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    FRICTION SENSOR FOR POLISHING SYSTEM
    41.
    发明申请
    FRICTION SENSOR FOR POLISHING SYSTEM 审中-公开
    用于抛光系统的摩擦传感器

    公开(公告)号：WO2008064268A2

    公开(公告)日：2008-05-29

    申请号：PCT/US2007/085305

    申请日：2007-11-20

    Applicant: APPLIED MATERIALS, INC. ,  BENVEGNU, Dominic J. ,  SWEDEK, Boguslaw A.

    Inventor： BENVEGNU, Dominic J. ,  SWEDEK, Boguslaw A.

    IPC: B24B49/00

    CPC classification number: G01N19/02 ,  B24B37/013 ,  B24B49/16

    Abstract: A system. method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.

    Abstract translation: 描述了用于监测经历抛光的基底的摩擦系数的系统，方法和装置。 抛光垫组件包括包括抛光表面的抛光层，以及柔性地联接到抛光层上的衬底接触构件，其具有与衬底的暴露表面接触的顶表面。 顶表面的至少一部分与抛光表面基本共面。 提供传感器以测量基板接触构件的横向位移。 一些实施例可以在化学机械抛光期间提供准确的端点检测以指示下层的曝光。

    OPTICAL DETECTION OF METAL LAYER CLEARANCE
    43.
    发明申请
    OPTICAL DETECTION OF METAL LAYER CLEARANCE 审中-公开
    金属层清晰度的光学检测

    公开(公告)号：WO2013028389A1

    公开(公告)日：2013-02-28

    申请号：PCT/US2012/050607

    申请日：2012-08-13

    Applicant: APPLIED MATERIALS, INC. ,  DAVID, Jeffrey Drue ,  BENVEGNU, Dominic J.

    Inventor： DAVID, Jeffrey Drue ,  BENVEGNU, Dominic J.

    IPC: H01L21/304 ,  H01L21/66

    CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B49/12

    Abstract: A method of controlling polishing includes polishing a metal layer of a substrate. The metal layer overlies an underlying layer structure. During polishing of the metal layer, a light beam is directed onto the first substrate. The metal layer is sufficiently thin that a portion of the light beam reflects from an exposed surface of the metal layer and a portion of the light beam passes through the metal layer and reflects from the underlying layer structure to generate a reflected light beam. The reflected light beam is monitored during polishing and a sequence of measured spectra is generated from the reflected light beam. At least one of a polishing endpoint or an adjustment for a polishing rate is determined from the sequence of measured spectra.

    Abstract translation: 控制抛光的方法包括抛光衬底的金属层。 金属层覆盖下层结构。 在抛光金属层期间，将光束引导到第一基板上。 金属层足够薄，使得一部分光束从金属层的暴露表面反射，并且光束的一部分穿过金属层并从下面的层结构反射以产生反射光束。 在抛光期间监测反射光束，并从反射光束产生测量光谱序列。 从测量光谱的顺序确定抛光终点或抛光速率的调整中的至少一个。

    GATHERING SPECTRA FROM MULTIPLE OPTICAL HEADS
    44.
    发明申请
    GATHERING SPECTRA FROM MULTIPLE OPTICAL HEADS 审中-公开
    从多个光学头收集光谱

    公开(公告)号：WO2012102871A2

    公开(公告)日：2012-08-02

    申请号：PCT/US2012021135

    申请日：2012-01-12

    Applicant: APPLIED MATERIALS INC ,  DAVID JEFFREY DRUE ,  SWEDEK BOGUSLAW A ,  BENVEGNU DOMINIC J ,  DHANDAPANI SIVAKUMAR

    Inventor： DAVID JEFFREY DRUE ,  SWEDEK BOGUSLAW A ,  BENVEGNU DOMINIC J ,  DHANDAPANI SIVAKUMAR

    IPC: H01L21/304

    CPC classification number: B24B49/12 ,  B24B37/013 ,  B24B37/105

    Abstract: A polishing apparatus includes a platen to hold a polishing pad having a plurality of optical apertures, a carrier head to hold a substrate against the polishing pad, a motor to generate relative motion between the carrier head and the platen, and an optical monitoring system. The optical monitoring system includes at least one light source, a common detector, and an optical assembly configured to direct light from the at least one light source to each of a plurality of separated positions in the platen, to direct light from each position of the plurality of separated positions to the substrate as the substrate passes over said each position, to receive reflected light from the substrate as the substrate passes over said each position, and to direct the reflected light from each of the plurality of separated positions to the common detector.

    Abstract translation: 抛光装置包括用于保持具有多个光学孔径的抛光垫的台板，用于将基板保持在抛光垫上的载体头，在载体头与台板之间产生相对运动的电机以及光学监测系统。 该光学监测系统包括至少一个光源，公共检测器以及光学组件，该光学组件被配置为将来自至少一个光源的光引导至台板中的多个分离位置中的每一个，以引导来自 当衬底经过所述每个位置时将多个分离位置提供给衬底，以便当衬底经过所述每个位置时接收来自衬底的反射光，并将来自多个分离位置中的每一个的反射光引导至公共检测器 。

    TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING
    45.
    发明申请
    TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING 审中-公开
    将测量光谱匹配到用于现场光学监测的参考光谱的技术

    公开(公告)号：WO2012019044A3

    公开(公告)日：2012-05-18

    申请号：PCT/US2011046646

    申请日：2011-08-04

    Applicant: APPLIED MATERIALS INC ,  HU XIAOYUAN ,  WANG ZHIHONG ,  LEE HARRY Q ,  ZHU ZHIZE ,  DAVID JEFFREY DRUE ,  BENVEGNU DOMINIC J ,  ZHANG JIMIN ,  TU WEN-CHIANG

    Inventor： HU XIAOYUAN ,  WANG ZHIHONG ,  LEE HARRY Q ,  ZHU ZHIZE ,  DAVID JEFFREY DRUE ,  BENVEGNU DOMINIC J ,  ZHANG JIMIN ,  TU WEN-CHIANG

    IPC: H01L21/304 ,  H01L21/66

    CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B37/107 ,  B24B37/205 ,  B24B49/045 ,  B24B49/12

    Abstract: A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.

    Abstract translation: 控制抛光的方法包括：存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱，使用 除了平方差的和以产生最佳匹配参考光谱的序列之外的匹配技术，以及基于最佳匹配参考光谱的序列来确定抛光终点或抛光速率的调整中的至少一个。 找到最佳匹配的参考光谱可以包括执行所测量的光谱与来自文库的多个参考光谱中的两个或更多个的互相关，并选择与所测量的光谱具有最大相关性的参考光谱作为最佳匹配参考 光谱。

    MOLDING WINDOWS IN THIN PADS
    46.
    发明申请
    MOLDING WINDOWS IN THIN PADS 审中-公开
    薄壁上的模制窗

    公开(公告)号：WO2011129959A3

    公开(公告)日：2012-04-19

    申请号：PCT/US2011029468

    申请日：2011-03-22

    Applicant: APPLIED MATERIALS INC ,  SWEDEK BOGUSLAW A ,  BENNETT DOYLE E ,  BENVEGNU DOMINIC J

    Inventor： SWEDEK BOGUSLAW A ,  BENNETT DOYLE E ,  BENVEGNU DOMINIC J

    IPC: H01L21/304 ,  H01L21/66

    CPC classification number: B24B37/205

    Abstract: A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.

    Abstract translation: 抛光垫包括具有抛光表面的抛光层，与抛光层相对的抛光层一侧的粘合剂层，以及延伸穿过模制到抛光层的固体透光窗。 固体透光窗具有具有第一横向尺寸的上部和具有小于第一横向尺寸的第二横向尺寸的下部。 固体透光窗的顶表面与抛光表面共面并且固体透光窗的底表面与粘合剂层的下表面共面。

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