公开(公告)号：WO2005089325A3

公开(公告)日：2006-01-26

申请号：PCT/US2005008610

申请日：2005-03-14

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: B29C45/00 ,  B29C59/14 ,  H01B1/22 ,  B05D3/06 ,  C08K3/10 ,  C23C26/00

CPC classification number: B29C45/0013 ,  B29C45/0055 ,  B29C59/14 ,  B29C2059/027 ,  B29C2791/009 ,  B29K2995/0005 ,  H01B1/22

Abstract: A molded conductive loaded resin-based product is processed to reduce surface resistivity. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 处理模制的导电负载树脂基产品以降低表面电阻率。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：WO2005118244A2

公开(公告)日：2005-12-15

申请号：PCT/US2005/011943

申请日：2005-04-08

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: B29B11/00

CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0005 ,  B29C70/882 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/243 ,  H01Q1/3283 ,  H01Q1/36 ,  H01Q1/364 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/0087 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

Abstract: Mono-polar and bipolar fuel cell plates are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20 % and 50 % of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 单极和双极燃料电池板由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：WO2005114782A2

公开(公告)日：2005-12-01

申请号：PCT/US2005016598

申请日：2005-05-12

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: H01Q1/36 ,  H01Q9/28 ,  H01R39/20 ,  H02K1/02 ,  H02K3/02 ,  H02K5/02 ,  H02K11/00 ,  H02K23/26 ,  H02K23/40

CPC classification number: H02K5/02 ,  H01R39/20 ,  H02K1/02 ,  H02K3/02 ,  H02K11/01 ,  H02K23/26 ,  H02K23/40

Abstract: Electric motor components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

Abstract translation: 电动机部件由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

公开(公告)号：WO2005022604A2

公开(公告)日：2005-03-10

申请号：PCT/US2004028291

申请日：2004-08-31

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: H01L20060101 ,  H01L

CPC classification number: G09F3/10 ,  B29C47/00 ,  B29C47/0016 ,  B29C47/0021 ,  C08K3/017 ,  C08K3/04 ,  C08K3/08 ,  C09J7/22 ,  C09J9/02 ,  C09J2205/102

Abstract: Conductive labels useful for anti-static devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non­metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract translation: 用于防静电装置的导电标签由导电负载的树脂基材料形成。 导电负载树脂基材料包括微米导电粉末，导电纤维或基础树脂主体中的导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分比为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属如不锈钢，镍，铜，银，也可以是金属电镀的，或 或由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

公开(公告)号：WO2005022564A3

公开(公告)日：2005-03-10

申请号：PCT/US2004/028369

申请日：2004-08-31

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: H01B11/06

Abstract: Electromagnetic energy absorbing, shrinkable tubing (14) are formed of a conductive loaded resin-based material (32). The material (32) comprises micron conductive powders (34), conductive fiber (38), or a combination of conductive powder and conductive fibers (34 & 38) in a base resin host (30). The percentage by weight of the conductive powder (34), conductive fiber (38), or a combination (34 & 38) thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material (32). The micron conductive powders (34) are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers (38) preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

公开(公告)号：WO2005022564A2

公开(公告)日：2005-03-10

申请号：PCT/US2004028369

申请日：2004-08-31

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: B29D22/00 ,  B32B3/00 ,  B65B53/00 ,  F16L9/00 ,  F16L9/14 ,  H01B7/00 ,  H01B11/06 ,  H01F20060101 ,  H01F

CPC classification number: H05K9/009 ,  H05K9/0083

Abstract: Electromagnetic energy absorbing, shrinkable tubing are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract translation: 电磁能吸收可收缩管由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

公开(公告)号：WO2005016445A2

公开(公告)日：2005-02-24

申请号：PCT/US2004/024833

申请日：2004-08-03

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: A61N

CPC classification number: A61N1/0456 ,  A61N1/0452 ,  A61N1/046 ,  A61N1/0484 ,  A61N1/0492

Abstract: Electrical stimulators and shocking devices are formed of, a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of nonmetal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel-plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract translation: 电刺激器和冲击装置由导电负载树脂基材料形成。 导电负载树脂基材料包括基础树脂主体中的微米导电粉末，导电纤维或导电粉末与导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分比为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属例如碳，石墨（其也可以是金属电镀的等）形成，或者由诸如不锈钢，镍，铜，银的金属形成，所述金属也可以是金属电镀的，或者 类似的，或来自非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

公开(公告)号：WO2005004287A2

公开(公告)日：2005-01-13

申请号：PCT/US2004/021409

申请日：2004-07-02

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: H01R

CPC classification number: H01R13/2414 ,  H01R13/035 ,  H01R13/6599 ,  H01R43/007

Abstract: Electrical connector housings are formed of a conductive loaded resin-based material which provides superior protection from EMI and RFI by absorbing such interfering signals. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination thereof, in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 40% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non­metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract translation: 电连接器壳体由导电负载的树脂基材料形成，其通过吸收这种干扰信号而提供优于EMI和RFI的保护。 导电负载的树脂基材料在基础树脂主体中包含微米导电粉末，导电纤维或其组合。 导电粉末，导电纤维或其组合的重量百分比为导电负载树脂基材料重量的约20％至40％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属如不锈钢，镍，铜，银，也可以是金属电镀等形成 ，或由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

公开(公告)号：WO2005004286A2

公开(公告)日：2005-01-13

申请号：PCT/US2004021404

申请日：2004-07-02

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: H01C7/00 ,  H01C17/065 ,  H01R

CPC classification number: H01C7/005 ,  H01C17/06526 ,  H01C17/06586

Abstract: Resistor devices are formed of a conductive loaded resin based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The conductive materials comprise between about 20% and about 50% of the total weight of the conductive loaded resin-based material The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract translation: 电阻器件由基于导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电材料占导电负载的树脂基材料的总重量的约20％至约50％。微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀的，或 或者来自金属，例如不锈钢，镍，铜，银，其也可以是金属电镀的，或类似的，或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

公开(公告)号：WO2004114365A3

公开(公告)日：2004-12-29

申请号：PCT/US2004/011694

申请日：2004-04-15

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas ,  LARSEN, Thor, Arne

Inventor： AISENBREY, Thomas ,  LARSEN, Thor, Arne

IPC: H01L23/48

Abstract: Chip carrier with integrated functions such as antennas, EMI shields, and heat sinks are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based integrated chip carrier functions can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the integrated chip carrier functions can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.