公开(公告)号：WO2021246133A1

公开(公告)日：2021-12-09

申请号：PCT/JP2021/018329

申请日：2021-05-14

Applicant: 奥野製薬工業株式会社

Inventor： 今井　第造 ,  杉岡　駿 ,  長尾　敏光 ,  片山　順一

IPC: C25D7/06 ,  C25D19/00 ,  C25D17/00 ,  C25D3/12 ,  C25D3/30 ,  C25D3/38

Abstract: 断続的電気めっきにおける微小孔のフィリング性を向上させる技術を提供すること。　多価金属イオンを含有するめっき液を使用することを含む、微小孔を有する被めっき物に対する断続的電気めっき方法。

公开(公告)号：WO2021245766A1

公开(公告)日：2021-12-09

申请号：PCT/JP2020/021687

申请日：2020-06-02

Applicant: 奥野製薬工業株式会社

Inventor： 今井　第造 ,  杉岡　駿 ,  長尾　敏光 ,  片山　順一

IPC: C25D3/12 ,  C25D3/30 ,  C25D3/38 ,  C25D7/06 ,  C25D17/00

Abstract: 断続的電気めっきにおける微小孔のフィリング性を向上させる技術を提供すること。　多価金属イオンを含有するめっき液を使用することを含む、微小孔を有する被めっき物に対する断続的電気めっき方法。

公开(公告)号：WO2021236398A1

公开(公告)日：2021-11-25

申请号：PCT/US2021/032072

申请日：2021-05-12

Applicant: LAM RESEARCH CORPORATION

Inventor： OBERST, Justin ,  BUCKALEW, Bryan L. ,  PONNUSWAMY, Thomas Anand ,  MAYER, Steven T. ,  BANIK, II, Stephen J.

IPC: C25D7/12 ,  C25D5/48 ,  C25D5/02 ,  H01L21/768 ,  H01L21/288 ,  H01L21/02 ,  H01L21/67 ,  C25D3/38

Abstract: Nanotwinned copper and non-nanotwinned copper may be electroplated to form mixed crystal structures such as 2-in-1 copper via and RDL structures or 2-in-1 copper via and pillar structures. Nanotwinned copper may be electroplated on a non-nanotwinned copper layer by pretreating a surface of the non-nanotwinned copper layer with an oxidizing agent or other chemical reagent. Alternatively, nanotwinned copper may be electroplated to partially fill a recess in a dielectric layer, and non-nanotwinned copper may be electroplated over the nanotwinned copper to fill the recess. Copper overburden may be subsequently removed.

公开(公告)号：WO2021197950A1

公开(公告)日：2021-10-07

申请号：PCT/EP2021/057522

申请日：2021-03-24

Applicant: BASF SE

Inventor： ARNOLD, Marco ,  FLUEGEL, Alexander ,  EMNET, Charlotte ,  ENGELHARDT, Nadine

IPC: C08G73/02 ,  C09D179/02 ,  C25D3/38 ,  H01L21/288 ,  H01L21/768 ,  H05K3/42 ,  C25D7/12 ,  H01L23/00 ,  C08K3/08 ,  C08G73/0286 ,  C08G73/0293 ,  C25D7/123 ,  H01L2224/02311 ,  H01L2224/0239 ,  H01L2224/03462 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L24/02 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2924/3656

Abstract: The present invention provides a composition comprising copper ions, an acid, and at least one polyaminoamide comprising, a group of formula (L1) [A-B-A'-Z]n[Y-Z]m (L1) wherein B is a diacid fragment of formula (L2) A, A' are amine fragments independently selected from formula (L3a) or of Formula (L3b) Y is a co-monomer fragment; Z is a coupling fragment of formula (L4) n is an integer of from 1 to 400; m is 0 or an integer of from 1 to 400;

公开(公告)号：WO2021101176A1

公开(公告)日：2021-05-27

申请号：PCT/KR2020/015965

申请日：2020-11-13

Applicant: 에스케이넥실리스 주식회사

Inventor： 김승민 ,  정인수 ,  김영태 ,  전상현

IPC: C25D1/04 ,  C23C28/00 ,  H01M4/66 ,  H01M4/13 ,  C23C22/24 ,  C25D3/38 ,  H01M10/052

Abstract: 본 발명의 일 실시예는, 전해동박에 있어서, 구리층을 포함하고, 0.8 내지 12.5의 밸리 평균 러프니스(Valley Mean Roughness), 0.49 내지 1.28의 (220)면 집합조직계수[TC(220)], 25 내지 51 kgf/mm2의 인장강도, 및 3% 이하의 폭 방향 중량편차를 갖는 전해동박을 제공한다.

公开(公告)号：WO2021066412A1

公开(公告)日：2021-04-08

申请号：PCT/KR2020/013100

申请日：2020-09-25

Applicant: 한국재료연구원

Inventor： 최승희 ,  한명진 ,  김만 ,  유병욱 ,  이규환 ,  이주열 ,  권영환

IPC: G01N27/30 ,  G01N27/333 ,  G01N27/404 ,  G01N27/416 ,  C25D3/38

Abstract: 본 발명은 도금공정 중 도금액에 포함된 도금 첨가제의 분해 산물인 일가 구리이온(Cu+), 3-머캡토프로필 설포네이트(3-mercaptopropyl sulfonate, MPS), 또는 Cu+-MPS의 농도를 직접적으로 연속하여 측정할 수 있는 측정방법, 전기화학적 측정 셀, 및 측정 장치에 관한 것이다.

公开(公告)号：WO2021031507A1

公开(公告)日：2021-02-25

申请号：PCT/CN2020/000184

申请日：2020-08-19

Applicant: COMPASS TECHNOLOGY COMPANY LIMITED

Inventor： KELVIN, Po Leung Pun ,  CHEE, Wah Cheung

IPC: H01L23/498 ,  H01L23/14 ,  H01L21/48 ,  C23C18/50 ,  C25D3/38 ,  C25D5/02 ,  B23K26/382

Abstract: A method to produce a substrate suitable for diffusion bonding is described. A flexible dielectric substrate is provided. An alkaline modification is applied to the dielectric substrrate to form a polyamic acid (PAA) anchoring layer on a surface of the dielectric substrate. A Ni-P seed layer is elecrolessly plated on the PAA layer. Copper traces are plated within a photoresist pattern on the Ni-P seed layer. A surface finishing layer is electrolytically plated on the copper traces. The photoresist pattern and Ni-P seed layer not covered by the copper traces are removed to complete the substrate suitable for diffusion bonding.

公开(公告)号：WO2020181875A1

公开(公告)日：2020-09-17

申请号：PCT/CN2019/127447

申请日：2019-12-23

Applicant: 华东理工大学 ,  百合花集团股份有限公司

Inventor： 王利民 ,  王康 ,  王峰 ,  王桂峰 ,  李俊 ,  何玉龙 ,  王小敏 ,  玛丽亚 ,  田禾 ,  陈立荣 ,  韩建伟 ,  黄卓

IPC: C07D487/04 ,  C25D3/38

Abstract: 本发明公开了一种杂环吡咯并吡咯二酮季铵盐类化合物，结构式如通式B所示：(B) 各取代基定义详见说明书。本发明的杂环吡咯并吡咯二酮季铵盐类化合物具有良好的电镀性能，可以作为季铵盐类整平剂用于酸性电镀铜。

公开(公告)号：WO2020123322A2

公开(公告)日：2020-06-18

申请号：PCT/US2019/065111

申请日：2019-12-07

Applicant: LAM RESEARCH CORPORATION

Inventor： BANIK, Stephen J. II ,  OBERST, Justin ,  THORKELSSON, Kari ,  BUCKALEW, Bryan, L. ,  PONNUSWAMY, Thomas Anand

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/48 ,  H01L23/50 ,  C25D17/001 ,  C25D17/002 ,  C25D3/38 ,  C25D5/022 ,  C25D5/08 ,  C25D5/18 ,  C25D5/48 ,  C25D7/123 ,  C25F3/02 ,  C25F3/22 ,  H01L21/4846 ,  H01L23/15 ,  H01L23/49866

Abstract: Direct copper-copper bonding at low temperatures is achieved by electroplating copper features on a substrate followed by electroplanarizing the copper features. The copper features are electroplated on the substrate under conditions so that nanotwinned copper structures are formed. Electroplanarizing the copper features is performed by anodically biasing the substrate and contacting the copper features with an electrolyte so that copper is electrochemically removed. Such electrochemical removal is performed in a manner so that roughness is reduced in the copper features and substantial coplanarity is achieved among the copper features. Copper features having nanotwinned copper structures, reduced roughness, and better coplanarity enable direct copper-copper bonding at low temperatures.

公开(公告)号：WO2020104569A1

公开(公告)日：2020-05-28

申请号：PCT/EP2019/082021

申请日：2019-11-21

Applicant: PARIS SCIENCES ET LETTRES - QUARTIER LATIN ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (CNRS) ,  SORBONNE UNIVERSITE ,  COLLEGE DE FRANCE

Inventor： FONTECAVE, Marc ,  MOUGEL, Victor ,  TRAN NGOC, Huan ,  ALVES DALLA CORTE, Daniel ,  LAMAISON, Sarah ,  LUTZ, Lukas

IPC: C25B3/04 ,  C25B1/04 ,  C25B11/03 ,  C25B11/04 ,  C25B9/06 ,  C25D3/38 ,  C25D5/50 ,  C25D11/34

Abstract: The present invention relates to an electrolysis device comprising an anode and a cathode, wherein the anode and the cathode each are an electrode comprising an electrically conductive support of which at least a part of the surface is covered by a metal deposit of copper, wherein the surface of the metal deposit is in an oxidized, suIfurated, selenated and/or tellurized form and the metal deposit has a specific surface area greater than or equal to 1 m 2 /g. The present invention relates also to a method for reducing CO 2 into hydrocarbons using an electrolysis device according to the invention. The method according to the invention comprises: a) providing an electrolysis device according to the invention; b) exposing the cathode of said electrolysis device to a CO 2 -containing aqueous catholyte solution; c) exposing the anode of said electrolysis device to an aqueous anolyte solution; and d) applying an electrical current between the anode and the cathode in order to reduce the carbon dioxide into hydrocarbons.