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    抵抗測定装置、フィルム製造装置および導電性フィルムの製造方法
    52.
    发明申请
    抵抗測定装置、フィルム製造装置および導電性フィルムの製造方法 审中-公开

    公开(公告)号：WO2019187393A1

    公开(公告)日：2019-10-03

    申请号：PCT/JP2018/046375

    申请日：2018-12-17

    Applicant: 日東電工株式会社

    Inventor： 森光　大樹

    IPC: G01R27/02 ,  C23C14/34 ,  C23C14/54 ,  C23C14/56 ,  G01R35/00

    Abstract: 抵抗測定装置は、一方向に長尺な導電性フィルムのシート抵抗を測定する抵抗測定装置であって、導電性フィルムと接触せず、導電性フィルムが介在可能なように、間隔を隔てて対向配置される２つのプローブと、２つのプローブを一方向と交差する交差方向に走査させる走査ユニットと、２つのプローブにより測定される電圧に基づいて導電性フィルムのシート抵抗を算出する演算ユニットとを備える。　演算ユニットは、導電性フィルムを介在しないで２つのプローブを交差方向に走査して測定した参照電圧を記憶するメモリを有する。　導電性フィルムを介在させて２つのプローブを交差方向に走査させて測定した実電圧を、参照電圧に基づいて補正する。

    基板成膜机台及使用方法
    54.
    发明申请
    基板成膜机台及使用方法 审中-公开

    公开(公告)号：WO2019165749A1

    公开(公告)日：2019-09-06

    申请号：PCT/CN2018/096285

    申请日：2018-07-19

    Applicant: 惠科股份有限公司 ,  重庆惠科金渝光电科技有限公司

    Inventor： 朱正良

    IPC: C23C14/56 ,  C23C14/54

    Abstract: 一种基板成膜机台及使用方法。该基板成膜机台，包括：第一基板承载进出腔（11）；第二基板承载进出腔（12）；成膜腔室（13）；中间腔室（14）；与第一基板承载进出腔（11）相连的泵组（21）；与中间腔室（14）相连的第二泵（22）；与成膜腔室（13）以及第二基板承载进出腔（12）相连的第三泵（23）；至少一个备用泵（24），设置为与成膜腔室（13）以及第二基板承载进出腔（12）相连，以在第三泵（23）损坏的情况下，抽出成膜腔室（13）以及第二基板承载进出腔（12）内的空气；或者，与中间腔室（14）相连，以在第二泵（22）损坏的情况下，抽出中间腔室（14）内的空气。

    SURFACE TREATMENT CHAMBER TRANSPORT SYSTEM
    57.
    发明申请
    SURFACE TREATMENT CHAMBER TRANSPORT SYSTEM 审中-公开

    公开(公告)号：WO2019121289A1

    公开(公告)日：2019-06-27

    申请号：PCT/EP2018/084688

    申请日：2018-12-13

    Applicant: AGC GLASS EUROPE ,  AGC FLAT GLASS NORTH AMERICA INC ,  AGC INC. ,  AGC VIDROS DO BRASIL LTDA

    Inventor： BIARD, Jean-Philippe ,  BELLET, Philippe ,  ADANS, Sébastien

    IPC: C23C14/50 ,  C23C14/56 ,  C23C16/44 ,  C23C16/458 ,  C23C16/54

    Abstract: The present invention concerns a surface treatment assembly (1) extending along a longitudinal axis, X, a vertical axis Z and a transverse axis, Y; comprising: (a) a surface treatment chamber (2); (b) a surface treatment apparatus (3) located in the coating chamber; (c) a transport system (6) suitable for carrying at least one substrate (7) in the form of a sheet, through the surface treatment chamber from an entrance to an exit of the surface treatment chamber, said transport system comprising: i) a substrate carrier (8) suitable for holding the at least one substrate in a vertical plane, (Z, X), and for carrying the substrate to be treated into at least one position with respect to the surface treatment apparatus so that a surface of the substrate may be treated; ii) a drive system (9) suitable for driving the substrate carrier from the entrance to the exit of the surface treatment chamber in the longitudinal axis, X; characterised in that the substrate carrier comprises a vertical surface portion (20), extending along a vertical plane (Z, X), on which the at least one substrate is held in a vertical plane; a top transverse surface portion (21), extending along a horizontal plane (X, Y);a bottom transverse surface portion (22), extending along a vertical plane (Z,X); and in that the substrate carrier has C-shaped cross section across a plane normal to the longitudinal axis, X; the C-shaped cross section comprising: a vertical portion (10) extending along the vertical axis, Z, from a top end to a bottom end and facing the coating apparatus; and a top transverse portion (11) and a bottom transverse portion (12), extending transverse to the top end and bottom end of the first portion, respectively; the vertical portion, the top transverse portion and the transverse bottom portion, defining an inner carrier volume (V), and in that the drive system is partially located in the inner carrier volume (V) and is suitable for coupling to the top transverse portion of the substrate carrier.

    VACUUM DEPOSITION FACILITY AND METHOD FOR COATING A SUBSTRATE
    58.
    发明申请
    VACUUM DEPOSITION FACILITY AND METHOD FOR COATING A SUBSTRATE 审中-公开

    公开(公告)号：WO2019116214A1

    公开(公告)日：2019-06-20

    申请号：PCT/IB2018/059856

    申请日：2018-12-11

    Applicant: ARCELORMITTAL

    Inventor： SILBERBERG, Eric ,  SCHMITZ, Bruno ,  PACE, Sergio ,  BONNEMANN, Rémy ,  MARNEFFE, Didier

    IPC: C23C14/24 ,  C23C14/56

    CPC classification number: C23C14/24 ,  C23C14/562 ,  C23C14/564

    Abstract: The invention relates to a vacuum deposition facility for continuously depositing, on a running substrate, coatings formed from metal or metal alloy, the facility comprising a vacuum chamber and a means for running the substrate through the vacuum chamber along a given path, wherein the vacuum chamber further comprises: - a central casing comprising a substrate entry and a substrate exit located on two opposite sides of the central casing and a vapor jet coater, the inner walls of the central casing being suited to be heated at a temperature above the condensation temperature of the metal or metal alloy vapors, - a vapor trap in the form of an external casing located at the substrate exit of the central casing, the inner walls of the vapor trap being suited to be maintained at a temperature below the condensation temperature of the metal or metal alloy vapors.

    VACUUM DEPOSITION FACILITY AND METHOD FOR COATING A SUBSTRATE
    59.
    发明申请
    VACUUM DEPOSITION FACILITY AND METHOD FOR COATING A SUBSTRATE 审中-公开

    公开(公告)号：WO2019116082A1

    公开(公告)日：2019-06-20

    申请号：PCT/IB2017/057946

    申请日：2017-12-14

    Applicant: ARCELORMITTAL

    Inventor： SILBERBERG, Eric ,  SCHMITZ, Bruno ,  PACE, Sergio ,  BONNEMANN, Rémy ,  MARNEFFE, Didier

    IPC: C23C14/24 ,  C23C14/56

    CPC classification number: C23C14/24 ,  C23C14/562 ,  C23C14/564

    Abstract: The invention relates to a vacuum deposition facility for continuously depositing, on a running substrate, coatings formed from metal or metal alloy, and comprising: - a central casing comprising a vapor jet coater, the inner walls of the central casing being suited to be heated at a temperature above the condensation temperature of the metal or metal alloy vapors, - a vapor trap located at the substrate exit of the central casing, the inner walls of the vapor trap being suited to be maintained at a temperature below the condensation temperature of the metal or metal alloy vapors, the passage linking the central casing to the vapor trap comprising at least one thermal connector extending at least from the inner walls of the central casing to the inner walls of the vapor trap.

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