METHOD FOR TRAINING MACHINE LEARNING MODEL TO DETERMINE OPTICAL PROXIMITY CORRECTION FOR MASK

    公开(公告)号:WO2020169303A1

    公开(公告)日:2020-08-27

    申请号:PCT/EP2020/051778

    申请日:2020-01-24

    Abstract: Described herein are training methods and a mask correction method. One of the methods is for training a machine learning model configured to predict a post optimal proximity correction (OPC) image for a mask. The method involves obtaining (i) a pre-OPC image associated with a design layout to be printed on a substrate, (ii) an image of one or more assist features for the mask associated with the design layout, and (iii) a reference post- OPC image of the design layout; and training the machine learning model using the pre-OPC image and the image of the one or more assist features as input such that a difference between the reference image and a predicted post-OPC image of the machine learning model is reduced.

    METHOD FOR DETERMINING MASK PATTERN AND TRAINING MACHINE LEARNING MODEL

    公开(公告)号:WO2022128500A1

    公开(公告)日:2022-06-23

    申请号:PCT/EP2021/083917

    申请日:2021-12-02

    Abstract: Described herein are a method for determining a mask pattern and a method for training a machine learning model. The method for generating data for a mask pattern associated with a patterning process includes obtaining (i) a first mask image (e.g., CTM) associated with a design pattern, (ii) a contour (e.g., a resist contour) based on the first mask image, (iii) a reference contour (e.g., an ideal resist contour) based on the design pattern; and (iv) a contour difference between the contour and the reference contour. The contour difference and the first mask image are inputted to a model to generate mask image modification data. Based on the first mask image and the mask image modification data, a second mask image is generated for determining a mask pattern to be employed in the patterning process.

    APPARATUS AND METHOD FOR DETERMINING THREE DIMENSIONAL DATA BASED ON AN IMAGE OF A PATTERNED SUBSTRATE

    公开(公告)号:WO2022128373A1

    公开(公告)日:2022-06-23

    申请号:PCT/EP2021/082756

    申请日:2021-11-24

    Abstract: Described herein are system, method, and apparatus for determining three-dimensional (3D) information of a structure of a patterned substrate. The 3D information can be determined using one or more model configured to generate 3D information (e.g., depth information) using only a single image of a patterned substrate. In a method, the model is trained by obtaining a pair of stereo images of a structure of a patterned substrate. The model generates, using a first image of the pair of stereo images as input, disparity data between the first image and a second image, the disparity data being indicative of depth information associated with the first image. The disparity data is combined with the second image to generate a reconstructed image corresponding to the first image. Further, one or more model parameters are adjusted based on the disparity data, the reconstructed image, and the first image.

    METHODS FOR GENERATING CHARACTERISTIC PATTERN AND TRAINING MACHINE LEARNING MODEL

    公开(公告)号:WO2021052712A1

    公开(公告)日:2021-03-25

    申请号:PCT/EP2020/073449

    申请日:2020-08-21

    Abstract: Described herein are methods of generating a characteristic pattern for a patterning process and training a machine learning model. A method of training a machine learning model configured to generate a characteristic pattern for a mask pattern includes obtaining (i) a reference characteristic pattern (EFMs) that meets a satisfactory threshold related to manufacturing of the mask pattern, and (ii) a continuous transmission mask (CTM) for use in generating the mask pattern; and training, based on the reference characteristic pattern and the CTM, the machine learning model such that a first metric between the characteristic pattern (EFM1) and the CTM, and a second metric between the characteristic pattern (EFM1) and the reference characteristic pattern (EFMs) is reduced.

    MACHINE LEARNING BASED INVERSE OPTICAL PROXIMITY CORRECTION AND PROCESS MODEL CALIBRATION

    公开(公告)号:WO2019238372A1

    公开(公告)日:2019-12-19

    申请号:PCT/EP2019/063282

    申请日:2019-05-23

    Abstract: Described herein is a method for calibrating a process model and training an inverse process model of a patterning process. The training method includes obtaining a first patterning device pattern from simulation of an inverse lithographic process that predicts a patterning device pattern based on a wafer target layout, receiving wafer data corresponding to a wafer exposed using the first patterning device pattern; and training an inverse process model configured to predict a second patterning device pattern using the wafer data related to the exposed wafer and the first patterning device pattern.

    METHODS OF DETERMINING SCATTERING OF RADIATION BY STRUCTURES OF FINITE THICKNESSES ON A PATTERNING DEVICE

    公开(公告)号:WO2018153735A1

    公开(公告)日:2018-08-30

    申请号:PCT/EP2018/053589

    申请日:2018-02-13

    Abstract: A method including: obtaining characteristics of a portion of a design layout; determining characteristics of M3D of a patterning device including or forming the portion; by using a computer, training a neural network using training data including a sample whose feature vector includes the characteristics of the portion and whose supervisory signal comprises the characteristics of the M3D. Also disclosed is a method including: obtaining characteristics of a portion of a design layout; obtaining characteristics of a lithographic process that uses a patterning device including or forming the portion; determining characteristics of a result of the lithographic process; by using a computer, training a neural network using training data including a sample whose feature vector comprises the characteristics of the portion and the characteristics of the lithographic process, and whose supervisory signal comprises the characteristics of the result.

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