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    INTEGRATED ARRAY TRANSMIT/RECEIVE MODULE
    1.
    发明申请
    INTEGRATED ARRAY TRANSMIT/RECEIVE MODULE 审中-公开
    集成阵列发射/接收模块

    公开(公告)号：WO2010078199A3

    公开(公告)日：2010-10-14

    申请号：PCT/US2009069442

    申请日：2009-12-23

    Applicant: INTEL CORP ,  CHOUDHURY DEBABANI ,  RUBERTO MARK

    Inventor： CHOUDHURY DEBABANI ,  RUBERTO MARK

    IPC: H01Q21/00 ,  H01Q23/00

    CPC classification number: H01Q21/0025 ,  H01L23/49822 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01Q1/523 ,  H01Q21/062 ,  H01Q21/065 ,  H01Q21/067 ,  H01L2224/05599

    Abstract: Disclosed are integration approaches for mm-wave array type architectures using multilayer substrate technologies. For instance, an apparatus may include a first substrate layer, a second substrate layer, and a third substrate layer. The first substrate layer has a first plurality of array elements, and the second substrate layer has a second plurality of array elements. The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements. The first and second substrate layers are separated by approximately a half wavelength (?/2) corresponding to the one or more RF signals.

    Abstract translation: 公开了使用多层衬底技术的毫米波阵列型架构的集成方法。 例如，装置可以包括第一衬底层，第二衬底层和第三衬底层。 第一衬底层具有第一多个阵列元件，并且第二衬底层具有第二多个阵列元件。 第三衬底层具有集成电路，以与第一和第二多个阵列元件交换一个或多个射频（RF）信号。 第一和第二衬底层被分开与一个或多个RF信号相对应的大约一半波长（λ/ 2）。

    PLATFORM INTEGRATED PHASED ARRAY TRANSMIT/RECEIVE MODULE
    4.
    发明申请
    PLATFORM INTEGRATED PHASED ARRAY TRANSMIT/RECEIVE MODULE 审中-公开
    平台集成定位阵列发射/接收模块

    公开(公告)号：WO2010078215A2

    公开(公告)日：2010-07-08

    申请号：PCT/US2009/069516

    申请日：2009-12-23

    Applicant: INTEL CORPORATION ,  CHOUDHURY, Debabani ,  PERRY, Richard, S.

    Inventor： CHOUDHURY, Debabani ,  PERRY, Richard, S.

    IPC: H01Q21/00 ,  H01Q23/00

    CPC classification number: H01Q3/26 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01Q1/02 ,  H01Q21/0025 ,  H01Q21/065 ,  H01Q23/00 ,  H01L2224/0401

    Abstract: Disclosed are integration approaches for mm-wave planar phased array type architectures using multilayer substrate technologies. For instance, an apparatus may include a plurality of substrate layers, an integrated circuit, and a connector module. The plurality of substrate layers includes a first substrate layer having one or more phased array elements. The integrated circuit exchange one or more radio frequency (RF) signals (e.g., mm-wave signals) with the one or more phased array elements. The connector module exchange further signals with the integrated circuit that correspond to the one or more RF signals. For example, these further signals may be baseband or intermediate frequency (IF) signals.

    Abstract translation: 公开了使用多层衬底技术的毫米波平面相控阵列型结构的集成方法。 例如，设备可以包括多个基板层，集成电路和连接器模块。 多个衬底层包括具有一个或多个相控阵列元件的第一衬底层。 集成电路与一个或多个相控阵列元件交换一个或多个射频（RF）信号（例如，毫米波信号）。 连接器模块与对应于一个或多个RF信号的集成电路交换进一步的信号。 例如，这些另外的信号可以是基带或中频（IF）信号。

    INTEGRATED ARRAY TRANSMIT/RECEIVE MODULE
    5.
    发明申请
    INTEGRATED ARRAY TRANSMIT/RECEIVE MODULE 审中-公开
    集成阵列发射/接收模块

    公开(公告)号：WO2010078199A2

    公开(公告)日：2010-07-08

    申请号：PCT/US2009/069442

    申请日：2009-12-23

    Applicant: INTEL CORPORATION ,  CHOUDHURY, Debabani ,  RUBERTO, Mark

    Inventor： CHOUDHURY, Debabani ,  RUBERTO, Mark

    IPC: H01Q21/00 ,  H01Q23/00

    CPC classification number: H01Q21/0025 ,  H01L23/49822 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01Q1/523 ,  H01Q21/062 ,  H01Q21/065 ,  H01Q21/067 ,  H01L2224/05599

    Abstract: Disclosed are integration approaches for mm-wave array type architectures using multilayer substrate technologies. For instance, an apparatus may include a first substrate layer, a second substrate layer, and a third substrate layer. The first substrate layer has a first plurality of array elements, and the second substrate layer has a second plurality of array elements. The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements. The first and second substrate layers are separated by approximately a half wavelength (λ/2) corresponding to the one or more RF signals.

    Abstract translation: 公开了使用多层衬底技术的mm波阵列型结构的集成方法。 例如，装置可以包括第一基底层，第二基底层和第三基底层。 第一基板层具有第一多个阵列元件，第二基板层具有第二多个阵列元件。 第三衬底层具有用于与第一和第二多个阵列元件交换一个或多个射频（RF）信号的集成电路。 第一和第二衬底层与对应于一个或多个RF信号的大约一半的波长（λ/ 2）分开。

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