公开(公告)号：US20220344567A1

公开(公告)日：2022-10-27

申请号：US17719601

申请日：2022-04-13

申请人： Darwin Precisions Corporation

发明人： YU JEN LAI

IPC分类号： H01L41/09 ,  H01L41/053 ,  H01L41/047 ,  H01L41/31 ,  H01L41/29

摘要： A vibration module is disclosed. The vibration module includes a film, a piezoelectricity device, and a substrate. The film has a first surface. The piezoelectricity device is disposed on the first surface. The substrate is disposed on the first surface by in-mold injection method, which contacts and surrounds the piezoelectricity device.

公开(公告)号：US11427463B2

公开(公告)日：2022-08-30

申请号：US16165828

申请日：2018-10-19

申请人： STMICROELECTRONICS S.R.L.

发明人： Dario Paci ,  Marco Ferrera ,  Andrea Picco

IPC分类号： B81B3/00 ,  H01L41/09 ,  H01L41/22 ,  B81C1/00 ,  H01L41/31 ,  G02B3/14 ,  G02B26/08 ,  H01L25/16 ,  H01L41/187

摘要： A MEMS device comprising a body, having a first surface and a second surface; a diaphragm cavity in the body extending from the second surface of the body; a deformable portion in the body between the first surface and the diaphragm cavity; and a piezoelectric actuator, extending on the first surface of the body, over the deformable portion. The MEMS device is characterized in that it comprises a recess structure extending in the body and delimiting a stopper portion for the deformable portion.

公开(公告)号：US10944042B2

公开(公告)日：2021-03-09

申请号：US16231007

申请日：2018-12-21

申请人： BROTHER KOGYO KABUSHIKI KAISHA

发明人： Katsumi Kakamu

IPC分类号： H01L41/09 ,  H01L41/04 ,  H01L41/31 ,  B41J2/14 ,  B41J2/16 ,  H01L41/047 ,  H01L41/29

摘要： A piezoelectric actuator includes a substrate, a first electrode arranged on the substrate, a piezoelectric body stacked on the first electrode, a second electrode superimposed on a surface of the piezoelectric body on a side opposite to the first electrode, and a wiring connected to the first electrode. The first electrode has a connecting portion which is arranged to protrude from an end portion of the piezoelectric body and to which the wiring is connected, and a first conductive portion is provided so that the first conductive portion overlaps with the first electrode while extending over from an area overlapped with the end portion of the piezoelectric body up to the connecting portion of the first electrode.

公开(公告)号：US10735865B2

公开(公告)日：2020-08-04

申请号：US15404989

申请日：2017-01-12

申请人： SnapTrack, Inc.

发明人： Philip Jason Stephanou ,  David William Burns ,  Ravindra V. Shenoy

IPC分类号： H01L41/107 ,  H04R17/00 ,  G02B26/00 ,  H04R31/00 ,  G06F1/16 ,  H01L41/04 ,  H01L41/31

摘要： This disclosure provides systems, methods and apparatus for microspeaker devices. In one aspect, a microspeaker element may include a deformable dielectric membrane that spans a speaker cavity. The deformable dielectric membrane can include a piezoactuator and a dielectric layer. Upon application of a driving signal to the piezoactuator, the dielectric layer can deflect, producing sound. In some implementations, an array of microspeaker elements can be encapsulated between a glass substrate and a cover glass. Sound generated by the microspeaker elements can be emitted through a speaker grill formed in the cover glass.

公开(公告)号：US10587242B2

公开(公告)日：2020-03-10

申请号：US15266515

申请日：2016-09-15

申请人： Samsung Electro-Mechanics Co., Ltd.

发明人： Won Kyu Jeung

IPC分类号： H03H9/54 ,  H01L41/316 ,  H01L41/332 ,  H03H9/60 ,  H01L41/047 ,  H01L41/29 ,  H01L41/31 ,  H03H9/02 ,  H03H3/02 ,  H03H3/04

摘要： An acoustic wave filter includes a substrate, a first resonator disposed on the substrate, a second resonator disposed on the substrate to be spaced apart from the first resonator, a connector electrically connecting the first and second resonators, and a variable capacitor formed in the connector to tune a pass band frequency of the acoustic wave filter.

公开(公告)号：US20190283082A1

公开(公告)日：2019-09-19

申请号：US16349028

申请日：2017-11-10

申请人： NOVOSOUND LTD

发明人： David HUGHES ,  David HUTSON

IPC分类号： B06B1/06 ,  B81B3/00 ,  H01L41/08 ,  H01L41/187 ,  H01L41/31 ,  B06B1/02 ,  H01L41/047 ,  H01L41/339

摘要： A method for producing a plurality of piezoelectric ultrasound transducer elements, the method comprising providing or depositing a piezoelectric material on at least part of a surface of a sheet of substrate to form a layered member; and forming the one or more piezoelectric ultrasound transducer elements from the layered member.

公开(公告)号：US20190127214A1

公开(公告)日：2019-05-02

申请号：US16165828

申请日：2018-10-19

申请人： STMICROELECTRONICS S.R.L.

发明人： Dario PACI ,  Marco FERRERA ,  Andrea PICCO

IPC分类号： B81B3/00 ,  B81C1/00 ,  H01L41/09 ,  H01L25/16 ,  H01L41/31

摘要： A MEMS device comprising a body, having a first surface and a second surface; a diaphragm cavity in the body extending from the second surface of the body; a deformable portion in the body between the first surface and the diaphragm cavity; and a piezoelectric actuator, extending on the first surface of the body, over the deformable portion. The MEMS device is characterized in that it comprises a recess structure extending in the body and delimiting a stopper portion for the deformable portion.

公开(公告)号：US10199563B2

公开(公告)日：2019-02-05

申请号：US15804814

申请日：2017-11-06

申请人： SAMSUNG MEDISON CO., LTD.

发明人： Gil-Ju Jin ,  Jung-Lim Park

IPC分类号： H01L41/04 ,  H01L41/31 ,  H01L41/25 ,  H01L41/311 ,  H01L41/22 ,  H01L41/29 ,  B06B1/06 ,  A61B8/14 ,  A61B8/00 ,  H01L41/27

摘要： Provided is a method of manufacturing an ultrasound probe. The method includes: preparing a backing layer having first and second surfaces with different heights due to forming a groove in the backing layer, wherein first and second electrodes are exposed on the first and second surfaces, respectively; forming a third electrode that is in contact with the first electrode; forming a base piezoelectric unit on the third electrode, the base piezoelectric unit including a piezoelectric layer; forming a piezoelectric unit by removing an upper region of the base piezoelectric unit; and forming a fourth electrode on the backing layer and the piezoelectric unit.

公开(公告)号：US20180287049A1

公开(公告)日：2018-10-04

申请号：US15476954

申请日：2017-03-31

申请人： GENERAL ELECTRIC COMPANY

发明人： Philip Wayne Luk

IPC分类号： H01L41/257 ,  H01L41/293 ,  H01L41/297 ,  G11C11/4074 ,  H01L41/31 ,  H04R17/10

摘要： The present disclosure relates to methods of manufacture of piezoelectric ceramic transducers useable, for example, in an ultrasound probe, using a poling process. The poling is accomplished without contacting transducer elements and by subjecting the piezoelectric ceramic transducer to a corona discharge. The disclosure further describes a system for poling a transducer comprising at least one piezoelectric ceramic component or transducer assembly, a ground plane comprising an electrical polarity, and a corona source connected to a first power source configured to supply a first voltage to the corona source having an electrical polarity opposite the electrical polarity of the ground plane. The at least one piezoelectric ceramic component or transducer assembly is positioned between the corona source and the ground plane within a chamber.

公开(公告)号：US20180033945A1

公开(公告)日：2018-02-01

申请号：US15643226

申请日：2017-07-06

申请人： Siemens Medical Solutions USA, Inc.

发明人： DuYeop Kim ,  KyungHo Lee ,  SeungHee Lee

IPC分类号： H01L41/047 ,  B06B1/06 ,  H01L41/293 ,  H01L41/053 ,  H01L41/31

CPC分类号： H01L41/047 ,  B06B1/0215 ,  B06B1/0644 ,  B06B1/0685 ,  B06B2201/20 ,  H01L41/0475 ,  H01L41/053 ,  H01L41/293 ,  H01L41/31

摘要： An ultrasound transducer used in an ultrasound system and a manufacturing method thereof includes: a backing block; a piezoelectric layer placed on the backing block; a matching layer placed on the piezoelectric layer; and a ground layer placed between the piezoelectric layer and the matching layer. The backing layer includes a connector that connects a transmitting unit and a receiving unit of an ultrasound system, and a wiring area that connects the piezoelectric layer and the connector. The wiring area is formed by etching and filling with metal material.