公开(公告)号：WO99055485A1

公开(公告)日：1999-11-04

申请号：PCT/US1999/009121

申请日：1999-04-27

IPC: B23K1/015 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  B23K31/02

CPC classification number: H05K3/363 ,  B23K1/015 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/2036 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A method is provided for forming a plurality of solder joints for electrically and mechanically coupling a printed circuit board (100) and a flexible circuit (101). Solder is applied to the connection surfaces of the printed circuit board (100), and the connection surfaces of the flexible circuit (101) are tinned. The circuit board (100) and flexible circuit (101) are then positioned so that the connections surfaces of each are in alignment and a gap exists between circuit board (100) and the flexible circuit (101). The gap between circuit board (100) and flexible circuit (101) is precisely controlled and permits the solder of the printed circuit to be in contact with the connection surfaces of the flexible circuit (101). The solder is reflowed by applying heat by vapor phase condensation.

Abstract translation: 提供了一种用于形成用于电气和机械耦合印刷电路板（100）和柔性电路（101）的多个焊点的方法。 将焊料施加到印刷电路板（100）的连接表面，并且柔性电路（101）的连接表面镀锡。 然后将电路板（100）和柔性电路（101）定位成使得它们的连接表面对准，并且在电路板（100）和柔性电路（101）之间存在间隙。 精确地控制电路板（100）和柔性电路（101）之间的间隙，并允许印刷电路的焊料与柔性电路（101）的连接表面接触。 焊料通过气相冷凝加热来回流焊。

公开(公告)号：WO1997038817A1

公开(公告)日：1997-10-23

申请号：PCT/EP1997001976

申请日：1997-04-18

Applicant: LEICHT, Helmut, W.

IPC: B23K01/015

CPC classification number: B23K1/015 ,  B23K2101/36

Abstract: In a process for cooling soldered objects, a liquid is applied on the soldered objects and made to evaporate quickly. In a preferred embodiment, the objects soldered in a vapour phase soldering installation are cooled down as soon as they leave the vapour phase by means of the vapour phase soldering liquid. The advantages of the process are that the soldered objects can be cooled much more quickly and that the quality of the soldering joints is improved.

Abstract translation: 提供了一种用于冷却物体焊接，其特征在于，施加在焊料的液体和蒸发速度更快的处理。 在一个优选的实施方案中，焊料是在汽相回流系统退出使用Dampfphasenlötflüssigkeit气相后立即冷却。 在焊接的冷却的显著增加的速率的过程谎言和改进的焊点质量的优点。

公开(公告)号：WO1996037330A1

公开(公告)日：1996-11-28

申请号：PCT/DE1996000968

申请日：1996-05-24

Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. ,  SCHEEL, Wolfgang ,  RING, Karl ,  HAFNER, Willi ,  LEICHT, Helmut

Inventor： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

IPC: B23K01/015

CPC classification number: B23K1/015 ,  B23K2101/40 ,  H05K3/3415 ,  H05K3/3468 ,  H05K3/3494 ,  H05K2203/088

Abstract: The invention describes a process and a device for wave and/or reflow soldering in the form of vapour-phase soldering for electronic units. In prior art processes and devices, either wave soldering or vapour-phase soldering alone can be performed in a single chamber. For electronic units which contain both components which are to be wave soldered and those to be reflow soldered, at least two soldering devices and two process steps are necessary. There is the further drawback that temperature-sensitive components impose either a limitation on the soldering temperature and hence the solders which can be used or laborious post-fitting. The invention performs wave soldering and vapour-phase soldering as a form of reflow soldering in a single chamber, in which an electronic unit can be placed and/or the portion of the volume of the chamber filled with the saturated vapour of a primary fluid can be controlled in such a way that, at the worst, temperature-sensitive components of the unit lie only partly in the saturated vapour and the connections of the electronic components of the unit are in the saturated vapour during soldering. The invention permits the soldering of surface-fitted, penetrating and temperature-sensitive components, e.g. large electrolytic capacitors, in a single chamber and in a single process stage and is therefore eminently suitable for economical mass production with high soldering quality.

Abstract translation: 本发明描述的方法和在用于电子组件汽相焊接的形式波和/或回流焊接的装置。 在在一个单一的室中仅波峰焊或仅气相焊接已知方法和装置或者是可行的。 对于包含于波峰焊和回流焊接两个部件的电子组件，从而至少两个焊接设备，因此需要两个工艺步骤。 还存在温度敏感设备或者需要在钎焊温度的限制，因此为所述可选择的焊接材料，或进行复杂的改造必要的缺点。 本发明实现了波峰焊和汽相焊接作为在单一腔室回流焊接的形式中，电子组件可被放置成和/或填充有所述室的主液体体积分数的饱和蒸汽被如此调节使得组件中的温度敏感元件至多部分地 位于饱和蒸汽，并且该连接被焊接模块的电子部件的软钎焊过程中位于饱和蒸汽。 本发明允许安装面的焊接，通过配合和温度敏感的组分，例如 大电解电容器，在一个单一的腔室，并在单一的工艺步骤，并且因此非常适合于廉价的大量生产具有非常好的焊接质量。

公开(公告)号：WO1993017824A1

公开(公告)日：1993-09-16

申请号：PCT/EP1993000493

申请日：1993-03-04

Applicant: LEICHT, Helmut, Walter

IPC: B23K01/015

CPC classification number: B23K1/015

Abstract: The invention relates to a transport device and process for loading and removing the part to be soldered in a vapour-phase soldering installation, in which a support for the part to be soldered is taken in its original direction into and out of a medium container for vapour-phase soldering and a plurality of sealing valves prevent soldering vapour from escaping. The advantages of the invention lie in the simple and economical production of the transport device and low soldering medium consumption.

公开(公告)号：WO1990006203A1

公开(公告)日：1990-06-14

申请号：PCT/EP1989001442

申请日：1989-11-28

Applicant: LEICHT, Helmut, Walter

IPC: B23K01/00

CPC classification number: B23K1/015 ,  C23G5/02 ,  H05K3/227 ,  H05K3/26 ,  H05K2203/0746 ,  H05K2203/0783 ,  H05K2203/088 ,  H05K2203/1509

Abstract: Workpieces, in particular printed circuit boards or subassemblies equipped with circuit elements, are cleaned after soldering by washing them with an inert cleaning fluid the temperature of which is maintained slightly below the melting point of the solder. This obviates the use of pollutant solvents to dissolve impurities and fluxes. This cleaning process is particularly advantageous after vapour-phase soldering, because the cleaning liquid used can be the same as that used as a heat-transfer medium in the vapour-phase soldering installation. This resolves the problem of undesirable mixing of different treatment media (heat-transfer medium and cleaning liquid).

Abstract translation: 工件，特别是装有电路元件的印刷电路板或子组件在焊接之后通过用温度低于焊料熔点的惰性清洗液冲洗来清洁。 这样可以避免使用污染物溶剂来溶解杂质和助熔剂。 由于所使用的清洗液可以与在气相焊接设备中作为传热介质使用的清洗液相同，所以这种清洗过程在气相焊接之后是特别有利的。 这解决了不同处理介质（传热介质和清洗液）的不合要求的混合问题。

公开(公告)号：WO1985001791A1

公开(公告)日：1985-04-25

申请号：PCT/FR1984000226

申请日：1984-10-10

Applicant: PIEZO-CERAM ELECTRONIQUE ,  PESCATORE, Richard ,  BOUMENDIL, Jean-Jack

Inventor： PIEZO-CERAM ELECTRONIQUE

IPC: F28D15/00

CPC classification number: B23K1/015 ,  F28C3/005

Abstract: The invention relates to heat treating machines. It relates to a machine of the in line type which comprises a tunnel (1), displacement means (2) for conveying the articles or products to be heated from the inlet of said tunnel to its outlet and, in the following order, a first chamber (10) for the condensation of secondary vapour, a second chamber (20) for the vaporization of secondary liquid and for the complementary condensation of the primary vapour, a third chamber (30) for heating the article or product to be heated and which is filled with primary vapour, a fourth chamber (40) for the vaporization of secondary liquid and for the complementary condensation of the primary vapour, and a fifth chamber (50) for the condensation of the secondary vapour, said chambers having a cross-section larger than that of the tunnel, and being distributed along said tunnel and being interconnected by sections of said tunnel. Utilization particularly in the electronic industry.

Abstract translation: 本发明涉及热处理机。 它涉及一种在线型机器，其包括通道（1），用于将待加热的物品或产品从所述隧道的入口输送到其出口的移动装置（2），并且按照以下顺序将第一 用于二次蒸气冷凝的室（10），用于二次蒸发蒸发二次液体的第二室（20）和用于第一蒸汽的互补冷凝的第二室（30），用于加热被加热物品或产品的第三室（30） 填充有初级蒸气，第二室（40），用于二次蒸发蒸发和第一蒸汽的互补冷凝;以及第五室（50），用于使二次蒸汽冷凝，所述室具有横截面 大于隧道，并且沿着所述隧道分布并且通过所述隧道的部分相互连接。 尤其在电子工业中的应用。