公开(公告)号：WO2011094706A3

公开(公告)日：2011-08-04

申请号：PCT/US2011/023215

申请日：2011-01-31

Applicant: APPLIED MATERIALS, INC. ,  XU, Kun ,  CARLSSON, Ingemar ,  LIU, Feng ,  GAGE, David Maxwell ,  WANG, You ,  BENVEGNU, Dominic J. ,  SWEDEK, Boguslaw A. ,  WANG, Yuchun ,  FONTARENSKY, Pierre ,  TU, Wen-Chiang ,  KARUPPIAH, Lakshmanan

Inventor： XU, Kun ,  CARLSSON, Ingemar ,  LIU, Feng ,  GAGE, David Maxwell ,  WANG, You ,  BENVEGNU, Dominic J. ,  SWEDEK, Boguslaw A. ,  WANG, Yuchun ,  FONTARENSKY, Pierre ,  TU, Wen-Chiang ,  KARUPPIAH, Lakshmanan

IPC: H01L21/304 ,  H01L21/66

Abstract: A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.

Abstract translation: 控制抛光的方法包括抛光在下层或层结构上具有覆盖层的第一基板。 在抛光过程中，基板采用现场监控系统进行监控，以生成一系列测量结果。 测量值被分类成​​组，每组与基底上多个区域的不同区域相关联。 对于每个区域，基于来自关联组的测量来确定覆盖层被清除的时间。 基于在抛光衬底期间施加在至少一个区域中的压力，至少一个区域的时间和另一个区域的时间，计算至少一个区域的至少一个第二调整后的抛光压力。 使用至少一个调整后的抛光压力抛光第二衬底。

公开(公告)号：WO2011094706A2

公开(公告)日：2011-08-04

申请号：PCT/US2011023215

申请日：2011-01-31

Applicant: APPLIED MATERIALS INC ,  XU KUN ,  CARLSSON INGEMAR ,  LIU FENG ,  GAGE DAVID MAXWELL ,  WANG YOU ,  BENVEGNU DOMINIC J ,  SWEDEK BOGUSLAW A ,  WANG YUCHUN ,  FONTARENSKY PIERRE ,  TU WEN-CHIANG ,  KARUPPIAH LAKSHMANAN

Inventor： XU KUN ,  CARLSSON INGEMAR ,  LIU FENG ,  GAGE DAVID MAXWELL ,  WANG YOU ,  BENVEGNU DOMINIC J ,  SWEDEK BOGUSLAW A ,  WANG YUCHUN ,  FONTARENSKY PIERRE ,  TU WEN-CHIANG ,  KARUPPIAH LAKSHMANAN

IPC: H01L21/304 ,  H01L21/66

CPC classification number: B24B37/042 ,  B24B37/013 ,  B24B49/105 ,  B24B49/12 ,  H01L21/3212 ,  H01L22/12 ,  H01L22/26

Abstract: A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.

Abstract translation: 控制抛光的方法包括抛光在下层或层结构上具有覆盖层的第一基板。 在抛光过程中，基板采用现场监控系统进行监控，以生成一系列测量结果。 测量值被分类成​​组，每组与基底上多个区域的不同区域相关联。 对于每个区域，基于来自关联组的测量来确定覆盖层被清除的时间。 基于在抛光衬底期间施加在至少一个区域中的压力，至少一个区域的时间和另一个区域的时间，计算至少一个区域的至少一个第二调整后的抛光压力。 使用该至少一个调整的抛光压力抛光第二衬底。

公开(公告)号：WO2011094135A2

公开(公告)日：2011-08-04

申请号：PCT/US2011/022132

申请日：2011-01-21

Applicant: APPLIED MATERIALS, INC. ,  IRAVANI, Hassan G. ,  XU, Kun ,  SWEDEK, Boguslaw A. ,  WANG, Yuchun ,  TU, Wen-Chiang

Inventor： IRAVANI, Hassan G. ,  XU, Kun ,  SWEDEK, Boguslaw A. ,  WANG, Yuchun ,  TU, Wen-Chiang

IPC: H01L21/304 ,  H01L21/66

CPC classification number: H01L22/14 ,  B24B37/013 ,  B24B37/205 ,  B24B49/105 ,  H01L21/3212 ,  H01L22/26 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, and an eddy current monitoring system to generate an eddy current signal. The eddy current monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a first prong extending from the back portion in a first direction normal to the surface of the platen and having a width in a second direction parallel to the surface of the platen, and second and third prongs extending from the back portion in parallel with the first protrusion, the second and third prongs positioned on opposite sides of and equidistant from the first prong. A spacing between each of the second and third prongs and the first prong is approximately equal to twice the width of the first prong.

Abstract translation: 用于化学机械抛光的设备包括具有支撑抛光垫的表面的台板和产生涡流信号的涡流监测系统。 该涡流监测系统包括一个铁芯和缠绕在铁芯一部分周围的线圈。 芯包括后部，第一叉，其沿垂直于压板表面的第一方向从后部延伸，并且具有沿平行于压板表面的第二方向的宽度，以及第二叉和第三叉， 后部与第一突起平行，第二和第三叉齿位于第一叉齿的相对侧并等距离。 第二和第三叉齿中的每一个与第一叉齿之间的间距大约等于第一叉齿宽度的两倍。

公开(公告)号：WO2010132261A1

公开(公告)日：2010-11-18

申请号：PCT/US2010/033818

申请日：2010-05-06

Applicant: SAUDI ARABIAN OIL COMPANY ,  ARAMCO SERVICES COMPANY ,  WANG, Yuchun, Eugene ,  AL-DOSSARY, Saleh

Inventor： WANG, Yuchun, Eugene ,  AL-DOSSARY, Saleh

IPC: G06F17/00

CPC classification number: G01V1/364 ,  G01V2210/3248 ,  G06T5/002 ,  G06T2207/20012 ,  G06T2207/20032 ,  G06T2207/20192

Abstract: A system and method perform structure-preserving smoothing (SPS) using a data adaptive method for smoothing 3D post-stacked seismic attributes which reduces random noise while preserving the structure without prior computation of its orientation. The data is smoothe within a neighborhood sub-window along a set of predefined orientations, and the best smoothing result is then selected for output. The orientation corresponding to the best result often approximates the true structure orientation embedded in the data, so that the embedded structure is thus preserved. The SPS method can also be combined with median, alpha-trim, symmetric near neighbor, or edge-preserving filters. The SPS method is an effective way to reduce random noise and eliminate noise footprints, and to enhance coherence and curvature attributes.

Abstract translation: 一种系统和方法使用数据自适应方法来执行结构保持平滑（SPS），用于平滑3D后堆叠地震属性，其减少随机噪声，同时保留结构而不事先计算其取向。 数据沿着一组预定义方向在邻域子窗口内平滑，然后选择最佳平滑结果进行输出。 对应于最佳结果的方向通常接近嵌入在数据中的真实结构方向，从而保持嵌入式结构。 SPS方法也可以与中值，alpha修剪，对称近邻或边缘保留滤波器组合。 SPS方法是减少随机噪声和消除噪声足迹的有效方法，并增强相干性和曲率属性。

公开(公告)号：WO2010016900A1

公开(公告)日：2010-02-11

申请号：PCT/US2009/004484

申请日：2009-08-03

Applicant: SAUDI ARABIAN OIL COMPANY ,  ARAMCO SERVICES COMPANY ,  AL-DOSSARY, Saleh ,  WANG, Yuchun, Eugene

Inventor： AL-DOSSARY, Saleh ,  WANG, Yuchun, Eugene

IPC: G01V1/00

CPC classification number: G06K9/0051 ,  G01V1/362 ,  G01V2210/32

Abstract: A system and method identify and display random noise in three dimensional (3-D) seismic data utilizing a 3-D operator to reduce the effects of seismic structure on noise identification. The 3-D operator is derived using statements of required performance in 3-D. The 3-D operator is applied on a pixel-by-pixel basis to each of the pixels in the 3-D post- stacked data to display images in a 3-D display or to output an estimate of noise that is substantially independent of the image structure. The resulting display is generated in colors to indicate noise amplitude to facilitate location of noisy regions in the original display.

Abstract translation: 系统和方法利用3-D算子在三维（3-D）地震数据中识别和显示随机噪声，以减少地震结构对噪声识别的影响。 3-D运算符是使用3-D中所需性能的语句导出的。 3-D操作符在逐像素的基础上应用于3-D堆叠后数据中的每个像素以在3-D显示器中显示图像或输出基本上独立于 图像结构。 产生的显示以颜色生成以指示噪声幅度，以便于原始显示中的噪声区域的定位。

公开(公告)号：WO2008130577A1

公开(公告)日：2008-10-30

申请号：PCT/US2008/004923

申请日：2008-04-15

Applicant: SAUDI ARABIAN OIL COMPANY ,  WANG, Yuchun, Eugene ,  LUO, Yi ,  ALFARAJ, Mohammed, N.

Inventor： WANG, Yuchun, Eugene ,  LUO, Yi ,  ALFARAJ, Mohammed, N.

IPC: G06K9/40

CPC classification number: G06T5/20 ,  G06T2207/20004

Abstract: A system and method use 2D and 3D numerical gradient operators for reducing anisotropic inaccuracies in digital image processing. Enhanced isotropic operators are derived by first parameterizing corresponding numerical operators, followed by determining the parameters for the operators by matching analytical gradients with numerical gradients, which produces generic frequency-independent operators. The system and method also optimize the design of operators for use at any given frequency range needed for any special purpose application.

Abstract translation: 一种系统和方法使用2D和3D数值梯度算子来减少数字图像处理中的各向异性误差。 通过首先对相应的数值运算符进行参数化，然后通过匹配具有数值梯度的分析梯度来确定运算符的参数，从而导出增强的各向同性运算符，这产生了通用频率无关运算符。 该系统和方法还优化了用于任何特殊用途应用所需的任何给定频率范围的操作员的设计。

公开(公告)号：WO2012096678A2

公开(公告)日：2012-07-19

申请号：PCT/US2011/022138

申请日：2011-01-21

Applicant: APPLIED MATERIALS, INC. ,  XU, Kun ,  LIU, Feng ,  BENVEGNU, Dominic J. ,  SWEDEK, Boguslaw A. ,  WANG, Yuchun ,  TU, Wen-Chiang ,  KARUPPIAH, Laksh

Inventor： XU, Kun ,  LIU, Feng ,  BENVEGNU, Dominic J. ,  SWEDEK, Boguslaw A. ,  WANG, Yuchun ,  TU, Wen-Chiang ,  KARUPPIAH, Laksh

IPC: H01L21/66 ,  H01L21/8247 ,  H01L27/115

CPC classification number: H01L22/26 ,  B24B37/005 ,  B24B37/013 ,  B24B49/12 ,  C01G9/00 ,  G01B11/0625 ,  G01B11/0683 ,  H01L21/30625 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/1683

Abstract: In polishing a substrate having a layer of GST disposed over an underlying layer, during polishing, a non-polarized light beam is directed onto the layer of GST. The non-polarized light beam reflects from the first substrate to generate a reflected light beam having an infra-red component. A sequence of measurements of intensity of the infra-red component of the reflected light beam are generated, and, in a processor, a time at which the sequence of measurements exhibits a predefined feature is determined.

Abstract translation: 在抛光具有设置在下面的层上的GST层的衬底时，在抛光期间，非偏振光束被引导到GST层上。 非偏振光束从第一衬底反射以产生具有红外分量的反射光束。 产生反射光束的红外分量的强度测量序列，并且在处理器中确定测量序列呈现预定特征的时间。

公开(公告)号：WO2011094590A2

公开(公告)日：2011-08-04

申请号：PCT/US2011/022994

申请日：2011-01-28

Applicant: APPLIED MATERIALS, INC. ,  XU, Kun ,  IRAVANI, Hassan, G. ,  SWEDEK, Boguslaw, A. ,  WANG, Yuchun ,  TU, Wen-Chiang

Inventor： XU, Kun ,  IRAVANI, Hassan, G. ,  SWEDEK, Boguslaw, A. ,  WANG, Yuchun ,  TU, Wen-Chiang

IPC: H01L21/304

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B49/105 ,  H01L21/3212 ,  H01L22/14 ,  H01L22/26 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of chemical mechanical polishing a metal layer on a substrate includes polishing the metal layer on the substrate at first and second polishing stations, monitoring thickness of the metal layer during polishing at the first and second polishing station with first and second eddy current monitoring systems having different resonant frequencies, and controlling pressures applied by a carrier head to the substrate during polishing at the first and second polishing stations to improve uniformity based on thickness measurements from the first and second eddy current monitoring systems.

Abstract translation: 对衬底上的金属层进行化学机械抛光的方法包括在第一抛光站和第二抛光站处抛光衬底上的金属层，在第一抛光站和第二抛光站处对抛光期间的金属层的厚度进行监测 其中第一和第二涡流监测系统具有不同的共振频率，并且在第一和第二抛光站的抛光期间控制由承载头施加到基底的压力，以基于来自第一和第二涡流监测系统的厚度测量结果改善均匀性。

公开(公告)号：WO2010017142A2

公开(公告)日：2010-02-11

申请号：PCT/US2009/052601

申请日：2009-08-03

Applicant: APPLIED MATERIALS, INC. ,  CHANG, Shou-sung ,  CHEN, Hung Chih ,  TSAI, Stan, D. ,  WANG, Yuchun

Inventor： CHANG, Shou-sung ,  CHEN, Hung Chih ,  TSAI, Stan, D. ,  WANG, Yuchun

IPC: H01L21/304

CPC classification number: B24B37/042 ,  B24B49/02 ,  B24B53/017

Abstract: A chemical mechanical polishing apparatus includes a metrology system that detects the thickness of the polishing pad as semiconductor wafers are processed and the thickness of the polishing pad is reduced. The chemical mechanical polishing apparatus includes a controller that adjusts the rate of material removal of a conditioning disk when areas of the polishing surface are detected that are higher or lower than the adjacent areas of the polishing pad.

Abstract translation: 化学机械抛光装置包括测量系统，其在处理半导体晶片时检测抛光垫的厚度，并且抛光垫的厚度减小。 化学机械抛光装置包括控制器，当检测到比抛光垫的相邻区域更高或更低的区域时，调节调节盘的材料去除速率。

公开(公告)号：WO2010060004A4

公开(公告)日：2010-12-16

申请号：PCT/US2009065434

申请日：2009-11-23

Applicant: APPLIED MATERIALS INC ,  LIU FENG Q ,  DUBOUST ALAIN ,  TU WEN-CHIANG ,  GE CHENAHO ,  XU KUN ,  WANG YUCHUN ,  CHEN YUFEI

Inventor： LIU FENG Q ,  DUBOUST ALAIN ,  TU WEN-CHIANG ,  GE CHENAHO ,  XU KUN ,  WANG YUCHUN ,  CHEN YUFEI

IPC: C09K3/14

CPC classification number: C11D3/3947 ,  C09G1/02 ,  C09K3/1463 ,  C11D7/08 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/1683

Abstract: A CMP method for polishing a phase change alloy on a substrate surface including positioning the substrate comprising a phase change alloy material on a platen containing a polishing pad and delivering a polishing slurry to the polishing pad. The polishing slurry includes colloidal particles with a particle size less than 60 nm, in an amount between 0.2% to about 10% by weight of slurry, a pH adjustor, a chelating agent, an oxidizing agent in an amount less than 1% by weight of slurry, and polyacrylic acid. The substrate on the platen is polished to remove a portion of the phase change alloy. A rinsing solution for rinsing the substrate on the platen includes deionized water and at least one component in the deionized water where the component selected from the group consisting of polyethylene imine, polyethylene glycol, polyacrylic amide, alcohol ethoxylates, polyacrylic acid, an azole containing compound, benzo-triazole, and combinations thereof.

Abstract translation: 一种用于抛光衬底表面上的相变合金的CMP方法，包括将含有相变合金材料的衬底定位在包含抛光垫的台板上并且将抛光浆料传送到抛光垫。 抛光浆料包括粒度小于60nm的胶体粒子，其量为浆料重量的0.2％至约10％，pH调节剂，螯合剂，少于1％重量的氧化剂 浆料和聚丙烯酸。 抛光平台上的基板以去除一部分相变合金。 冲洗台板上的基材的冲洗溶液包括去离子水和去离子水中的至少一种组分，其中选自聚乙烯亚胺，聚乙二醇，聚丙烯酰胺，醇乙氧基化物，聚丙烯酸，含唑化合物 ，苯并三唑及其组合。