Abstract:
A hydrostatic pad for use in holding a semiconductor wafer during grinding of the wafer by grinding wheels. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.
Abstract:
The invention relates to a method for surface working of a body (2) having a first surface (2.1) to be worked and a second surface (2.2) to be worked. The method comprises, in a first step, providing a first tool (3.1) and a second tool (4.1), in a second step, placing the body (2) between the first tool (3.1) and the second tool (4.1), and, in a third step, working the first surface (2.1) and the second surface (2.2). The first surface (2.1) is worked by a first working surface (3.6) of the first tool (3.1), the first working surface (3.6) having a first central area (3.8). The second surface (2.2) is worked by a second working surface (4.6) of the second tool (4.1), the second working surface (4.6) having a second central area (4.8). In the third step, the second tool (4.1) lies opposite to the first tool (4.1) to form a working gap (1.1), the working gap (1.1) mainly extending in a working gap plane. Furthermore, in the third step, the body (2), in at least one guide movement, is guided substantially parallel to the working gap plane between the first tool (3.1) and the second tool (4.1), and at least a part of at least one of the first surface (2.1) and the second surface (2.2) is guided over the central area (3.8, 4.8) of the associated one of the first working surface (3.6) and the second working surface (4.6). The invention further relates to a corresponding device (1) for surface working.
Abstract:
A resurfacing pad (50) that adheres to a normal brake pad (40) of a braking assembly to resurface a braking surface (28) of a brake member (26), and then automatically permits continued functioning of the normal brake pad (40). The resurfacing is accomplished by employing the components of the braking assembly. The resurfacing pad (50) includes a substrate (54) that mounts to the normal brake pad (40). The substrate (54) supports abrasive particles (56) for removing braking surface materials to resurface the brake member (26). The resurfacing pad (50) adheres to the brake pad (40) until completing the resurfacing process, then degrades to expose the normal brake pad (40) and resume normal braking operation.
Abstract:
A double side grinding device, comprising a pair of grinding wheels (4), a work rotating device (1), and a moving device (2), wherein each ground surface (4a) is brought into contact with a processed surface (a) on both sides of a work (W) so that the outer periphery of the work (W) crosses the outer periphery of each grinding wheel (4) and the center (c) of the work (W) is positioned inside each ground surface (4a) and is cut up to a specified position and, the cutting by each grinding wheel (4) is stopped and each grinding wheel (4) and the work (W) are moved, by the moving device (2), relatively in parallel with the processed surface (a) until the center (c) of the work (W) is disengaged from each ground surface (4a) so as to separate each ground surface (4a) from the processed surface (a), whereby both sides of a thin disk work can be ground simultaneously and easily by a small device, and also a variation in work thickness after grinding can be reduced.
Abstract:
A method of polishing the double sides of a plurality of works simultaneously by rotating a plurality of carriers between upper and lower rotating surface plates, comprising the steps of forming the works (400) integrally with the carriers (500) on the outside of a polishing device main body (110), feeding the works (400) onto a rotating surface plate (111) on the underside of the polishing device main body (110) with the works formed integrally with the carriers (500), injecting liquid such as water from the upper side rotating surface plate when the upper side rotating surface plate is raised after the double sides are polished, holding the plurality of works (400) on the lower side rotating surface plate (111) after the double sides are polished, enabling the works (400) to be discharged automatically from the lower side rotating surface plate (111), providing a brush storage part (180) and a dresser storage part (190) near the polishing device main body (110), and frequently treating a polishing cloth installed on the opposed surfaces of the upper and lower rotating surface plates with a brush and a dresser.
Abstract:
A polishing machine (10) includes a platform assembly (60) mounted within three support columns (32, 34, 36). The platform assembly (60) includes fluidically pressurized bladders (102, 104) for urging the upper polish plate (20) toward and away from the lower polish plate (26). In one embodiment a movable support column (70) is suspended from an overlying frame (38). The support column (70) is engaged with the upper polish plate (20) so as to selectively raise and lower the platform assembly (60). In another embodiment, the platform (66) is raised and lowered by threaded shafts (212, 214) so as to engage and thereby displace the upper polish plate (20).
Abstract:
An apparatus for polishing one or more planar substrates, such as magnetic disks, between rotating polishing plates is described. The apparatus is designed to optimize uniformity and flatness of the substrates by maintaining a substantially constant parallel and coaxial alignment between the rotating polishing plates.
Abstract:
An indexable cutting insert for metal machining comprises a rake surface (5), a bottom surface (6) and side surfaces (7) that extend between said two surfaces, cutting edges (10) being formed at the transitions between the side surfaces and the rake surface. Along the cutting edges on the rake surface are elongated primary lands (11) and inside these chip-breaking depressions (9). In order to make possible a grinding of the cutting edges on the rake surface, it is provided with a land area (12) to be ground inside the chip breaker (9), so that the total grinding area of the rake surface becomes about as large as the total grinding area of the bottom surface.
Abstract:
A disc brake assembly includes a disc (50) having an axis of rotation (51), a radial inner portion (54) and a radial outer portion (55) separated by a continuous circumferential gap (56). Brake pad assemblies (11, 12) are located on respective sides of the disc (50), each engageable with both of the raidal inner and outer portions (54, 55). A piston cylinder assembly having a piston (26) and a cylinder (24) is provided for movement of the brake pad assemblies (11, 12) into engagement with the disc (50). The cylinder (24) is connected to the inboard pad assembly (11) and a draw bar (29), which extends co-axially with the axis of movement of the piston cylinder assembly through the gap (56), connects the piston (26) to the outboard pad assembly (12).
Abstract:
In the texturing unit (10) of this invention a data storage disk (11) is gripped between a pair of opposed, counter-rotating cylindrical abrasive mandrels (12), which are covered with soft, porous pads (21). The frictional force between the disk (11) and the pads (21) raises the edge of the disk (11) against a pair of driven rollers (17) which impart a rotational motion to the disk (11). A texture pattern of uniform grooves, having controlled peak heights and valley depths, is formed simultaneously on both sides of the disk (11). A system for delivering an abrasive slurry to the pads includes a closed loop in which the slurry is recirculated and a dispense section of that loop, from which a blast of pressurized air periodically expels the slurry through applicators (18) and onto the pads (21). The continuous recirculation of the slurry prevents settling. A unique feature is that the groove length may be controlled by adjusting the ratio between the rotational speeds of the disk and mandrels. The groove patterns is primarily circular but a radial component may be added by varying the position at which the pads (21) contact the surfaces of the disk (11).