Abstract:
Provided herein are methods and systems for reducing roughness of EUV resists and improving etched features. The methods may involve depositing a thin film on a patterned EUV resist having a stress level that is less compressive than a stress level of the patterned EUV resist. The resulting composite stress may reduce buckling and/or bulging of the patterned EUV resist.
Abstract:
Imaging layers on the surface of a substrate may be patterned using next generation lithographic techniques, and the resulting patterned film may be used as a lithographic mask, for example, for production of a semiconductor device.
Abstract:
Techniques, methods, systems, apparatus, and articles of manufacture that can be used for optical amplification may be particularly, though not exclusively, applicable to optical amplification using thin single crystal rods (TSCRs). Such TSCRs may be particularly useful for use in Master Oscillator - Power Amplifier systems. Use of TSCRs in such systems presents an attractive alternative to using glass fibers for ultra-short pulsing lasers with output power levels exceeding 100 W. Such systems are desirable because virtually any engineering material can be processed by ultra-short pulses and the achieved processing quality using such systems generally meets stringent quality requirements.
Abstract:
Methods of and apparatuses for processing a metal oxide film are provided. Methods involve (a) exposing the metal oxide film to a boron halide reactant and igniting a first plasma with a first bias power to modify a surface of the metal oxide film, and (b) exposing the modified surface of the metal oxide film to a second plasma at a second bias power and for a duration sufficient to remove the modified surface without sputtering. Methods also involve (c) selectively depositing a metal oxide material on the metal oxide film to fill crevices within the metal oxide film.
Abstract:
Sol-gel methods, apparatus and compositions for cladding optical fiber cores provide optical fibers, including single crystal optical fiber cores with polycrystalline cladding, having improved performance in a variety of applications, such as fiber lasers.
Abstract:
Integration of semiconductor tool maintenance operations on mobile devices enables technicians to more accurately perform semiconductor tool maintenance, and allows for more accurate collection and analysis of data so that maintenance procedures and resulting tool operations can be more repeatable, consistent and efficient.
Abstract:
This invention relates to systems and methods for manufacturers, distributors, and vendors ("suppliers") that participate in a system and method of distributing products over a network from suppliers to consumers to invite each other to share links on each other's product pages. A supplier may partner with selected suppliers so that only the products of those selected suppliers are included in the cross-traffic ads and offers on its website or product page.
Abstract:
Water activated alkali metal battery cells, protected anode bi-polar electrodes and multi-cell stacks are configurable to achieve very high energy density. The cells, bi-polar electrode and multi-cell stacks include a protected anode and a cathode having a solid phase electro-active component material that is reduced during cell discharge.
Abstract:
A photovoltaic module having a light transmissive front layer, a back layer, and a plurality of interconnected photovoltaic cells disposed between the light transmissive front layer and the back layer has a CTE-modified composite encapsulant is interposed between the plurality of solar cells and the light transmissive front layer. The composite encapsulant includes a bulk encapsulant transmissive to visible and near visible wavelengths of the solar spectrum and having a base coefficient of thermal (CTE) expansion, and an encapsulant CTE modifier in the bulk encapsulant. The encapsulant CTE modifier is substantially evenly distributed through the composite encapsulant thickness and interacts with the bulk encapsulant to reduce the effective CTE of the composite encapsulant below that of the bulk encapsulant.
Abstract:
A carrier for holding a microfluidic device includes a substrate with a plurality of wells, each well defining a volume of between 0.1 µl and 100 µl; a plurality of channels within the substrate wherein each well is in fluid communication with at least one of the plurality of channels; and a receiving portion for receiving a microfluidic device and placing the microfluidic device in fluid communication with the plurality of wells. The carrier has a polymeric composition and/or an array of structural features that enhance its performance and compatibility with existing instrumentation.