Abstract:
In described examples, a channel selector (110) for use in an analog-to-digital converter (100) has a sampling circuit for converting an analog input (107) to a digital output (108) within a fault tolerance range. The channel selector (110) includes a reception channel (112), a diagnostic channel (114), and an impedance compensator (116). The reception channel (112) receives an analog signal for delivery to the sampling circuit when it is selected for coupling with the sampling circuit. The diagnostic channel (114) receives a diagnostic signal for verifying the digital output (108) of the sampling circuit when it is selected for coupling with the sampling circuit. The impedance compensator (116) is configured to offset a high channel impedance of the reception channel (112) based on the fault tolerance range of the sampling circuit and when the diagnostic channel (114) is selected.
Abstract:
In described examples, a method of operating a wireless communication system includes receiving respective downlink transmissions at N second transceivers (RUs) from a first transceiver (100), where N is a positive integer greater than 1. The reception acknowledgement signals by the N second transceivers are combined into a single reception acknowledgement signal and transmitted to the first transceiver (100).
Abstract:
In described examples, a power conversion system includes a PFM controller (245), a PWM controller (255), and an auxiliary voltage output stage (270). The PFM controller (245) controls a power output stage (260) in a PFM mode in response to a power stage voltage output generated by the power output stage (260) during a first period of time in which the power output stage (260) is operating in the PFM mode. The PWM controller (255) controls the power output stage (260) in a PWM mode in response to a power stage voltage output generated by the power output stage (260) during a second period of time in which the power output stage (260) is operating in the PWM mode. The auxiliary voltage output stage (270) generates an auxiliary voltage during a third period of time, where the PWM controller (255) controls the auxiliary voltage output stage (270) using the auxiliary voltage during the third period of time.
Abstract:
In described examples, an FLL (frequency locked loop) oscillator/clock generator (100) includes a free-running oscillator (110), which generates an FLL clk with an FLL-controlled frequency fosc- The FLL control loop includes a switched capacitor resistor divider (130) that converts fosc to a resistance, generating an FLL feedback voltage (Vfosc) to generate a loop control signal (OSC cntrl) input to the oscillator (110). In response, the oscillator frequency locks FLL clk to fosc. In an example implementation, the FLL oscillator/clock generator (100) operates with spread spectrum clocking (SSC) that provides triangular SSC modulation based on a truncated RC transition voltage generated as a negative feedback to an RC relaxation oscillator, with truncation based on switched tripping threshold voltages generated a positive feedback to the RC relaxation oscillator.
Abstract:
In described examples, a relaxation oscillator (100) reduces temperature sensitivity and phase noise at low offset frequency by periodically swapping a first current (II) and a second current (12), so that after the first current (II) has been input to a first pair of circuits (120, 140) and the second current (12) has been input to a second pair of circuits (130, 140), the second current (12) is input to the first pair of circuits (120, 140), and the first current (II) is input to the second pair of circuits (130, 140).
Abstract:
In described examples, apparatus (200) includes a controller (270) and logic circuitry (275). The controller (270) is configured to generate multiple single-bit logic values. Each single-bit logic value has one of: (a) a first value indicating that a data packet has been written into a memory (210); and (b) a second value indicating that a data packet has been read from the memory (210). The logic circuitry (275) is configured to serially stack the single-bit logic values. The apparatus (200) could further include a shift memory bank (280) configured to store the single-bit logic values. The logic circuitry (275) can be configured to serially stack the single-bit logic values in the shift memory bank (280). For example, the logic circuitry (275) can be configured to shift the single-bit logic values in the shift memory bank (280) in different directions and insert one single -bit logic value into the memory bank at different ends depending on whether the one logic value has the first or second value.
Abstract:
In described examples, a segmented bipolar transistor (100) includes a p-base in a semiconductor surface (106) including at least one p-base finger (140) having a base metal/silicide stack including a base metal line that contacts a silicide layer (159) on the semiconductor surface of the p-base finger (140). An n+ buried layer (126) is under the p-base. A collector includes an n+ sinker (115) extending from the semiconductor surface to the n+ buried layer (126) including a collector finger having a collector metal/silicide stack including a collector metal line that contacts a silicide layer on the semiconductor surface of the collector finger. An n+ emitter (150) has at least one emitter finger including an emitter metal/silicide stack that contacts the silicide layer (159) on the semiconductor surface of the emitter finger. The emitter metal/silicide stack and/or collector metal/silicide stack include segmentation with a gap (150c), which cuts a metal line and/or the silicide layer of the stack.
Abstract translation:在所描述的示例中,分段双极晶体管(100)在半导体表面(106)中包括p基极,包括至少一个具有基底金属/硅化物堆叠的p基指(140),所述基底金属/硅化物堆叠包括接触硅化物 (140)的半导体表面上的层(159)。 n +掩埋层(126)位于p基底之下。 收集器包括从半导体表面延伸到n +掩埋层(126)的n +沉降片(115),其包括具有集电极金属/硅化物堆叠的集电极指状物,所述集电极金属/硅化物堆叠包括与集电极的半导体表面上的硅化物层接触的集电极金属线 手指。 n +发射极(150)具有至少一个发射极指,其包括与发射极指状物的半导体表面上的硅化物层(159)接触的发射极金属/硅化物堆叠。 发射极金属/硅化物堆叠和/或集电极金属/硅化物堆叠包括具有间隙(150c)的分割,其切割叠层的金属线和/或硅化物层。
Abstract:
Described examples include an inductive gear sensing system suitable for sensing gear (gear tooth) movement, such as a combination of speed, direction and position, based on differential sensor response waveforms. Example embodiments of inductive gear sensing with differential sensor response for different gear (10) configurations include generating differential pulsed/phased sensor response signals from dual differential sensors (101, 102) based on axial (proximity-type) sensing, and generating asymmetrical response signals from a single sensor based on lateral and axial sensing with either asymmetrical gear teeth or an asymmetrical sensor or a combination of both.
Abstract:
In described examples, an integrated circuit (IC) (100) includes input/output (I/O) terminals (106) through which signals pass into or out of the IC (100). Also, the IC (100) includes an I/O timing module (102) configured to add propagation delay to signals passing between the I/O terminals (106) and I/O subsystems (104) of the IC (100). The I/O timing module (102) includes delay elements associated with each of the I/O terminals (106), a control register associated with each of the I/O terminals (106), a memory, and I/O delay control logic. The control register is coupled to each of the delay elements associated with the I/O terminal (106). The memory is encoded with delay information. The I/O delay control logic is configured to initialize the propagation delay associated with each of the I/O terminals (106) by selecting which of the delay elements are to be applied to produce the propagation delay based on the delay information stored in the memory.
Abstract:
In described examples, an integrated circuit (100) is formed to include a first MOS transistor (104) having a first polarity and a second MOS transistor (106) having a second, opposite, polarity. A layer of silicon-doped boron nitride (136) is formed over the first MOS transistor (104) and the second MOS transistor (106). The layer of silicon-doped boron nitride (136) is removed from over the first MOS transistor (104). Epitaxial source and drain regions (156) are formed adjacent to spacers (146) of the first MOS transistor (104).