公开(公告)号：US20180211917A1

公开(公告)日：2018-07-26

申请号：US15877749

申请日：2018-01-23

申请人： Infineon Technologies AG

发明人： Juergen Hoegerl ,  Andre Arens ,  Holger Torwesten

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L23/29 ,  H01L23/373 ,  H01L23/498 ,  H01L23/34 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/34 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49589 ,  H01L23/49861 ,  H01L23/50 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/10272 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14251 ,  H01L2924/14252 ,  H01L2924/1426 ,  H01L2924/19105 ,  H01L2224/45099

摘要： A semiconductor module is disclosed. In one example, the module includes a carrier, at least one semiconductor transistor disposed on the carrier, at least one semiconductor diode disposed on the carrier, at least one semiconductor driver chip disposed on the carrier, a plurality of external connectors, and an encapsulation layer covering the carrier, the semiconductor transistor, the semiconductor diode, and the semiconductor driver chip. The semiconductor transistor, the semiconductor diode, and the semiconductor driver chip are arranged laterally side by side on the carrier.