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1.发明授权Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals 有权表面安装麦克风封装，麦克风布置，移动电话和用于记录麦克风信号的方法公开(公告)号：US09332330B2
公开(公告)日：2016-05-03
申请号：US13947930
申请日：2013-07-22
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss , Thomas Mueller
CPC classification number: H04R1/04 , B81B2201/0257 , H04R2201/00 , H04R2499/11
Abstract: A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
Abstract translation: 表面安装式麦克风封装包括第一麦克风和第二麦克风。 此外，表面可安装麦克风封装包括用于第一麦克风的第一开口和用于第二麦克风的第二开口。 第一开口和第二开口布置在可表面安装的麦克风包装的相对侧上。
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2.发明申请Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals 有权表面安装麦克风包，麦克风布置，手机和录音麦克风信号的方法公开(公告)号：US20150024807A1
公开(公告)日：2015-01-22
申请号：US13947930
申请日：2013-07-22
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Klaus Elian , Horst Theuss , Thomas Mueller
CPC classification number: H04R1/04 , B81B2201/0257 , H04R2201/00 , H04R2499/11
Abstract: A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
Abstract translation: 表面安装式麦克风封装包括第一麦克风和第二麦克风。 此外，表面可安装麦克风封装包括用于第一麦克风的第一开口和用于第二麦克风的第二开口。 第一开口和第二开口布置在可表面安装的麦克风封装的相对侧上。
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