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公开(公告)号：WO2018119153A2
公开(公告)日：2018-06-28
申请号：PCT/US2017/067739
申请日：2017-12-20
Applicant: INTEL CORPORATION , INTEL IP CORPORATION , ALPMAN, Erkan , AMADJIKPE, Arnaud Lucres , OSAF, Omer , AZADET, Kameran , BANIN, Rotem , BARYAKH, Miroslav , BAZOV, Anat , BRENNA, Stefano , CASPER, Bryan K. , CHAKRABARTI, Anandaroop , CHANCE, Gregory , CHOUDHURY, Debabani , COHEN, Emanuel , DA SILVA, Claudio , DALMIA, Sidharth , DANESHGAR ASL, Saeid , DASGUPTA, Kaushik , DATTA, Kunal , DAVIS, Brandon , DEGANI, Ofir , FAHIM, Amr M. , FREIMAN, Amit , GENOSSAR, Michael , GERSON, Eran , GOLDBERGER, Eyal , GORDON, Eshel , GORDON, Meir , HAGN, Josef , KANG, Shinwon , KAO, Te Yu , KOGAN, Noam , KOMULAINEN, Mikko S. , KUSHNIR, Igal Yehuda , LAHTI, Saku , LAMPINEN, Mikko M. , LANDSBERG, Naftali , LEE, Wook Bong , LEVINGER, Run , MOLINA, Albert , MONTOYA MORENO, Resti , MUSAH, Tawfiq , NAREVSKY, Nathan G. , NIKOPOUR, Hosein , ORHAN, Oner , PALASKAS, Georgios , PELLERANO, Stefano , PONGRATZ, Ron , RAVI, Ashoke , RAVID, Shmuel , SAGAZIO, Peter Andrew , SASOGLU, Eren , SHAKEDD, Lior , SHOR, Gadi , SINGH, Baljit , SOFFER, Menashe , SOVER, Ra'anan , TALWAR, Shilpa , TANZI, Nebil , TEPLITSKY, Moshe , THAKKAR, Chintan S. , THAKUR, Jayprakash , TSARFATI, Avi , TSFATI, Yossi , VERHELST, Marian , WEISMAN, Nir , YAMADA, Shuhei , YEPES, Ana M. , KITCHIN, Duncan
Inventor： ALPMAN, Erkan , AMADJIKPE, Arnaud Lucres , OSAF, Omer , AZADET, Kameran , BANIN, Rotem , BARYAKH, Miroslav , BAZOV, Anat , BRENNA, Stefano , CASPER, Bryan K. , CHAKRABARTI, Anandaroop , CHANCE, Gregory , CHOUDHURY, Debabani , COHEN, Emanuel , DA SILVA, Claudio , DALMIA, Sidharth , DANESHGAR ASL, Saeid , DASGUPTA, Kaushik , DATTA, Kunal , DAVIS, Brandon , DEGANI, Ofir , FAHIM, Amr M. , FREIMAN, Amit , GENOSSAR, Michael , GERSON, Eran , GOLDBERGER, Eyal , GORDON, Eshel , GORDON, Meir , HAGN, Josef , KANG, Shinwon , KAO, Te Yu , KOGAN, Noam , KOMULAINEN, Mikko S. , KUSHNIR, Igal Yehuda , LAHTI, Saku , LAMPINEN, Mikko M. , LANDSBERG, Naftali , LEE, Wook Bong , LEVINGER, Run , MOLINA, Albert , MONTOYA MORENO, Resti , MUSAH, Tawfiq , NAREVSKY, Nathan G. , NIKOPOUR, Hosein , ORHAN, Oner , PALASKAS, Georgios , PELLERANO, Stefano , PONGRATZ, Ron , RAVI, Ashoke , RAVID, Shmuel , SAGAZIO, Peter Andrew , SASOGLU, Eren , SHAKEDD, Lior , SHOR, Gadi , SINGH, Baljit , SOFFER, Menashe , SOVER, Ra'anan , TALWAR, Shilpa , TANZI, Nebil , TEPLITSKY, Moshe , THAKKAR, Chintan S. , THAKUR, Jayprakash , TSARFATI, Avi , TSFATI, Yossi , VERHELST, Marian , WEISMAN, Nir , YAMADA, Shuhei , YEPES, Ana M. , KITCHIN, Duncan
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号：WO2018119153A3
公开(公告)日：2018-06-28
申请号：PCT/US2017/067739
申请日：2017-12-20
Applicant: INTEL CORPORATION , INTEL IP CORPORATION
Inventor： ALPMAN, Erkan , AMADJIKPE, Arnaud Lucres , OSAF, Omer , AZADET, Kameran , BANIN, Rotem , BARYAKH, Miroslav , BAZOV, Anat , BRENNA, Stefano , CASPER, Bryan K. , THAKUR, Jayprakash , TALWAR, Shilpa , TEPLITSKY, Moshe , CHAKRABARTI, Anandaroop , CHANCE, Gregory , CHOUDHURY, Debabani , COHEN, Emanuel , DA SILVA, Claudio , DALMIA, Sidharth , DANESHGAR ASL, Saeid , DASGUPTA, Kaushik , DATTA, Kunal , DAVIS, Brandon , DEGANI, Ofir , FAHIM, Amr M. , FREIMAN, Amit , GENOSSAR, Michael , GERSON, Eran , GOLDBERGER, Eyal , GORDON, Eshel , GORDON, Meir , HAGN, Josef , KANG, Shinwon , KAO, Te Yu , KOGAN, Noam , KOMULAINEN, Mikko S. , KUSHNIR, Igal Yehuda , LAHTI, Saku , LAMPINEN, Mikko M. , LANDSBERG, Naftali , LEE, Wook Bong , LEVINGER, Run , MOLINA, Albert , MONTOYA MORENO, Resti , MUSAH, Tawfiq , NAREVSKY, Nathan G. , NIKOPOUR, Hosein , ORHAN, Oner , PALASKAS, Georgios , PELLERANO, Stefano , PONGRATZ, Ron , RAVI, Ashoke , RAVID, Shmuel , SAGAZIO, Peter Andrew , SASOGLU, Eren , SHAKEDD, Lior , SHOR, Gadi , SINGH, Baljit , SOFFER, Menashe , SOVER, Ra'anan , TANZI, Nebil , THAKKAR, Chintan S. , TSARFATI, Avi , TSFATI, Yossi , VERHELST, Marian , WEISMAN, Nir , YAMADA, Shuhei , YEPES, Ana M. , KITCHIN, Duncan
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号：WO2022098342A1
公开(公告)日：2022-05-12
申请号：PCT/US2020/058622
申请日：2020-11-03
Applicant: INTEL CORPORATION
Inventor： THAKUR, Jayprakash , DEGANI, Ofir , KRONFELD, Ronen , RESHEF, Ehud , SUH, Seong-Youp, J. , SHOSHANA, Tal , MANN, Eytan , TAMRAKAR, Maruti , RAVI, Ashoke , CAMACHO PEREZ, Jose Rodrigo , HUUSARI, Timo Sakari , BOROKHOVICH, Eli , RUBIN, Amir , BENJAMIN, Ofer , YANG, Tae Young , SKINNER, Harry , LEE, Kwan Ho , LEE, Jaejin , HAN, Dong-Ho , GROSS, Shahar , SEGEV, Eran , KAMGAING, Telesphor
Abstract: In various aspects, a radio frequency circuit is provided. The radio frequency circuit may include a substrate that may include a radio frequency front-end to antenna (RF FE-to-Ant) connector. The RF FE-to-Ant connector may include a conductor track structure and a substrate connection structure coupled to the conductor track structure. The substrate may include radio frequency front-end circuitry monolithically integrated in the substrate. The substrate connection structure may include at least one of a solderable structure, a weldable structure, or an adherable structure. The substrate connection structure may be configured to form at least one radio frequency signal interface with an antenna circuit connection structure of a substrate-external antenna circuit. The substrate may include an edge region. The substrate connection structure may be disposed in the edge region.
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公开(公告)号：WO2019160633A1
公开(公告)日：2019-08-22
申请号：PCT/US2019/013600
申请日：2019-01-15
Applicant: INTEL CORPORATION
Inventor： THAKUR, Jayprakash
IPC: H01Q1/52
Abstract: An antenna isolation circuit configured to provide an isolation between two adjacent antennas in a wireless communication device is disclosed. The antenna isolation circuit comprises a partition line circuit comprising a conductive element configured to be placed between the two adjacent antennas; and a matching circuit having a first end and a second end. In some embodiments, the matching circuit is coupled to the partition line circuit at the first end and to a ground circuit at the second end. In some embodiments, the matching circuit is configured to provide an impedance.In some embodiments, a dimension of the conductive element and the impedance of the matching circuit are configured to result in an isolation between the two adjacent antennas.
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