High pressure counterflow heat exchanger

    公开(公告)号:US11598583B2

    公开(公告)日:2023-03-07

    申请号:US16796579

    申请日:2020-02-20

    摘要: A heat exchanger including a plurality of heat exchanger plates in a stacked arrangement. At least two counterflow sections are positioned adjacent each other. The counterflow sections comprise an intermediate section of each heat exchanger plate. The heat exchanger plates configured to transfer heat between a first fluid and a second fluid flowing in an opposite directions from the first fluid through a respective heat exchanger plate. At least one tent section is positioned on each end of each counterflow section. The tent sections are configured to angle the flow direction of the first and second fluids in the tent sections relative to the flow direction in the counterflow sections. A wall is positioned between each tent section and each counterflow section configured to provide a load path at opposite ends of the heat exchanger to oppose forces due to pressure on the tent sections.

    A HEAT EXCHANGER PLATE, AND A PLATE HEAT EXCHANGER

    公开(公告)号:US20230061944A1

    公开(公告)日:2023-03-02

    申请号:US17799602

    申请日:2021-01-15

    发明人: Jens ROMLUND

    IPC分类号: F28F3/02 F28D9/00

    摘要: A plate heat exchanger comprises heat exchanger plates each comprising a heat exchanger area extending in parallel with an extension plane and comprising a corrugation extending from a primary level on one side of the extension plane to a secondary level on an opposite side of the extension plane. Four porthole areas enclose a respective porthole and comprise two first porthole areas comprising a respective annular base area around the porthole at the secondary level. Each first porthole area comprises a first annular ridge around the porthole and projecting from the annular base area to the primary level, and a second annular ridge around and at a distance from the first annular ridge and projecting from the annular base area to the primary level. The first and second annular ridges are through-broken by a number of depressions.

    Void free injection-molded cold plates

    公开(公告)号:US11589477B2

    公开(公告)日:2023-02-21

    申请号:US16580605

    申请日:2019-09-24

    摘要: Methods and systems for creating cold plates are disclosed. For example, in one example method for manufacturing a cold plate made of a thermally-conductive plastic includes performing a first injection-molding process using the thermally-conductive plastic to produce a first unitary body, the first unitary body including one or more elongated sections forming a unitary body, performing a second injection-molding process using the thermally-conductive plastic to produce a second unitary body, the second unitary body incorporating the first unitary body so as to cover a majority of the first unitary body and form a respective coolant pipe body corresponding to each elongated section, and performing a machining process on the second unitary body so as to create a conduit in each respective coolant pipe body suitable for a fluid to pass through to create respective coolant pipes.

    HEAT EXCHANGER HAVING OPTIMIZED FLUID PASSAGES

    公开(公告)号:US20230023640A1

    公开(公告)日:2023-01-26

    申请号:US17783068

    申请日:2020-12-15

    IPC分类号: F28D9/00 F28F3/02 F28F3/06

    摘要: The invention relates to a heat exchanger that is configured to permit an exchange of heat between a first fluid and a second fluid that circulate in passage paths formed by plates (14a, 14b) and fins (16a, 16b) of the heat exchanger, the fluids flowing in a multitude of passage channels (10) each consisting of a closed space (12) delimited by two adjacent plates and two adjacent fins, characterized in that each plate extends along a non-planar surface following at least a first oscillating curve, and each fin further following at least one second oscillating curve along at least one second main direction, in such a way that each passage path allows the fluid to flow in the closed space along a fluid direction defined by a generatrix that is a combination at least of the first oscillating curve and the second oscillating curve.

    Electronic display with cooling
    7.
    发明授权

    公开(公告)号:US11540418B2

    公开(公告)日:2022-12-27

    申请号:US17751263

    申请日:2022-05-23

    摘要: A method for cooling a display assembly includes forcibly circulating gas about an airflow pathway extending within a housing and surrounding an image assembly. Forcibly ingesting ambient air into the housing through an intake, passing the ingested ambient air within the housing in a manner which provides thermal interaction with the circulating gas in said airflow pathway, and exhausting the ingested ambient air from the housing through an exhaust to cool the circulating gas.

    TWO-PASS HEAT EXCHANGER WITH CALIBRATED BYPASS

    公开(公告)号:US20220404100A1

    公开(公告)日:2022-12-22

    申请号:US17351788

    申请日:2021-06-18

    IPC分类号: F28D9/00 F28F3/02

    摘要: A two-pass heat exchanger with calibrated bypass is disclosed for cooling heat-generating substrates and/or for heating a heat transfer fluid. The heat exchanger has first and second outer plate walls and an intermediate plate wall located between and spaced from the outer plate walls in the thickness dimension of the heat exchanger, and with inlet and outlet ports at the same end. An input flow passage is defined between the first outer plate wall and the intermediate plate wall, and a return flow passage is defined between the second outer plate wall and the intermediate plate wall. The first and second fluid flow passages are in a U-flow, stacked arrangement. At least one bypass opening extends through the intermediate plate wall between the input and return flow passages, and configured to permit a portion of the heat transfer fluid to bypass portions of the input and return flow passages.

    Apparatus for thermal management of electronic components

    公开(公告)号:US11495519B2

    公开(公告)日:2022-11-08

    申请号:US16894257

    申请日:2020-06-05

    发明人: Doug Vanderwees

    IPC分类号: H01L23/427 H01L23/40 F28F3/02

    摘要: An electronic device includes a heat-generating electronic component, a heat spreader and a heat sink. The heat spreader has an area at least about 4 times greater than the heat-generating component. A first surface of the heat spreader is in thermal contact with the first surface of the heat-generating component along a first, non-dielectric interface. The heat sink has greater mass than the heat spreader and comprises one or more layers of thermally conductive material. A first surface of the heat sink is in thermal contact with the second surface of the heat spreader along a second interface having greater area than the first interface. Dielectric thermal interface material is provided at the second interface in direct contact with the heat spreader and the heat sink, such that the second interface is dielectric.