公开(公告)号：WO2016004386A1

公开(公告)日：2016-01-07

申请号：PCT/US2015/039107

申请日：2015-07-02

Applicant: BELL SPORTS, INC.

Inventor： ALLEN, Scott

IPC: A42B3/00 ,  F41H1/00

CPC classification number: A42B3/125 ,  A42B3/04 ,  A42B3/062 ,  A42B3/08 ,  A63B71/10

Abstract: A helmet can include a helmet body formed of a foam energy-absorbing material in which the helmet body includes inner and outer opposing surfaces. A plurality of lower slots can be formed completely through the helmet body and can be open at a lower edge of the helmet body. A plurality of upper slots can be formed completely through the helmet body and be open at a top portion of the helmet body to form a star shape. An S-shaped panel of the helmet body can include an undulating form from the alternating and overlapping positions of the plurality of lower slots and the plurality of upper slots. A reinforcing halo can be disposed within the helmet body to reinforce areas of weakness in the helmet body resulting from the plurality of lower slots and the plurality of upper slots.

Abstract translation: 头盔可以包括由泡沫能量吸收材料形成的头盔主体，其中头盔主体包括内部和外部相对表面。 多个下槽可以完全穿过头盔本体形成，并且可以在头盔主体的下边缘处打开。 可以通过头盔主体完全形成多个上部槽口，并且在头盔主体的顶部开口形成星形。 头盔主体的S形面板可以包括来自多个下槽和多个上槽的交替和重叠位置的起伏形式。 加强光晕可以设置在头盔主体内，以加强由多个下槽和多个上槽产生的头盔主体的弱点。

公开(公告)号：WO2015172113A1

公开(公告)日：2015-11-12

申请号：PCT/US2015/030032

申请日：2015-05-08

Applicant: BELL SPORTS, INC.

Inventor： LOWE, Michael, W.

IPC: A42B3/04

CPC classification number: A42B3/12 ,  A42B3/205 ,  A42B3/22 ,  A42B3/222 ,  A42B3/225

Abstract: A full-face motorcycle helmet can include a faceport opening that includes an upper edge, a lower edge, and an A-pillar extending between the upper edge of the faceport and the lower edge of the faceport. The chinbar can include a recess that begins immediately adjacent the A-pillar and includes a chinbar height Hcl within the recess that is greater than or equal to 60 millimeters (mm) and a chin bar height Hc2 outside and immediately adjacent the recess that is greater than or equal to 70 mm. The recess can include a height Hr that is greater than or equal to 5 mm for a distance in a range of 15-60 mm. The recess can further include a stair-step between the bottom of the recess and the top of the recess comprising a length that is less than or equal to 35 mm.

Abstract translation: 全脸摩托车头盔可以包括面孔开口，其包括上边缘，下边缘和在面孔的上边缘和面孔的下边缘之间延伸的A柱。 下巴可以包括一个紧邻A柱开始的凹槽，并且在凹槽内包括大于或等于60毫米（mm）的下巴高度Hcl，并且下凹块高度Hc2在凹槽之外并且紧邻该凹槽更大 大于或等于70mm。 该凹部可以包括在15-60mm的范围内大于或等于5mm的高度Hr。 所述凹部还包括在所述凹部的底部和所述凹部的顶部之间的阶梯台阶，其包括小于或等于35mm的长度。

公开(公告)号：WO2015152992A1

公开(公告)日：2015-10-08

申请号：PCT/US2015/014558

申请日：2015-02-05

Applicant: BELL SPORTS, INC.

Inventor： MUSAL, Michael, J.

IPC: A42B3/00

CPC classification number: A42B3/324 ,  A42B3/06

Abstract: An adaptive fit helmet can comprise an outer shell, and energy-absorbing material, and a fit system. The outer shell can comprise a top portion, a side portion, and an outer expansion area that extends along an interface of the top portion and the side portion from a temple area of the outer shell to a lower exterior edge of the outer shell. The energy-absorbing material can be disposed withing the outer shell, wherein the energy-absorbing material further comprises a top portion, a side portion, and an inner expansion area between edges of the top portion and the side portion of the energy-absorbing material such that the inner expansion area corresponds with the outer expansion area. The fit system can comprise a belt and a fit system mechanism that control a three-dimensional size and shape of both the outer shell and the energy-absorbing material.

Abstract translation: 适应性适配头盔可以包括外壳和能量吸收材料以及配合系统。 外壳可以包括顶部，侧部和外部膨胀区域，其沿着顶部部分和侧部分的界面从外壳的镜腿区域延伸到外壳的下外部边缘。 能量吸收材料可以与外壳一起设置，其中能量吸收材料还包括顶部，侧部以及能量吸收材料的顶部和侧部的边缘之间的内部膨胀区域 使得内部扩张区域对应于外部扩张区域。 配合系统可以包括控制外壳和能量吸收材料的三维尺寸和形状的带和配合系统机构。

公开(公告)号：WO2015138359A1

公开(公告)日：2015-09-17

申请号：PCT/US2015/019538

申请日：2015-03-09

Applicant: DECA TECHNOLOGIES INC.

Inventor： SCANLAN, Christopher, M. ,  BISHOP, Craig

IPC: H01L23/538 ,  H01L21/60 ,  H01L21/56

CPC classification number: H01L24/96 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/214

Abstract: A method of making a semiconductor package can comprise forming a plurality of thick redistribution layer (RDL) traces over active surfaces of a plurality of semiconductor die that are electrically connected to contact pads on the plurality of semiconductor die, singulating the plurality of semiconductor die comprising the plurality of thick RDL traces, mounting the singulated plurality of semiconductor die over a temporary carrier with the active surfaces of the plurality of semiconductor die oriented away from the temporary carrier, disposing encapsulant material over the active surfaces and at least four side surfaces of each of the plurality of semiconductor die, over the plurality of thick RDL traces, and over the temporary carrier, forming a via through the encapsulant material to expose at least one of the plurality of thickened RDL traces with respect to the encapsulant material, removing the temporary carrier, and singulating the plurality of semiconductor die.

Abstract translation: 制造半导体封装的方法可以包括在电连接到多个半导体管芯上的接触焊盘的多个半导体管芯的有效表面上形成多个厚的重分布层（RDL）迹线，将多个半导体管芯分离， 多个粗RDL迹线，将多个半导体裸片的多个半导体裸片安装在临时载体上，其中多个半导体管芯的有源表面远离临时载体，将密封剂材料设置在活性表面和每个半导体芯片的至少四个侧表面上 在多个厚RDL迹线上并且在临时载体上方，通过密封剂材料形成通孔以暴露相对于密封剂材料的多个增厚的RDL迹线中的至少一个，去除临时的 载体和单个多个半导体管芯。

公开(公告)号：WO2015134881A1

公开(公告)日：2015-09-11

申请号：PCT/US2015/019197

申请日：2015-03-06

Applicant: BELL SPORTS, INC.

Inventor： JACOBSON, Gregg, T.

IPC: A42B3/00

CPC classification number: A42B3/06 ,  A42B3/066 ,  A42B3/08 ,  A42B3/12 ,  A42B3/128 ,  A42B3/147 ,  A42B3/221 ,  A42B3/283

Abstract: A helmet can comprise an upper-body comprising an upper outer shell, a first foam energy-absorbing material coupled the upper outer shell, and an upper vent opening formed through the upper-body. The helmet can comprise a lower-body nested within the upper-body, wherein the lower-body comprises a lower outer shell, a second foam energy-absorbing material coupled the outer shell, and a lower vent opening formed through the lower-body and overlapping with the upper vent opening. The helmet can comprise a vent closure system comprising a vent cover disposed between an inner surface of the upper-body and an outer surface of the lower-body, wherein the vent closure system is configured to adjustably block 0- 100 percent of the overlap between the upper vent opening and the lower vent opening with the vent cover. An adjustable position of the vent cover can be determined by a position of a vent actuator tab.

Abstract translation: 头盔可以包括上身，其包括上外壳，连接上外壳的第一泡沫能量吸收材料和通过上身形成的上排气口。 头盔可以包括嵌套在上身内的下身，其中下身包括下外壳，连接外壳的第二泡沫能量吸收材料和通过下体形成的下通气口， 与上排气口重叠。 头盔可以包括排气口系统，其包括设置在上身的内表面和下体的外表面之间的通气盖，其中通气口闭合系统构造成可调节地阻挡0-100％ 上排气口和下通风口与通风口盖。 通气盖的可调节位置可以通过排气致动器翼片的位置来确定。

公开(公告)号：WO2015134863A1

公开(公告)日：2015-09-11

申请号：PCT/US2015/019159

申请日：2015-03-06

Applicant: BELL SPORTS, INC.

Inventor： JACOBSEN, Gregg, T.

IPC: A42B3/00

CPC classification number: A42B3/06 ,  A42B3/066 ,  A42B3/08 ,  A42B3/12 ,  A42B3/128 ,  A42B3/147 ,  A42B3/221 ,  A42B3/283

Abstract: A helmet can comprise an upper-body and a lower-body nested within the upper-body. An opening can be formed within a front portion of the helmet and disposed between an outer surface of the upper-body and an inner surface of the lower-body. A first magnet can be encased within the upper-body or the lower-body and adjacent the opening. A shield can comprise a shield mount and a second magnet coupled to the shield mount that is sized to fit within the opening and to be releasably coupled to the first magnet. The first magnet and the second magnet can be self-aligned in direct alignment with eyes of a user. A third magnet can be disposed above the first magnet and aligned with the second magnet on an outer surface of the helmet out of sight from eyes of the user.

Abstract translation: 头盔可以包括嵌套在上身内的上身和下身。 开口可以形成在头盔的前部内并且设置在上身的外表面和下体的内表面之间。 第一磁体可以被封装在上体或下体内并与开口相邻。 屏蔽件可以包括屏蔽安装件和耦合到屏蔽安装座的第二磁体，其尺寸适于装配在开口内并且可释放地联接到第一磁体。 第一磁体和第二磁体可以与用户的眼睛直接对准而自对准。 第三磁体可以设置在第一磁体上方并与头盔的外表面上的第二磁体对准，使用者的眼睛不在视线之内。

公开(公告)号：WO2015061002A1

公开(公告)日：2015-04-30

申请号：PCT/US2014/058255

申请日：2014-09-30

Applicant: BELL SPORTS, INC.

Inventor： JACOBSEN, Gregg, T.

IPC: A42B3/04 ,  A42B7/00

CPC classification number: A44B11/125 ,  A42B3/066 ,  A42B3/08 ,  A44B11/10 ,  Y10T24/2185 ,  Y10T24/4019 ,  Y10T24/4084 ,  Y10T24/4086 ,  Y10T24/4093

Abstract: A webbing adjuster for maintaining orderly, adjustable strap arrangement and secure connections in, e.g., a helmet, which allows for strap adjustment and, upon cinching, secures straps in place. The adjuster can be used in mountaineering, with motorcycle and bicycle helmets, and in other applications that benefit from orderly, adjustable strap arrangement and/or secure connections.

Abstract translation: 一种织带调节器，用于保持有序的，可调节的带子布置和例如头盔中的安全连接，其允许带子调节，并且在收紧时将带固定在适当位置。 调节器可用于登山，摩托车和自行车头盔以及其他应用中，从有序，可调节的肩带布置和/或安全连接中受益。

公开(公告)号：WO2014182962A1

公开(公告)日：2014-11-13

申请号：PCT/US2014/037388

申请日：2014-05-08

Applicant: DECA TECHNOLOGIES INC.

Inventor： SCANLAN, Christopher, M. ,  OLSON, Timothy, L.

IPC: H01L21/98 ,  H05K3/10

CPC classification number: H01L21/78 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A semiconductor device and method of making a semiconductor device is described, An embedded die panel comprising a plurality of semiconductor die separated by saw streets is provided. A conductive layer is formed by an electroless plating process, the conductive layer comprising bussing lines disposed in the saw streets and a redistribution layer (RDL) coupled to the semiconductor die and bussing lines. An insulating layer is formed over the conductive layer and embedded die panel, the insulating layer comprising openings disposed over the conductive layer outside a footprint of the semiconductor die. Interconnect structures are formed in the openings in the insulating layer by using the conductive layer as part of an electroplating process. The embedded die panel is singulated through the saw streets after forming the interconnect structures to remove the bussing lines and to form individual fan-out wafer level packages.

Abstract translation: 一种制造半导体器件的半导体器件及其制造方法，其特征在于，提供一种由锯片隔开的多个半导体管芯构成的嵌入式模具面板。 通过化学镀处理形成导电层，导电层包括布置在锯条街道中的总线和耦合到半导体管芯和总线的再分配层（RDL）。 绝缘层形成在导电层和嵌入的模板上，绝缘层包括设置在半导体管芯的覆盖区外的导电层上的开口。 通过使用导电层作为电镀工艺的一部分，在绝缘层的开口中形成互连结构。 在形成互连结构以便去除总线并且形成单独的扇出晶片级封装之后，嵌入式模具面板通过锯条划分。

公开(公告)号：WO2014171973A1

公开(公告)日：2014-10-23

申请号：PCT/US2013/070076

申请日：2013-11-14

Applicant: COMTECH EF DATA CORP.

Inventor： PENG, Lianfeng

IPC: H04B1/7156

CPC classification number: H04B1/7073 ,  H04B1/709

Abstract: A method of detecting FN code synchronization for a DSSS signal comprising receiving a DSSS data signal of data frames comprised of I and Q symbols, at least a portion of each data frame comprising a unique word, demodulating the data signal into I and Q chip samples, filtering the I and Q chip samples and outputting the filtered I and Q chip samples to a chip stream controller which outputs the plurality of chip streams to a correlation matrix that correlates the plurality of chip streams with the chipped unique word and outputs a correlated data stream, A plurality of FFTs is run on the correlated output data stream and a processor searches for a maximum frequency bin power of each FF'T. A PN synchronization detector searches for a maximum frequency bin power among the plurality of FFT runs and determines whether PN synchronization is present.

Abstract translation: 一种检测DSSS信号的FN码同步的方法，包括接收由I和Q符号组成的数据帧的DSSS数据信号，每个数据帧的至少一部分包括唯一字，将数据信号解调为I和Q码片样本 对I和Q芯片样本进行滤波并将滤波后的I和Q码片样本输出到芯片流控制器，芯片流控制器将多个芯片流输出到相关矩阵，该相关矩阵将多个芯片流与切片唯一字相关，并输出相关数据 在相关输出数据流上运行多个FFT，并且处理器搜索每个FF'T的最大频率仓功率。 PN同步检测器在多个FFT运行中搜索最大频率箱功率，并确定是否存在PN同步。

公开(公告)号：WO2014071312A1

公开(公告)日：2014-05-08

申请号：PCT/US2013/068330

申请日：2013-11-04

Applicant: DECA TECHNOLOGIES INC.

Inventor： SCANLAN, Christopher, M. ,  OLSON, Timothy, L.

IPC: H01L27/77

CPC classification number: H01L24/19 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/00 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/03

Abstract: An adaptive patterning method and system for fabricating panel based package structures is described. A plurality of semiconductor die comprising a copper column disposed over the active surface of each semiconductor die is provided. An embedded die panel is formed by disposing an encapsulant around each of the plurality of semiconductor die. A true position and rotation of each semiconductor die within the embedded die panel is measured. A unit-specific pattern is formed to align with the true position of each semiconductor die in the embedded die panel. The unit-specific pattern as a fan-out structure disposed over the semiconductor die, over the encapsulant, and coupled to the copper columns. A fan-in redistribution layer (RDL) can extend over the active surface of each semiconductor die such that the copper columns formed over the fan-in RDLs. The unit-specific pattern can be directly coupled to the copper columns.

Abstract translation: 描述了一种用于制造基于面板的封装结构的自适应图案化方法和系统。 提供了包括设置在每个半导体管芯的有效表面上的铜柱的多个半导体管芯。 通过在多个半导体管芯的每一个周围设置密封剂来形成嵌入式模板。 测量嵌入式模板内的每个半导体管芯的真实位置和旋转。 形成单元特定图案以与嵌入的模板中的每个半导体管芯的真实位置对准。 作为扇出结构的单元特定图案设置在半导体管芯上方，超过密封剂并耦合到铜柱。 风扇再分配层（RDL）可以在每个半导体管芯的有效表面上延伸，使得铜柱形成在风扇内的RDL中。 单元特定图案可以直接耦合到铜柱。