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公开(公告)号:US6166431A
公开(公告)日:2000-12-26
申请号:US701425
申请日:1996-08-22
IPC分类号: H01L23/28 , H01L21/56 , H01L23/31 , H01L23/495 , H01L23/498 , H01C23/02 , H01C23/053
CPC分类号: H01L23/3121 , H01L23/49531 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L2224/45099 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/1579 , H01L2924/181 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a thickness in the range from 0.2 mm to 0.3 mm, an external connection lead, one end thereof being connected to a peripheral portion of the first surface of the frame plate main body, the other end thereof extending to the outside of the frame plate main body, a bonding wire for electrically connecting an electrode of the semiconductor pellet and a connection portion of the end of the external connection lead, and a sealing resin layer for covering and sealing at least a region including the semiconductor pellet, the bonding wire, and a connection portion.
摘要翻译: 公开了一种厚度为1mm以下的半导体器件,其包括厚度为0.1mm至0.25mm的框架板主体,设置在框架板主体的第一表面上并具有 厚度在0.2mm至0.3mm的范围内,外部连接引线,其一端连接到框架板主体的第一表面的周边部分,其另一端延伸到框架主体的外部 电连接半导体芯片的电极和外部连接引线的端部的连接部分的接合线,以及用于覆盖和密封至少包括半导体芯片,接合线和 连接部分。