WAFER CLAMPING DEVICE FOR A DOUBLE SIDE GRINDER
    81.
    发明申请
    WAFER CLAMPING DEVICE FOR A DOUBLE SIDE GRINDER 审中-公开
    双面磨床的水平夹紧装置

    公开(公告)号:WO2005095054A1

    公开(公告)日:2005-10-13

    申请号:PCT/US2005/001732

    申请日:2005-01-20

    CPC classification number: B24B7/228 B24B7/17 B24B37/08 B24B37/28 B24B41/061

    Abstract: A hydrostatic pad for use in holding a semiconductor wafer during grinding of the wafer by grinding wheels. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.

    Abstract translation: 一种静压垫,用于在通过研磨轮磨削晶片时保持半导体晶片。 衬垫包括形成在与晶片直接相对的身体的表面中的静水压凹坑。 凹穴适于接收流体通过主体并进入凹穴,以在主体面和工件之间提供阻挡物,同时在研磨期间仍然施加压力以保持工件。 静压垫允许晶片相对于垫围绕其公共轴线旋转。 当砂轮相对于静液压垫移动或倾斜时,袋被定向成减小在晶片中产生的流体静力弯矩,有助于防止通常由砂轮的移动和倾斜引起的晶片表面的纳米拓扑降解。

    DEVICE AND METHOD FOR SURFACE WORKING
    82.
    发明申请
    DEVICE AND METHOD FOR SURFACE WORKING 审中-公开
    表面处理的装置和方法

    公开(公告)号:WO2005058544A1

    公开(公告)日:2005-06-30

    申请号:PCT/EP2004/014418

    申请日:2004-12-17

    CPC classification number: B24B37/08 B24B7/17 B24B13/015

    Abstract: The invention relates to a method for surface working of a body (2) having a first surface (2.1) to be worked and a second surface (2.2) to be worked. The method comprises, in a first step, providing a first tool (3.1) and a second tool (4.1), in a second step, placing the body (2) between the first tool (3.1) and the second tool (4.1), and, in a third step, working the first surface (2.1) and the second surface (2.2). The first surface (2.1) is worked by a first working surface (3.6) of the first tool (3.1), the first working surface (3.6) having a first cen­tral area (3.8). The second surface (2.2) is worked by a second working surface (4.6) of the second tool (4.1), the second working surface (4.6) having a second central area (4.8). In the third step, the second tool (4.1) lies opposite to the first tool (4.1) to form a working gap (1.1), the working gap (1.1) mainly extending in a working gap plane. Furthermore, in the third step, the body (2), in at least one guide movement, is guided substantially parallel to the working gap plane between the first tool (3.1) and the second tool (4.1), and at least a part of at least one of the first surface (2.1) and the second surface (2.2) is guided over the central area (3.8, 4.8) of the associated one of the first working surface (3.6) and the second working surface (4.6). The invention further relates to a corresponding device (1) for surface working.

    Abstract translation: 本发明涉及具有待加工的第一表面(2.1)和待加工的第二表面(2.2)的主体(2)的表面加工方法。 该方法包括在第一步骤中提供第一工具(3.1)和第二工具(4.1),在第二步骤中,将主体(2)放置在第一工具(3.1)和第二工具(4.1)之间, 并且在第三步骤中,对第一表面(2.1)和第二表面(2.2)进行加工。 第一表面(2.1)由第一工具(3.1)的第一工作表面(3.6)加工,第一工作表面(3.6)具有第一中心区域(3.8)。 第二表面(2.2)由第二工具(4.1)的第二工作表面(4.6)加工,第二工作表面(4.6)具有第二中心区域(4.8)。 在第三步骤中,第二工具(4.1)与第一工具(4.1)相对,以形成工作间隙(1.1),工作间隙(1.1)主要在工作间隙平面内延伸。 此外,在第三步骤中,主体(2)在至少一个引导运动中基本上平行于第一工具(3.1)和第二工具(4.1)之间的工作间隙平面引导,并且至少部分 第一表面(2.1)和第二表面(2.2)中的至少一个被引导到第一工作表面(3.6)和第二工作表面(4.6)中相关联的一个的中心区域(3.8,4.8)上。 本发明还涉及用于表面加工的对应装置(1)。

    BRAKE RESURFACER AND METHODS OF RESURFACING A BRAKE ROTOR AND DRUM
    83.
    发明申请
    BRAKE RESURFACER AND METHODS OF RESURFACING A BRAKE ROTOR AND DRUM 审中-公开
    制动压路机和重新制动制动转子和鼓的方法

    公开(公告)号:WO2003106107A1

    公开(公告)日:2003-12-24

    申请号:PCT/US2002/018779

    申请日:2002-06-14

    CPC classification number: B24D7/14 B24B7/17 B24B19/28 F16D65/0037

    Abstract: A resurfacing pad (50) that adheres to a normal brake pad (40) of a braking assembly to resurface a braking surface (28) of a brake member (26), and then automatically permits continued functioning of the normal brake pad (40). The resurfacing is accomplished by employing the components of the braking assembly. The resurfacing pad (50) includes a substrate (54) that mounts to the normal brake pad (40). The substrate (54) supports abrasive particles (56) for removing braking surface materials to resurface the brake member (26). The resurfacing pad (50) adheres to the brake pad (40) until completing the resurfacing process, then degrades to expose the normal brake pad (40) and resume normal braking operation.

    Abstract translation: 一种粘贴在制动组件的正常制动衬块(40)上以重新制动制动件(26)的制动表面(28),然后自动允许正常制动衬块(40)继续运转的表面覆层(50) 。 通过采用制动组件的部件来实现表面重铺。 表面覆层(50)包括安装到普通制动衬块(40)的衬底(54)。 衬底(54)支撑磨料颗粒(56),用于去除制动表面材料以重新制造制动构件(26)。 表面覆层(50)粘附到制动衬块(40)直到完成表面重新涂覆处理,然后劣化以暴露正常制动衬块(40)并恢复正常的制动操作。

    METHOD AND DEVICE FOR GRINDING DOUBLE SIDES OF THIN DISK WORK
    84.
    发明申请
    METHOD AND DEVICE FOR GRINDING DOUBLE SIDES OF THIN DISK WORK 审中-公开
    用于研磨薄盘工作双面的方法和装置

    公开(公告)号:WO01021356A1

    公开(公告)日:2001-03-29

    申请号:PCT/JP2000/006250

    申请日:2000-09-13

    CPC classification number: B24B7/17 B24B7/228

    Abstract: A double side grinding device, comprising a pair of grinding wheels (4), a work rotating device (1), and a moving device (2), wherein each ground surface (4a) is brought into contact with a processed surface (a) on both sides of a work (W) so that the outer periphery of the work (W) crosses the outer periphery of each grinding wheel (4) and the center (c) of the work (W) is positioned inside each ground surface (4a) and is cut up to a specified position and, the cutting by each grinding wheel (4) is stopped and each grinding wheel (4) and the work (W) are moved, by the moving device (2), relatively in parallel with the processed surface (a) until the center (c) of the work (W) is disengaged from each ground surface (4a) so as to separate each ground surface (4a) from the processed surface (a), whereby both sides of a thin disk work can be ground simultaneously and easily by a small device, and also a variation in work thickness after grinding can be reduced.

    Abstract translation: 一种双面研磨装置,包括一对砂轮(4),工件旋转装置(1)和移动装置(2),其中每个地面(4a)与处理表面(a)接触, 在工件(W)的两侧使工件(W)的外周与每个砂轮(4)的外周交叉,并且工件(W)的中心(c)位于每个地面内 4a)并被切割到指定位置,并且通过移动装置(2)停止由每个砂轮(4)进行的切割并且每个砂轮(4)和工件(W)相对平行地移动 与处理过的表面(a)直到工件(W)的中心(c)从每个地表面(4a)脱离,从而将每个地面(4a)与处理过的表面(a)分开,由此 可以通过小型装置同时且容易地研磨薄盘作业,并且还可以减少研磨后的工作厚度的变化。

    METHOD AND DEVICE FOR POLISHING DOUBLE SIDES
    85.
    发明申请
    METHOD AND DEVICE FOR POLISHING DOUBLE SIDES 审中-公开
    用于抛光双面的方法和装置

    公开(公告)号:WO00069597A1

    公开(公告)日:2000-11-23

    申请号:PCT/JP2000/003159

    申请日:2000-05-17

    CPC classification number: B24B37/08 B24B7/17 B24B41/005 B24B53/017

    Abstract: A method of polishing the double sides of a plurality of works simultaneously by rotating a plurality of carriers between upper and lower rotating surface plates, comprising the steps of forming the works (400) integrally with the carriers (500) on the outside of a polishing device main body (110), feeding the works (400) onto a rotating surface plate (111) on the underside of the polishing device main body (110) with the works formed integrally with the carriers (500), injecting liquid such as water from the upper side rotating surface plate when the upper side rotating surface plate is raised after the double sides are polished, holding the plurality of works (400) on the lower side rotating surface plate (111) after the double sides are polished, enabling the works (400) to be discharged automatically from the lower side rotating surface plate (111), providing a brush storage part (180) and a dresser storage part (190) near the polishing device main body (110), and frequently treating a polishing cloth installed on the opposed surfaces of the upper and lower rotating surface plates with a brush and a dresser.

    Abstract translation: 一种通过在上下旋转表面板之间旋转多个载体同时抛光多个工件的双面的方法,包括以下步骤:在抛光的外侧与载体(500)一体地形成工件(400) 装置主体(110),将工件(400)馈送到抛光装置主体(110)的下侧上的旋转表面板(111)上,其中与载体(500)一体形成的工件,喷射诸如水的液体 在双面抛光后,当上侧旋转面板升高时,从上侧旋转面板将双面抛光后的多个工件(400)保持在下侧旋转面板(111)上, 工件(400)从下侧旋转面板(111)自动排出,在抛光装置主体(110)附近提供刷存储部(180)和修整器收纳部(190),经常处理 用刷子和修整器安装安装在上下旋转表面板的相对表面上的抛光布。

    POLISHING APPARATUS
    86.
    发明申请
    POLISHING APPARATUS 审中-公开
    抛光装置

    公开(公告)号:WO99056910A1

    公开(公告)日:1999-11-11

    申请号:PCT/US1999/008006

    申请日:1999-04-13

    CPC classification number: B24B7/228 B24B7/17

    Abstract: A polishing machine (10) includes a platform assembly (60) mounted within three support columns (32, 34, 36). The platform assembly (60) includes fluidically pressurized bladders (102, 104) for urging the upper polish plate (20) toward and away from the lower polish plate (26). In one embodiment a movable support column (70) is suspended from an overlying frame (38). The support column (70) is engaged with the upper polish plate (20) so as to selectively raise and lower the platform assembly (60). In another embodiment, the platform (66) is raised and lowered by threaded shafts (212, 214) so as to engage and thereby displace the upper polish plate (20).

    Abstract translation: 抛光机(10)包括安装在三个支撑柱(32,34,36)内的平台组件(60)。 平台组件(60)包括用于将上抛光板(20)朝向和远离下抛光板(26)推动的流体加压气囊(102,104)。 在一个实施例中,可移动支撑柱(70)从上覆框架(38)悬挂。 支撑柱(70)与上抛光板(20)接合,以便选择地升高和降低平台组件(60)。 在另一个实施例中,平台(66)通过螺纹轴(212,214)升高和降低,从而接合并从而使上抛光板(20)移位。

    APPARATUS FOR POLISHING PLANAR SUBSTRATES BETWEEN ROTATING PLATES
    87.
    发明申请
    APPARATUS FOR POLISHING PLANAR SUBSTRATES BETWEEN ROTATING PLATES 审中-公开
    用于抛光旋转板之间的平面基板的设备

    公开(公告)号:WO1998019301A1

    公开(公告)日:1998-05-07

    申请号:PCT/US1997019710

    申请日:1997-10-28

    Abstract: An apparatus for polishing one or more planar substrates, such as magnetic disks, between rotating polishing plates is described. The apparatus is designed to optimize uniformity and flatness of the substrates by maintaining a substantially constant parallel and coaxial alignment between the rotating polishing plates.

    Abstract translation: 描述了用于在旋转的抛光板之间抛光一个或多个平面基板(例如磁盘)的装置。 该设备被设计成通过保持旋转的抛光板之间基本上恒定的平行和同轴对准来优化基板的均匀性和平坦度。

    GRINDED CUTTING INSERT
    88.
    发明申请
    GRINDED CUTTING INSERT 审中-公开
    磨削切割刀

    公开(公告)号:WO1997028919A1

    公开(公告)日:1997-08-14

    申请号:PCT/SE1997000201

    申请日:1997-02-10

    Abstract: An indexable cutting insert for metal machining comprises a rake surface (5), a bottom surface (6) and side surfaces (7) that extend between said two surfaces, cutting edges (10) being formed at the transitions between the side surfaces and the rake surface. Along the cutting edges on the rake surface are elongated primary lands (11) and inside these chip-breaking depressions (9). In order to make possible a grinding of the cutting edges on the rake surface, it is provided with a land area (12) to be ground inside the chip breaker (9), so that the total grinding area of the rake surface becomes about as large as the total grinding area of the bottom surface.

    Abstract translation: 用于金属加工的可转位切削刀片包括在所述两个表面之间延伸的前刀面(5),底表面(6)和侧表面(7),切割刃(10)形成在侧表面和 耙面。 沿着前刀面的切削刃是细长的主凸台(11)并且在这些断屑凹部(9)内。 为了能够对前刀面上的切削刃进行磨削,在切削刃(9)的内部设置有被研磨的区域(12),使得前刀面的总研磨面积变为约 作为底面的总研磨面积大。

    A DISC BRAKE ASSEMBLY
    89.
    发明申请
    A DISC BRAKE ASSEMBLY 审中-公开
    碟形刹车装置

    公开(公告)号:WO1995017612A1

    公开(公告)日:1995-06-29

    申请号:PCT/AU1994000787

    申请日:1994-12-22

    Abstract: A disc brake assembly includes a disc (50) having an axis of rotation (51), a radial inner portion (54) and a radial outer portion (55) separated by a continuous circumferential gap (56). Brake pad assemblies (11, 12) are located on respective sides of the disc (50), each engageable with both of the raidal inner and outer portions (54, 55). A piston cylinder assembly having a piston (26) and a cylinder (24) is provided for movement of the brake pad assemblies (11, 12) into engagement with the disc (50). The cylinder (24) is connected to the inboard pad assembly (11) and a draw bar (29), which extends co-axially with the axis of movement of the piston cylinder assembly through the gap (56), connects the piston (26) to the outboard pad assembly (12).

    Abstract translation: 盘式制动器组件包括具有旋转轴线(51)的盘(50),径向内部部分(54)和由连续圆周间隙(56)分开的径向外部部分(55)。 制动衬块组件(11,12)位于盘(50)的相应侧上,每一个可与两个内部和外部部分(54,55)接合。 提供具有活塞(26)和气缸(24)的活塞气缸组件,用于使制动衬块组件(11,12)与盘(50)接合。 气缸(24)连接到内侧衬垫组件(11),并且与活塞气缸组件通过间隙(56)的运动轴线同轴地延伸的牵引杆(29)将活塞(26) )到外侧垫组件(12)。

    SYSTEM AND METHOD FOR TEXTURING MAGNETIC DATA STORAGE DISKS
    90.
    发明申请
    SYSTEM AND METHOD FOR TEXTURING MAGNETIC DATA STORAGE DISKS 审中-公开
    用于纹理磁性数据存储盘的系统和方法

    公开(公告)号:WO1993017829A2

    公开(公告)日:1993-09-16

    申请号:PCT/US1993001510

    申请日:1993-02-25

    CPC classification number: G11B5/82 B24B7/17 B24B37/08 B82Y10/00 G11B5/743

    Abstract: In the texturing unit (10) of this invention a data storage disk (11) is gripped between a pair of opposed, counter-rotating cylindrical abrasive mandrels (12), which are covered with soft, porous pads (21). The frictional force between the disk (11) and the pads (21) raises the edge of the disk (11) against a pair of driven rollers (17) which impart a rotational motion to the disk (11). A texture pattern of uniform grooves, having controlled peak heights and valley depths, is formed simultaneously on both sides of the disk (11). A system for delivering an abrasive slurry to the pads includes a closed loop in which the slurry is recirculated and a dispense section of that loop, from which a blast of pressurized air periodically expels the slurry through applicators (18) and onto the pads (21). The continuous recirculation of the slurry prevents settling. A unique feature is that the groove length may be controlled by adjusting the ratio between the rotational speeds of the disk and mandrels. The groove patterns is primarily circular but a radial component may be added by varying the position at which the pads (21) contact the surfaces of the disk (11).

    Abstract translation: 在本发明的纹理单元(10)中,数据存储盘(11)被夹在一对相对的反向旋转的圆柱形磨料心轴(12)之间,其被柔软的多孔垫(21)覆盖。 盘(11)和垫(21)之间的摩擦力将盘(11)的边缘抵靠一个向盘(11)施加旋转运动的从动辊(17)升高。 在盘(11)的两侧同时形成具有受控的峰高和谷深的均匀凹槽的纹理图案。 用于将磨料浆料输送到衬垫的系统包括闭合回路,其中浆料被再循环,并且该循环的分配部分,加压空气鼓风从该循环周期性地排出浆料通过施加器(18)并排到衬垫(21)上 )。 浆料的连续再循环防止沉降。 一个独特的特征是可以通过调节盘和心轴的转速之间的比例来控制槽长度。 凹槽图案主要是圆形的,但是可以通过改变焊盘(21)接触盘(11)的表面的位置来添加径向分量。

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