor device manufacturing. The mount tape may include a first adhesive layer configured for release at a first stage of a semiconductor device manufacturing process, a second adhesive layer configured for release at a second stage of the semiconductor device manufacturing process, and an inner support layer positioned between the first adhesive layer and the second adhesive layer and configured for removal during the semiconductor device manufacturing process.

公开(公告)号：US11845258B2

公开(公告)日：2023-12-19

申请号：US17451752

申请日：2021-10-21

申请人： ARMSTRONG WORLD INDUSTRIES, INC.

发明人： Ying Chang ,  Michelle Wang

IPC分类号： B32B7/06 ,  B32B7/12

CPC分类号： B32B7/06 ,  B32B7/12 ,  B32B2419/04 ,  C09J2203/366 ,  C09J2301/124 ,  Y10T428/14

摘要： Described herein is a method of covering a surface using a surface covering system. The surface may be a floor, a wall, or a ceiling. In one embodiment, the surface covering system includes a plurality of panels and an adhesive tape that is configured to detachably couple the panels to the surface. The adhesive tape may include a substrate-side adhesive component, a panel-side adhesive component, and a release component between the substrate-side and panel-side adhesive components. The panels may be detachably coupled to the substrate by the adhesive tape such that at least one adhesive layer of the substrate-side adhesive component is adhered to the substrate, at least one adhesive layer of the panel-side adhesive component is adhered to the rear surfaces of the panels, and the release component is between the substrate-side adhesive component and the panel-side adhesive component.