公开(公告)号：WO2012051121A3

公开(公告)日：2012-06-21

申请号：PCT/US2011055642

申请日：2011-10-10

Applicant: APPLIED MATERIALS INC ,  DAVID JEFFREY DRUE ,  BENVEGNU DOMINIC J ,  HU XIAOYUAN

Inventor： DAVID JEFFREY DRUE ,  BENVEGNU DOMINIC J ,  HU XIAOYUAN

IPC: H01L21/304 ,  H01L21/66

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/12 ,  H01L21/3212 ,  H01L22/12

Abstract: A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.

Abstract translation: 控制抛光的方法包括：存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱，使用 除了平方差的和以产生最佳匹配参考光谱的序列之外的匹配技术，以及基于最佳匹配参考光谱的序列来确定抛光终点或抛光速率的调整中的至少一个。 找到最佳匹配的参考光谱可以包括执行所测量的光谱与来自文库的多个参考光谱中的两个或更多个的互相关，并且选择与所测量的光谱具有最大相关性的参考光谱作为最佳匹配参考 光谱。

公开(公告)号：WO2012051121A2

公开(公告)日：2012-04-19

申请号：PCT/US2011/055642

申请日：2011-10-10

Applicant: APPLIED MATERIALS, INC. ,  DAVID, Jeffrey Drue ,  BENVEGNU, Dominic J. ,  HU, Xiaoyuan

Inventor： DAVID, Jeffrey Drue ,  BENVEGNU, Dominic J. ,  HU, Xiaoyuan

IPC: H01L21/304 ,  H01L21/66

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/12 ,  H01L21/3212 ,  H01L22/12

Abstract: A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.

Abstract translation: 控制抛光的方法包括存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱 ，使用不同于平方差平方和的匹配技术来找到最佳匹配参考谱以产生最佳匹配参考谱的序列，以及基于最佳匹配序列来确定抛光终点或抛光速率的调整中的至少一个 参考光谱。 寻找最佳匹配参考光谱可以包括执行测量光谱与来自库的多个参考光谱中的两个或更多个中的每一个的互相关，并选择与测量光谱具有最大相关性的参考光谱作为最佳匹配参考 谱。

公开(公告)号：WO2012012530A3

公开(公告)日：2012-01-26

申请号：PCT/US2011/044680

申请日：2011-07-20

Applicant: APPLIED MATERIALS, INC. ,  DAVID, Jeffrey Drue ,  HU, Xiaoyuan ,  ZHU, Zhize ,  LEE, Harry Q.

Inventor： DAVID, Jeffrey Drue ,  HU, Xiaoyuan ,  ZHU, Zhize ,  LEE, Harry Q.

IPC: H01L21/66 ,  H01L21/304

Abstract: A method of polishing includes polishing a substrate, receiving an identification of a selected spectral feature to monitor during polishing, measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, determining a location value and an associated intensity value of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of coordinates, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of coordinates. At least some of the spectra of the sequence differ due to material being removed during the polishing, and the coordinates are pairs of location values and associated intensity values.

公开(公告)号：WO2012012530A2

公开(公告)日：2012-01-26

申请号：PCT/US2011044680

申请日：2011-07-20

Applicant: APPLIED MATERIALS INC ,  DAVID JEFFREY DRUE ,  HU XIAOYUAN ,  ZHU ZHIZE ,  LEE HARRY Q

Inventor： DAVID JEFFREY DRUE ,  HU XIAOYUAN ,  ZHU ZHIZE ,  LEE HARRY Q

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B49/12

Abstract: A method of polishing includes polishing a substrate, receiving an identification of a selected spectral feature to monitor during polishing, measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, determining a location value and an associated intensity value of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of coordinates, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of coordinates. At least some of the spectra of the sequence differ due to material being removed during the polishing, and the coordinates are pairs of location values and associated intensity values.

Abstract translation: 抛光方法包括抛光基底，接收所选择的光谱特征的识别以在抛光期间监测，测量在衬底被抛光时从衬底反射的光的光谱序列，确定位置值和相关联的强度值 所述光谱序列中的每个光谱的所选光谱特征以产生坐标序列，并且基于所述坐标序列确定抛光终点或抛光速率的调整中的至少一个。 由于抛光期间材料被去除，该序列的至少一些光谱不同，并且坐标是位置值对和相关联的强度值对。

公开(公告)号：WO2006058245A3

公开(公告)日：2007-05-10

申请号：PCT/US2005042798

申请日：2005-11-28

Applicant: UNIV CALIFORNIA ,  SOH HYONGSOK TOM ,  WANG JEAN Y J ,  KIM UNYOUNG ,  HU XIAOYUAN SANDRA ,  QIAN JIANGRONG ,  MEINHART CARL

Inventor： SOH HYONGSOK TOM ,  WANG JEAN Y J ,  KIM UNYOUNG ,  HU XIAOYUAN SANDRA ,  QIAN JIANGRONG ,  MEINHART CARL

IPC: C12Q1/00

CPC classification number: B01L3/502776 ,  B01L3/5025 ,  B01L3/502746 ,  B01L3/502761 ,  B01L2200/0652 ,  B01L2200/0668 ,  B01L2300/0816 ,  B01L2300/0864 ,  B01L2300/087 ,  B01L2300/0877 ,  B01L2400/0424 ,  B01L2400/0463 ,  B01L2400/0487 ,  B03C5/026 ,  B03C5/028 ,  C12M47/04 ,  C12N13/00 ,  G01N15/1031 ,  G01N15/1056 ,  G01N2015/1081

Abstract: Provided are methods, devices and systems that utilize dielectrophoretic forces to separate a target species from a plurality of species in a sample.

Abstract translation: 提供了利用介电泳力将样品中多种物质分离靶物种的方法，装置和系统。

公开(公告)号：WO2012019044A2

公开(公告)日：2012-02-09

申请号：PCT/US2011/046646

申请日：2011-08-04

Applicant: APPLIED MATERIALS, INC. ,  HU, Xiaoyuan ,  WANG, Zhihong ,  LEE, Harry Q. ,  ZHU, Zhize ,  DAVID, Jeffrey Drue ,  BENVEGNU, Dominic J. ,  ZHANG, Jimin ,  TU, Wen-Chiang

Inventor： HU, Xiaoyuan ,  WANG, Zhihong ,  LEE, Harry Q. ,  ZHU, Zhize ,  DAVID, Jeffrey Drue ,  BENVEGNU, Dominic J. ,  ZHANG, Jimin ,  TU, Wen-Chiang

IPC: H01L21/304 ,  H01L21/66

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B37/107 ,  B24B37/205 ,  B24B49/045 ,  B24B49/12

Abstract: A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.

Abstract translation: 控制抛光的方法包括存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱 ，使用不同于平方差平方和的匹配技术来找到最佳匹配参考谱以产生最佳匹配参考谱的序列，以及基于最佳匹配序列来确定抛光终点或抛光速率的调整中的至少一个 参考光谱。 寻找最佳匹配参考光谱可以包括执行测量光谱与来自库的多个参考光谱中的两个或更多个中的每一个的互相关，并选择与测量光谱具有最大相关性的参考光谱作为最佳匹配参考 谱。

公开(公告)号：WO2012148716A2

公开(公告)日：2012-11-01

申请号：PCT/US2012/033677

申请日：2012-04-13

Applicant: APPLIED MATERIALS, INC. ,  DAVID, Jeffrey Drue ,  BENVEGNU, Dominic J. ,  HU, Xiaoyuan

Inventor： DAVID, Jeffrey Drue ,  BENVEGNU, Dominic J. ,  HU, Xiaoyuan

IPC: H01L21/304

CPC classification number: B24B37/005 ,  B24B37/042 ,  G01N21/274 ,  G01N21/41 ,  H01L21/3212 ,  H01L22/12 ,  H01L22/26

Abstract: A method of generating a library of reference spectra includes storing an optical model for a layer stack having at a plurality of layers, and for each combination of a refractive index function from a set of refractive index functions and an extinction coefficient function from a set of extinction coefficient functions, calculating a reference spectrum using the optical model. Another method of generating a library of reference spectra includes receiving user input identifying a plurality of different contribution percentages for at least one of a first stack or a second stack on the substrate, and for each contribution percentage from the plurality of different contribution percentages, calculating a reference spectrum from a first spectrum for the first stack, a second spectrum for the second stack, and the contribution percentage.

Abstract translation: 生成参考光谱库的方法包括存储具有多个层的层堆栈的光学模型，以及针对来自一组折射率函数的折射率函数和 来自一组消光系数函数的消光系数函数，使用光学模型计算参考光谱。 生成参考光谱库的另一种方法包括接收标识针对衬底上的第一叠层或第二叠层中的至少一个的多个不同贡献百分比的用户输入，并且针对来自多个不同贡献百分比的每个贡献百分比计算 来自第一叠层的第一光谱的参考光谱，第二叠层的第二光谱以及贡献百分比。

公开(公告)号：WO2011152958A2

公开(公告)日：2011-12-08

申请号：PCT/US2011035631

申请日：2011-05-06

Applicant: APPLIED MATERIALS INC ,  MAI DAVID H ,  JEW STEPHEN ,  HU XIAOYUAN

Inventor： MAI DAVID H ,  JEW STEPHEN ,  HU XIAOYUAN

IPC: H01L21/304

CPC classification number: B24B37/042

Abstract: An apparatus and method for simulating a substrate being polished in a multiple carrier head per platen station when no substrate is provided in one or more of the multiple carrier heads is described. In one embodiment, a method for processing a substrate includes providing a single substrate to a polishing station adapted to process a plurality of substrates on a single polishing pad using at least a first carrier head and a second carrier head, retaining the single substrate in the first carrier head while the second carrier head remains substrate-free, urging the first carrier head and the second carrier head toward a polishing surface of the polishing pad; and providing relative movement between the polishing pad and the first carrier head.

Abstract translation: 描述了在多个载体头中的一个或多个中没有设置基板时，模拟在每个压板站的多个载体头中被抛光的基板的装置和方法。 在一个实施例中，用于处理衬底的方法包括向抛光站提供单个衬底，所述抛光站适于使用至少第一载体头和第二载体头在单个抛光垫上处理多个衬底，将单个衬底保持在 第一载体头，而第二载体头保持无基材，将第一载体头和第二载体头推向抛光垫的抛光表面; 以及在所述抛光垫和所述第一承载头之间提供相对运动。

公开(公告)号：WO2012019044A3

公开(公告)日：2012-05-18

申请号：PCT/US2011046646

申请日：2011-08-04

Applicant: APPLIED MATERIALS INC ,  HU XIAOYUAN ,  WANG ZHIHONG ,  LEE HARRY Q ,  ZHU ZHIZE ,  DAVID JEFFREY DRUE ,  BENVEGNU DOMINIC J ,  ZHANG JIMIN ,  TU WEN-CHIANG

Inventor： HU XIAOYUAN ,  WANG ZHIHONG ,  LEE HARRY Q ,  ZHU ZHIZE ,  DAVID JEFFREY DRUE ,  BENVEGNU DOMINIC J ,  ZHANG JIMIN ,  TU WEN-CHIANG

IPC: H01L21/304 ,  H01L21/66

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B37/107 ,  B24B37/205 ,  B24B49/045 ,  B24B49/12

Abstract: A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.

Abstract translation: 控制抛光的方法包括：存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱，使用 除了平方差的和以产生最佳匹配参考光谱的序列之外的匹配技术，以及基于最佳匹配参考光谱的序列来确定抛光终点或抛光速率的调整中的至少一个。 找到最佳匹配的参考光谱可以包括执行所测量的光谱与来自文库的多个参考光谱中的两个或更多个的互相关，并选择与所测量的光谱具有最大相关性的参考光谱作为最佳匹配参考 光谱。

公开(公告)号：WO2012012052A3

公开(公告)日：2012-01-26

申请号：PCT/US2011/040631

申请日：2011-06-16

Applicant: APPLIED MATERIALS, INC. ,  HU, Xiaoyuan (Sandra) ,  WANG, Zhihong ,  TU, Wen-Chiang

Inventor： HU, Xiaoyuan (Sandra) ,  WANG, Zhihong ,  TU, Wen-Chiang

IPC: B24B37/04 ,  B24B49/02 ,  H01L21/304

Abstract: Embodiments described herein relate to methods of detecting an endpoint for a target substrate during chemical mechanical polishing process. In one embodiment, the method includes polishing one or more target substrates at a first film removal rate to provide reference spectra, polishing one or more target substrates at a second film removal rate to provide current spectra of the one or more target substrates, wherein the second film removal rate is different from the first film removal rate, identifying an interface transition between different layers formed on the one or more target substrates using a sequence of endpoint values obtained based on the reference spectra collected during polishing of the one or more reference substrates.