公开(公告)号：WO99010718A1

公开(公告)日：1999-03-04

申请号：PCT/EP1998/005400

申请日：1998-08-26

IPC: G01J5/00 ,  B23K1/015 ,  H01L21/205 ,  H01L21/26 ,  H01L21/66 ,  G01J5/60

CPC classification number: B23K1/015 ,  B23K2201/40

Abstract: A method for Rapid Thermal Processing (RTP) is presented, wherein the broadband reflectivity of an object is measured, and the results of the measurement used by the RTP system to adjust the RTP system parameters used in processing the object.

Abstract translation: 提出了一种用于快速热处理（RTP）的方法，其中测量对象的宽带反射率，以及RTP系统使用的测量结果来调整用于处理对象的RTP系统参数。

公开(公告)号：WO1990005611A1

公开(公告)日：1990-05-31

申请号：PCT/FR1986000111

申请日：1986-04-02

Applicant: SAINT MARTIN, Xavier

IPC: B23K01/00

CPC classification number: B23K1/015

Abstract: The main purpose of the invention is to limit corrosion in a vapour phase refusion machine. Chlorinated and fluoridised liquid is used in vapour phase welding machines. When decomposed by heat, ions are freed which, in the presence of water, form hydrofluoric and hydrochloric acids. They corrode both the tank (1) which makes the welding process possible and the metal parts of the welded components. The device of this invention eliminates the water from the secondary liquid (20) by isolating its vapours from the atmosphere, preventing water (21) from entering the drying cartridge (19) and facilitating drying before the use of the fresh secondary liquid (20). The invention applies mainly to vapour phase refusion welding.

公开(公告)号：WO1989010817A1

公开(公告)日：1989-11-16

申请号：PCT/EP1989000481

申请日：1989-05-02

Applicant: LEICHT, Helmut, Walter

IPC: B23K01/00

CPC classification number: B23K1/015

Abstract: Said device and process provide optimal sealing of the heat transfer medium against unwanted vapour loss, the geometry of the transport channel with cooling system and locks being specially designed to this end. Said process can be applied to batch-processing as well as to continuous-operation installations.

公开(公告)号：WO2010144126A2

公开(公告)日：2010-12-16

申请号：PCT/US2010/001644

申请日：2010-06-08

Applicant: TYCO ELECTRONICS CORPORATION ,  CHOU, George, Jyh-Shann ,  HILTY, Robert, Daniel

Inventor： CHOU, George, Jyh-Shann ,  HILTY, Robert, Daniel

IPC: B23K31/02 ,  B23K37/04 ,  B23K37/00

CPC classification number: B23K1/0016 ,  B23K1/012 ,  B23K1/015 ,  B23K3/00 ,  B23K2201/42 ,  C23C14/16 ,  C23C14/56 ,  C23C14/5806 ,  H01L21/67721 ,  H01L21/6776

Abstract: A system for manufacturing electrical components includes a reflow chamber having an inlet port and an outlet port. The inlet port receives a web of interconnected electrical components having a conductive coating into the reflow chamber. The outlet port discharges the web from the reflow chamber. The reflow chamber directs the web of interconnected electrical components along a predetermined pathway through the reflow chamber. The reflow chamber retains a heated and saturated vapor to heat the conductive coating as the web passes along the pathway through the chamber to reflow the conductive coating about the electrical components.

Abstract translation: 一种用于制造电气部件的系统包括具有入口和出口的回流室。 入口端口将具有导电涂层的相互连接的电气部件的腹板接纳到回流室中。 出口将回流焊管排出。 回流室将互连的电气部件的腹板沿着预定的通路引导通过回流室。 当纸幅沿着通过室的路径通过时，回流室保持加热和饱和的蒸气以加热导电涂层，以围绕电气部件回流导电涂层。

公开(公告)号：WO2003106093A2

公开(公告)日：2003-12-24

申请号：PCT/DK2003/000393

申请日：2003-06-14

Applicant: VAPOUR PHASE TECHNOLOGY ApS ,  DOKKEDAHL, Lars, G.

Inventor： DOKKEDAHL, Lars, G.

IPC: B23K1/015

CPC classification number: B23K1/015

Abstract: The present invention concerns a method and an apparatus for performing soldering of items that are applied a soldering agent, where the soldering apparatus includes at least one soldering zone, where the soldering zone include means for generating vapour, the apparatus being adapted to heat the items to be soldered to a temperature required for soldering by condensing the vapour. Further the invention relates to a method and an apparatus for flux deposition connected to a soldering machine, which soldering machine comprises a solder heating medium evaporated by heating means forming a vapour that heats elements to be soldered by heat transfer and by condensation, which apparatus comprises means for condensation, of a vapour containing flux where pumping means circulate vapor containing flux through the condensation means, where the condensation means comprises heat exchangers for cooling the vapour for flux condensation.

Abstract translation: 本发明涉及一种用于对应用焊剂的物品执行焊接的方法和装置，其中焊接装置包括至少一个焊接区，其中焊接区包括用于产生蒸气的装置，该装置适于加热物品 通过冷凝蒸气而被焊接到焊接所需的温度。 此外，本发明涉及一种与焊接机连接的助熔剂沉积的方法和装置，该焊接机包括通过加热装置蒸发的焊料加热介质，该加热装置形成通过热传递和通过冷凝加热待焊接的元件的蒸气，该装置包括 含有蒸气的通量的装置，其中泵送装置使含有助熔剂的蒸汽循环通过冷凝装置，其中冷凝装置包括用于冷却蒸汽以进行助熔剂冷凝的热交换器。

公开(公告)号：WO1991001429A1

公开(公告)日：1991-02-07

申请号：PCT/CH1990000172

申请日：1990-07-16

Applicant: BÄCHLI, Emil

IPC: E06B03/66

CPC classification number: E06B3/66357 ,  B23K1/015 ,  C03C17/36 ,  C03C17/3615 ,  C03C17/3642 ,  C03C17/3652 ,  C03C17/3681 ,  E06B3/6612 ,  E06B3/66342 ,  E06B2003/66395 ,  Y02A30/25 ,  Y02B80/24 ,  Y10T428/24777

Abstract: To coat the glass edge of two wall elements (2, 3) which form a gap (5) for a heat-insulating construction and/or light element (1), an adhesive metallic layer is produced on one side of each wall element (2, 3) by physical (PVD) or chemical (CVD) deposition of the coating material from a gas or vapour phase. A final protective barrier layer (6) is applied to this adhesive layer (4) and then provided with a subsequent solder layer (7). These solder layers (7) are connected to a film (8) which surrounds the edge of the construction and/or light element (1) in a gas-tight manner.

Abstract translation: 为了涂覆形成用于隔热结构和/或轻元件（1）的间隙（5）的两个壁元件（2,3）的玻璃边缘，在每个壁元件的一侧上产生粘合金属层 2，3）通过物理（PVD）或化学（CVD）沉积来自气相或气相的涂层材料。 将最终的保护屏障层（6）施加到该粘合剂层（4）上，然后设置有随后的焊料层（7）。 这些焊料层（7）以气密的方式连接到围绕结构和/或轻元件（1）的边缘的膜（8）。

公开(公告)号：WO1989004234A1

公开(公告)日：1989-05-18

申请号：PCT/EP1988001023

申请日：1988-11-11

Applicant: RAHN, Armin

IPC: B23K01/00

CPC classification number: B23K1/015 ,  C23G5/04 ,  Y10S134/902

Abstract: A process for treating workpieces (61) in a normally closed treatment chamber (5). The process comprises providing a pressure within the chamber which is less than atmospheric and providing an unsaturated treatment vapour within the chamber. A workpiece is then moved into the chamber to be treated by the unsaturated vapour. The process is particularly suited for the vapour phase soldering of printed circuit boards. In this case the unsaturated vapour in the chamber is heated to a temperature higher than the melting point of the solder used and the circuit boards with solder thereon are passed through the vapour in the chamber to reflow the solder. The invention is also directed toward an apparatus for carrying out the process.

公开(公告)号：WO2011071041A1

公开(公告)日：2011-06-16

申请号：PCT/JP2010/071903

申请日：2010-12-07

Applicant: 千住金属工業株式会社 ,  杉原崇史 ,  田口寛 ,  笠原大介 ,  細川晃一郎 ,  斉藤雄太

Inventor： 杉原崇史 ,  田口寛 ,  笠原大介 ,  細川晃一郎 ,  斉藤雄太

IPC: B23K3/08 ,  B23K1/008 ,  F27B9/24 ,  F27D7/04 ,  H05K3/34 ,  B23K101/42

CPC classification number: F27B9/3005 ,  B23K1/008 ,  B23K1/012 ,  B23K1/015 ,  B23K3/08 ,  F27B9/24 ,  F27D17/001

Abstract: 　気化したフラックスが予備加熱ゾーンと本加熱ゾーンと冷却ゾーンに配置されたファンを回転させるためのモータ回転軸に付着して固化することを防止するため、気化したフラックスが固化する前の流動性を有する液化の状態で効率的、かつ、確実に回収する。　フラックス回収装置１０Ａを構成するドレン部２０は、モータベース１６のファンとの対向側であって、かつ、回転軸１４の周辺部に形成されている。ドレン部２０のファンとの対向面は、モータベース１６の平面位置からモータベース１６の背面側に設けられた排出口４６に向かって傾斜した傾斜面２０Ａとなっている。ファンの回転駆動によりモータベース１６の中心部に集まってくるフラックスは、モータベース１６の中心部に形成されたドレン部２０に流入されて傾斜面２０Ａに沿って流動され、ドレン部２０から排出口４６、ドレン管およびパイプ管４８を経由して回収用容器３４に収容される。

Abstract translation: 公开了一种回流炉，其中为了防止蒸发的焊剂在设置在预热区域，主加热区域和冷却区域中的旋转风扇的电机旋转轴上粘附和固化，可以有效且可靠地回收蒸发的焊剂 处于液化状态，其中焊剂的流动性高于焊剂固化的流动性。 在旋转轴（14）的周围形成有构成磁通回收装置（10A）的排水部（20），所述周边位于与电机基座（16）的风扇相对的一侧。 面向风扇的排水部20形成从马达座16的平面位置向设于马达座16的后侧的出口46倾斜的倾斜面20A。 使通过风扇的旋转驱动而聚集到电动机基座（16）的中心部分的通量流入形成在电动机基座（16）的中心部分的排水部分（20），并沿着倾斜表面 （20A），并且通过出口（46），排水管和管道（48）将通量从排水部分（20）存储在回收容器（34）中。

公开(公告)号：WO1990006204A1

公开(公告)日：1990-06-14

申请号：PCT/JP1989001198

申请日：1989-11-27

Applicant: FURUKAWA ALUMINUM CO., LTD ,  YAMAGUCHI, Motoyoshi ,  KOYAMA, Hitoshi

Inventor： FURUKAWA ALUMINUM CO., LTD

IPC: B23K01/00

CPC classification number: B23K1/015 ,  B23K1/19 ,  B23K35/3605 ,  B23K35/38

Abstract: This invention relates to a brazing method for bonding an assembly made of Al or an Al alloy, and more particularly to a gaseous phase brazing method which does not need the step of applying directly a flux to the assembly to be bonded. The present invention is characterized in that when Al or an Al alloy member is brazed through a brazing material, these members are brazed in a non-oxidizing atmosphere where a vapor of potassium fluoroaluminate complex exists. This vapor attaches in an extremely small quantity and uniformly to the assembly and destroys the Al oxide film on the surface. Accordingly, it promotes wetting of the brazing material, causes the brazing material to flow uniformly and forms uniform fillets at the bonding portion of the assembly. Furthermore, the consumed amount of the flux is small and economical, brazability of an Mg-containing material can be improved and the surface of the bonded article after brazing is clean and beautiful.

公开(公告)号：WO1986004002A1

公开(公告)日：1986-07-17

申请号：PCT/US1985002308

申请日：1985-11-25

Applicant: HUGHES AIRCRAFT COMPANY

Inventor： HUGHES AIRCRAFT COMPANY ,  SMITH, Gerald, B.

IPC: B23K01/00

CPC classification number: B23K1/015 ,  B23K3/0661

Abstract: Soldering apparatus and method wherein an assembly (10) containing solder (16) is simultaneously subjected to vapor heating and ultrasonic vibration to provide for fluxless soldering. The solder (16) is heated in a solder pot (14) which creates a hot vapor space (38) above the surface of the solder (16). A transducer (22) vibrates the solder (16) in the pot (14) while the circuit board to be soldered floats on the surface of the solder (16). This invention is particularly useful for circuit board assemblies which are sensitive to cleansing in preparation for soldering and solder fluxes.