公开(公告)号：WO2005098965A3

公开(公告)日：2006-02-23

申请号：PCT/US2005009846

申请日：2005-03-24

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: E04D1/26 ,  H01L31/00 ,  H01Q1/00 ,  H01Q1/12 ,  H01Q1/48 ,  H05K9/00 ,  H01B1/22 ,  E04C1/00 ,  G21F3/04 ,  H01B1/24

CPC classification number: E04D1/265 ,  E04D2001/005 ,  H01Q1/002 ,  H01Q1/1221 ,  H01Q1/48 ,  H05K9/0003

Abstract: Conductive roofing materials are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 导电屋顶材料由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：WO2005097485A3

公开(公告)日：2006-02-23

申请号：PCT/US2005009975

申请日：2005-03-24

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: B32B9/00 ,  B32B15/08 ,  C09J7/02 ,  C09J7/04 ,  B32B27/04 ,  B32B27/12

CPC classification number: B32B15/08 ,  B32B7/06 ,  B32B2307/202 ,  B32B2307/208 ,  B32B2405/00 ,  C09J7/21 ,  C09J7/22 ,  C09J7/29 ,  C09J2201/602 ,  C09J2400/163 ,  C09J2400/263

Abstract: Electrically conductive tapes and films are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20 % and 50 % of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 导电带和膜由导电负载的树脂基材料形成。 导电负载树脂基材料包括微米导电粉末，导电纤维或基础树脂主体中的导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分比为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属如不锈钢，镍，铜，银，也可以是金属电镀的，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：WO2005123815A2

公开(公告)日：2005-12-29

申请号：PCT/US2005/020414

申请日：2005-06-08

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: C08J7/04

CPC classification number: B29C45/0005 ,  B29C45/0013 ,  B29K2105/0023 ,  B29K2995/0005 ,  F28D1/05366 ,  F28F21/06 ,  F28F21/062 ,  Y10T29/4935 ,  Y10T29/49378

Abstract: Vehicle heat exchanger devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

Abstract translation: 车辆热交换器装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可以用作微米导电纤维和/或作为金属镀覆在纤维上。

公开(公告)号：WO2005016445A3

公开(公告)日：2005-12-22

申请号：PCT/US2004024833

申请日：2004-08-03

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: A61N1/04 ,  A61N1/18

CPC classification number: A61N1/0456 ,  A61N1/0452 ,  A61N1/046 ,  A61N1/0484 ,  A61N1/0492

Abstract: Electrical stimulators and shocking devices are formed of, a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of nonmetal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel-plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract translation: 电刺激器和冲击装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

公开(公告)号：WO2005119837A3

公开(公告)日：2005-12-15

申请号：PCT/US2005/018954

申请日：2005-05-31

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: A47J43/28 ,  H01Q1/38

Abstract: Food processing, preparation, and handling devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or :by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

公开(公告)号：WO2005098965A2

公开(公告)日：2005-10-20

申请号：PCT/US2005/009846

申请日：2005-03-24

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: H01L31/00

CPC classification number: E04D1/265 ,  E04D2001/005 ,  H01Q1/002 ,  H01Q1/1221 ,  H01Q1/48 ,  H05K9/0003

Abstract: Conductive roofing materials are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 导电屋顶材料由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：WO2004094764A3

公开(公告)日：2005-09-15

申请号：PCT/US2004011860

申请日：2004-04-16

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: E21B20060101 ,  H01G4/008 ,  H01L21/20 ,  H01L29/00

CPC classification number: H01G4/008

Abstract: Capacitors are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of nonmetal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based capacitors can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the capacitors can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

Abstract translation: 电容器由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。 导电负载的树脂基电容器可以使用诸如注射成型压缩成型或挤出的方法来形成。 用于形成电容器的导电负载树脂基材料也可以是可以容易地切割成所需形状的薄柔性机织织物的形式。

公开(公告)号：WO2005038979A3

公开(公告)日：2005-04-28

申请号：PCT/US2004/034419

申请日：2004-10-18

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: H01Q1/36

Abstract: Antennas are formed of a conductive loaded resin-based material with conductive wrapping, embedding, and/or center-fusing. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, aluminum that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

公开(公告)号：WO2005038979A2

公开(公告)日：2005-04-28

申请号：PCT/US2004034419

申请日：2004-10-18

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: H01Q20060101 ,  H01Q

CPC classification number: H01Q1/00 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/3025

Abstract: Antennas are formed of a conductive loaded resin-based material with conductive wrapping, embedding, and/or center-fusing. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, aluminum that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 天线由导电负载的树脂基材料形成，具有导电包裹，嵌入和/或中心熔化。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如可以金属镀覆的碳，石墨等，也可以是金属，例如不锈钢，镍，铜，银，铝，也可以金属镀覆， 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：WO2004114365A2

公开(公告)日：2004-12-29

申请号：PCT/US2004/011694

申请日：2004-04-15

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas ,  LARSEN, Thor, Arne

Inventor： AISENBREY, Thomas ,  LARSEN, Thor, Arne

IPC: H01L

CPC classification number: H01L23/3107 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3737 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: Chip carrier with integrated functions such as antennas, EMI shields, and heat sinks are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based integrated chip carrier functions can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the integrated chip carrier functions can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

Abstract translation: 集成功能如天线，EMI屏蔽和散热片的芯片载体由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。 导电负载的树脂基集成芯片载体功能可以使用诸如注射成型压缩成型或挤出的方法形成。 用于形成集成芯片载体功能的导电负载树脂基材料也可以是可以容易地切割成所需形状的薄柔性机织织物的形式。