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公开(公告)号:WO2023288004A2
公开(公告)日:2023-01-19
申请号:PCT/US2022/037174
申请日:2022-07-14
Applicant: UNIVERSITY OF SOUTHERN CALIFORNIA
Inventor: JACOB, Ajey Poovannummoottil , KAPADIA, Rehan Rashid
IPC: H01L21/02 , H01L21/762 , C30B19/00 , C30B19/12 , H01L21/02376 , H01L21/02381 , H01L21/0242 , H01L21/02458 , H01L21/02461 , H01L21/02463 , H01L21/02488 , H01L21/02505 , H01L21/0254 , H01L21/02546 , H01L21/02623 , H01L29/70
Abstract: A method for fabricating low defective non-planar bipolar heterostructure transistors includes a steps of providing a substrate that is coated with a first dielectric layer when the substrate is not composed of a dielectric material. A layer of a first semiconductor material is formed by template liquid phase (TLP) crystal growth wherein a second dielectric layer is disposed over the first semiconductor material. A trench is patterned into the second dielectric layer. An intermediate heterostructure is formed by epitaxially growing second semiconductor material in the trench to form a fin structure therein. Various power transistor structures can be formed from the intermediate heterostructure.
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公开(公告)号:WO2022239948A1
公开(公告)日:2022-11-17
申请号:PCT/KR2022/003477
申请日:2022-03-11
Applicant: 주성엔지니어링(주)
IPC: H01L21/02 , C23C16/02 , C23C16/34 , C23C16/455 , C23C16/0272 , C23C16/4554 , C23C16/45553 , C23C16/56 , H01L21/02458 , H01L21/0254 , H01L21/02576 , H01L21/02579 , H01L21/0262 , H01L21/02667
Abstract: 본 발명은 박막 형성 방법에 관한 것으로서, 보다 상세하게는 질화갈륨 박막을 형성하기 위한 박막 형성 방법에 관한 것이다. 본 발명의 실시 예에 따른 박막 형성 방법은, 챔버의 공정 공간에 기판을 반입하는 단계; 및 상기 기판 상에 질화갈륨 박막을 형성하는 단계;를 포함하고, 상기 질화갈륨 박막을 형성하는 단계는, 상기 기판 상에 갈륨을 함유하는 소스 가스를 공급하는 단계; 상기 기판 상에 질소를 함유하는 리액턴트 가스를 공급하는 단계; 및 상기 리액턴트 가스가 공급된 기판 상에 수소를 함유하는 후처리 가스를 활성화시켜 공급하는 단계;를 포함한다.
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公开(公告)号:WO2021258293A1
公开(公告)日:2021-12-30
申请号:PCT/CN2020/097752
申请日:2020-06-23
Applicant: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
Inventor: WU, Peng-Yi
IPC: H01L29/06 , H01L29/778 , H01L21/335 , H01L21/02458 , H01L21/02505 , H01L21/0254 , H01L21/0262 , H01L21/02647 , H01L29/0684 , H01L29/2003 , H01L29/41766 , H01L29/66462 , H01L29/7781 , H01L29/7786
Abstract: Semiconductor device structures and methods for manufacturing the same are provided. The semiconductor device structure includes a substrate, a first layer and a second layer. The first layer is disposed on and in contact with the substrate. The first layer includes AlX1Ga (1-X1) N, wherein 0.5≤X1
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公开(公告)号:WO2021195595A1
公开(公告)日:2021-09-30
申请号:PCT/US2021/024529
申请日:2021-03-26
Applicant: GOOGLE LLC
Inventor: DAVID, Aurelien Jean Francois
IPC: H01L21/02 , H01L33/00 , H01L33/32 , H01L33/08 , H01L33/12 , H01L21/02389 , H01L21/0243 , H01L21/02433 , H01L21/02458 , H01L21/0251 , H01L21/02513 , H01L21/0254 , H01L21/02603 , H01L21/0262 , H01L21/02647 , H01L33/0075 , H01L33/0093
Abstract: A method of forming an LED emitter includes: providing a Ill-nitride layer on a substrate (310), the Ill-nitride layer having a planar top surface; providing discrete lateral growth regions on the top surface; selectively epitaxially growing, on each discrete lateral growth region, a base region (1210) comprising an In(x)Ga(l-x)N material, each extending perpendicular to the top surface; providing surfaces of the In(x)Ga(l-x)N material on portions of the base regions (1210), the surfaces having a relaxed strain and being characterized by a base lattice constant within 0.1% of its bulk relaxed value; and epitaxially growing LED regions on the surfaces, the LED regions including light- emitting layers of In(y)Ga(l-y)N material that are pseudomorphic with the surfaces of the In(x)Ga(l-x)N material, and characterized by an active region (1240) lattice constant within 0.1% of the base lattice constant, wherein 0.05 0.3.
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公开(公告)号:WO2021148813A1
公开(公告)日:2021-07-29
申请号:PCT/GB2021/050158
申请日:2021-01-22
Applicant: PORO TECHNOLOGIES LTD
Inventor: ALI, Muhammad , OLIVER, Rachel , ZHU, Tongtong
IPC: H01L33/12 , H01L33/16 , H01L33/32 , H01L33/00 , H01L21/02 , H01L21/02389 , H01L21/02458 , H01L21/02505 , H01L21/02513 , H01L21/0254 , H01L33/0075
Abstract: A semiconductor structure comprises a layer of a first III-nitride material having a first lattice dimension; a non-porous layer of a second III-nitride material having a second lattice dimension different from the first lattice dimension; and a porous region of III-nitride material disposed between the layer of first III-nitride material and the non-porous layer of the second III-nitride material. An optoelectronic semiconductor device, an LED, and a method of manufacturing a semiconductor structure are also provided.
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公开(公告)号:WO2021126445A1
公开(公告)日:2021-06-24
申请号:PCT/US2020/060961
申请日:2020-11-18
Applicant: LUMILEDS LLC
Inventor: WILDESON, Isaac , LOPEZ, Toni , ARMITAGE, Robert , DEB, Parijat
IPC: H01L33/00 , H01L21/02 , H01L33/20 , H01L21/02403 , H01L21/02414 , H01L21/0242 , H01L21/0243 , H01L21/02458 , H01L21/02472 , H01L21/0254 , H01L21/02639 , H01L33/007 , H01L33/22 , H01L33/32
Abstract: Light emitting diode (LED) devices comprise: a patterned substrate comprising a substrate body, a plurality of integral features protruding from the substrate body, and a base surface defined by spaces between the plurality of integral features; a selective layer comprising a dielectric material located on the surfaces of the integral features, wherein there is an absence of the selective layer on the base surface; and a III-nitride layer comprising a III-nitride material on the selective layer and the base surface.
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