摘要:
A universal abrasive article adapted to mount on a mounting surface of a sanding machine having a plurality of dust extraction holes that define an open area. The abrasive article includes a plurality of discrete apertures that are sized and positioned so as to expose a majority of the open area of the dust extraction holes independent of the angular orientation of the abrasive article when the abrasive article is in registration with the mounting surface. The discrete apertures may include elongated, arcuate slots that may be symmetrically positioned about a center point of the abrasive article. In one embodiment, the discrete apertures may include seven arcuate slots. These embodiments also include sufficient abrasive material to provide adequate sanding cut rate and structural integrity during use and removal.
摘要:
A nozzle assembly and method is configured to apply coherent jets of coolant in a tangential direction to the grinding wheel in a grinding process, at a desired temperature, pressure and flowrate, to minimize thermal damage in the part being ground. Embodiments of the present invention may be useful when grinding thermally sensitive materials such as gas turbine creep resistant alloys and hardened steels. Flowrate and pressure guidelines are provided to facilitate optimization of the embodiments.
摘要:
In the grinding process, grinding fluid is supplied toward the grinding point where a workpiece is ground with a grinding wheel. At the same time, a fluid jet is ejected across the air flow above the grinding point in the rotational direction of the grinding wheel. As a result, the air layers on both lateral sides of the grinding wheel are turned not to head for the grinding point above the same, whereby the grinding fluid is reliably led to the grinding point without being obstructed by the air layers following both lateral sides of the grinding wheel.
摘要:
In a grinding machine grinding a workpiece W by a grinding wheel G to supply coolant to one of a grinding point P or the workpiece W by way of a relative movement between the grinding wheel W rotatably supported on a wheel slide 11 and the workpiece W supported by a work support device 17, air layer 36 flowing on a circumferential surface Gc of said grinding wheel G by blowing hydraulic jet 35 transversally from one side to the other side of the grinding wheel G along the circumferential surface Gc at an upper stream position of a rotational direction of the grinding wheel G from the grinding point P. Mist of coolant blown by the hydraulic jet 35 through a recovering port 37, 43, 53 mounted on a wheel guard 20 covering a part of the grinding wheel G.
摘要:
An adhesive-backed sandpaper disc is affixed to the side wall of a standard off-the-shelf circular saw blade having two opposed flat planar faces devoid of any recesses and surrounded by a periphery of cutting teeth. The disc is made in a generally circular shape with an abrasive affixed on one surface and a layer of adhesive provided on an opposite surface covered with a release paper to prevent contamination before use. The sandpaper disc includes a plurality of slots extending toward or to the periphery of the disc which combine with the surface of the saw blade to create recesses that permit channeling of saw dust created during cutting and sanding operations. In an alternative embodiment, the slots can spiral in an arcuate path from adjacent the center of the disc to the periphery to enhance the ability of the slots to channel saw dust radially outwardly from the disc. A plurality of holes form cylindrical recesses in conjunction with the face of the saw blade to which the disc is affixed. These recesses permit dissipation of heat from the saw blade and also provide locations where saw dust can be retained so that it does not interfere with cutting and sanding operations. The disc not only sands the sides created during cutting operations but also dampens vibrations, balances the saw blade, and reduces noise. A method of using the disc is also disclosed.
摘要:
A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surface and a top ring for holding a substrate and pressing the substrate against the polishing surface to polish a surface having a semiconductor device thereon, and a cleaning section for cleaning the substrate which has been polished. The cleaning section has an electrolyzed water supply device for supplying electrolyzed water to the substrate to clean the polished surface of the substrate while supplying electrolyzed water to the substrate.
摘要:
An eyeglass lens processing apparatus for processing a periphery of an eyeglass lens, includes: a processing chamber in which a lens processing tool is disposed, the processing chamber having a drainage port; a water supply unit which supplies water for lens processing to an interior of the processing chamber; a drainpipe connected to the drainage port; a sensor which detects an amount of the water within the processing chamber or the drainpipe; and a controller which controls the water supply unit based on a result of detection by the sensor.
摘要:
A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen that are coupled to a vacuum source. When a vacuum is drawn through the apertures in the platen, the polishing pad is drawn tightly against the platen and may therefore be less likely to wrinkle when a semiconductor substrate is engaged with the polishing pad during planarization. When the vacuum is released, the polishing pad can be easily separated from the platen. The apparatus can further include a liquid trap to separate liquid from the fluid drawn by the vacuum source through the apertures, and can also include a releasable stop to prevent the polishing pad from separating from the platen should the vacuum source be deactivated while the platen is in motion. In another embodiment, a signal can be applied to the platen to draw the polishing pad toward the platen via electrostatic or electromagnetic forces. In still another embodiment, the polishing pad can be attached to a pad support and conditioned on a separate jig.
摘要:
A grinding wheel comprises an annular base and a grinding stone means mounted on the under surface of the base. A coolant pool which is open inward in a radial direction is formed in the inner surface of the base.
摘要:
A machining device includes a tool with a rotational axis and porous material with an outer peripheral surface disposed about the rotational axis and adapted to machine a surface of a workpiece. The machining device further includes a fluid delivery device oriented relative to the tool to disperse fluid to contact the tool primarily at a location inboard from the outer peripheral surface of the tool such that dispersed fluid is capable of flowing through the porous material. The machining device provides a controlled radial discharge of fluid at a workpiece surface in use. Methods of machining a workpiece are also provided.