公开(公告)号：WO2005067663A3

公开(公告)日：2005-07-28

申请号：PCT/US2005/000614

申请日：2005-01-07

Applicant: STRASBAUGH ,  DALRYMPLE, Alice, M. ,  HORRELL, Robert, J.

Inventor： DALRYMPLE, Alice, M. ,  HORRELL, Robert, J.

IPC: B24B7/22 ,  B24B49/00 ,  B24B49/12

Abstract: A method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an optical sensor disposed within the polishing pad. The intensity of the reflected light is measured by a light detector also disposed in the polishing pad. The intensity of the reflected light varies sinusoidally with the change in layer thickness as the layer is removed. By measuring the absolute thickness of the layer at two or more points along the sinusoidal curve, the sinusoidal curve is calibrated so that a portion of the wavelength of the curve corresponds to a change in thickness of the layer.

公开(公告)号：WO02053320A9

公开(公告)日：2004-03-04

申请号：PCT/US0150769

申请日：2001-10-23

Applicant: STRASBAUGH

Inventor： HALLEY DAVID G

IPC: B24B9/06 ,  B24B37/013 ,  B24B37/04 ,  B24B37/30 ,  B24B49/02 ,  B24B49/12 ,  B24B53/007 ,  B24B53/017 ,  B24B57/02 ,  H01L21/687 ,  B24B5/00

CPC classification number: B24B37/30 ,  B24B9/065 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B49/02 ,  B24B49/12 ,  B24B53/017 ,  B24B57/02 ,  H01L21/68728

Abstract: The present invention provides an improved planarization apparatus for chemical mechanical planarization. In an exemplary embodiment, the invention provides an apparatus having a back support (118) operatively coupled to the edge support, the bac support having at least one surface for supporting a back side of the object during planarization. The surface for supporting the back side provides a substantially friction free interface between the surface and the back side of the object to allow the object to move across the surface of the back support. In some embodiments, an edge support (120) is movably coupled to an edge of an object for supporting and positioning the object during planarization.

Abstract translation: 本发明提供一种用于化学机械平面化的改进的平面化装置。 在一个示例性实施例中，本发明提供一种具有可操作地耦合到边缘支撑件的后支撑件（118）的装置，所述支架具有至少一个用于在平坦化期间支撑物体的背面的表面。 用于支撑背面的表面在物体的表面和背面之间提供基本上无摩擦的界面，以允许物体移动穿过背部支撑件的表面。 在一些实施例中，边缘支撑件（120）可移动地联接到物体的边缘，以在平坦化期间支撑和定位物体。

公开(公告)号：WO2003086701A1

公开(公告)日：2003-10-23

申请号：PCT/US2003/010811

申请日：2003-04-09

Applicant: STRASBAUGH, INC.

Inventor： KASSIR, Salman, Moudrek ,  SPIEGEL, Larry, A.

IPC: B24B1/00

CPC classification number: B24B37/30 ,  B23B31/307 ,  B23B2226/18 ,  H01L21/6838

Abstract: The present invention provides an apparatus and method for protecting a work piece during surface processing. The apparatus employs a protective material (22) to protect a wafer during backside grinding. The apparatus can further include a vacuum chuck (14) that allows the passage of a vacuum signal, a frame (24) holding the protective material, a frame holder (26) to hold the frame, and a fastening arrangement to fasten the frame holder to the chuck adjacent a support surface. The method can include providing a vacuum chuck, placing a protective material in contact with the chuck, placing a wafer in contact with the protective material, applying a vacuum signal securing the wafer with the chuck, and grinding the backside surface of the wafer.

Abstract translation: 本发明提供了一种用于在表面处理期间保护工件的装置和方法。 该装置采用保护材料（22）以在背面研磨期间保护晶片。 该装置还可以包括允许真空信号通过的真空吸盘（14），保持保护材料的框架（24），用于保持框架的框架保持件（26）和紧固装置，以紧固框架架 靠近支撑表面的卡盘。 该方法可以包括提供真空卡盘，将保护材料放置在与卡盘接触的位置，使晶片与保护材料接触，施加用夹头固定晶片的真空信号，并研磨晶片的背面。

公开(公告)号：WO02060643A9

公开(公告)日：2003-09-12

申请号：PCT/US0151079

申请日：2001-10-23

Applicant: STRASBAUGH

Inventor： HALLEY DAVID G

IPC: B24B9/06 ,  B24B37/04 ,  B24B41/04 ,  B24B47/10 ,  B24B49/02 ,  B24B49/12 ,  B24B53/007 ,  B24B57/02 ,  H01L21/304 ,  H01L21/687 ,  B24B7/22 ,  B24B1/00

CPC classification number: B24B9/065 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B37/30 ,  B24B41/04 ,  B24B47/10 ,  B24B49/02 ,  B24B49/12 ,  B24B53/017 ,  B24B57/02 ,  H01L21/68728

Abstract: The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus for polishing an object (115) comprises a pad (117) having a polishing surface to be placed on the target surface of the object (115) to be polished. A pad drive member (116) is connected to the pad to move the pad relative to the object to chenge a position of the polishing surface of the pad on the target surface of the object. A drive support (251) is movably coupled with the pad drive member (116) to support the pad drive member (116) for rotation relative to the drive support around a pivot point (252) which is disposed substantially on the target surface of the object (115) during polishing.

Abstract translation: 本发明提供了用于化学机械平面化和其它类型抛光的改进的平面化或抛光装置，例如金属抛光和光学抛光。 在一个示例性实施例中，用于抛光物体（115）的装置包括具有待抛光的物体（115）的目标表面上的抛光表面的焊盘（117）。 衬垫驱动构件（116）连接到衬垫以使衬垫相对于物体移动以使衬垫的抛光表面的位置在目标表面上沉降。 驱动支撑件（251）可与垫驱动构件（116）可移动地联接，以支撑垫驱动构件（116），用于相对于围绕枢转点（252）的驱动支撑件旋转，该枢转点基本上设置在 物体（115）。

公开(公告)号：WO2003065431A1

公开(公告)日：2003-08-07

申请号：PCT/US2003/002787

申请日：2003-01-29

Applicant: STRASBAUGH

Inventor： KASSIR, Salman, M.

IPC: H01L21/302

CPC classification number: H01L21/30608 ,  Y10S438/977

Abstract: A method of relieving surface stress on a thin wafer (16) by removing a small portion of the wafer substrate, the substrate being removed by applying a solution of KOH to the wafer while the wafer spins.

Abstract translation: 通过去除晶片衬底的一小部分来减轻薄晶片（16）上的表面应力的方法，通过在晶片旋转时将KOH溶液施加到晶片来除去衬底。

公开(公告)号：WO02060643A3

公开(公告)日：2002-10-03

申请号：PCT/US0151079

申请日：2001-10-23

Applicant: STRASBAUGH

Inventor： HALLEY DAVID G

IPC: B24B9/06 ,  B24B37/04 ,  B24B41/04 ,  B24B47/10 ,  B24B49/02 ,  B24B49/12 ,  B24B53/007 ,  B24B57/02 ,  H01L21/304 ,  H01L21/687 ,  B24B7/22 ,  B24B1/00

CPC classification number: B24B9/065 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B37/30 ,  B24B41/04 ,  B24B47/10 ,  B24B49/02 ,  B24B49/12 ,  B24B53/017 ,  B24B57/02 ,  H01L21/68728

Abstract: The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus for polishing an object (115) comprises a pad (117) having a polishing surface to be placed on the target surface of the object (115) to be polished. A pad drive member (116) is connected to the pad to move the pad relative to the object to chenge a position of the polishing surface of the pad on the target surface of the object. A drive support (251) is movably coupled with the pad drive member (116) to support the pad drive member (116) for rotation relative to the drive support around a pivot point (252) which is disposed substantially on the target surface of the object (115) during polishing.

Abstract translation: 本发明提供了用于化学机械平坦化和其他类型的抛光如金属抛光和光学抛光的改进的平坦化或抛光装置。 在示例性实施例中，用于抛光物体（115）的设备包括具有抛光表面的抛光垫（117），抛光表面将被放置在待抛光的物体（115）的目标表面上。 衬垫驱动构件（116）连接到衬垫以相对于物体移动衬垫，以平整衬垫的抛光表面在物体的目标表面上的位置。 驱动器支撑件（251）与垫驱动构件（116）可移动地联接以支撑垫驱动构件（116）以相对于驱动器支撑件围绕枢轴点（252）旋转，该枢轴点基本上设置在 物体（115）在抛光期间。