公开(公告)号：WO2009143759A1

公开(公告)日：2009-12-03

申请号：PCT/CN2009/071952

申请日：2009-05-25

Applicant: 深圳华为通信技术有限公司 ,  李继厚 ,  黄明利

Inventor： 李继厚 ,  黄明利

IPC: H05K1/09

CPC classification number: H05K3/0044 ,  H05K3/4611 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0228 ,  H05K2203/1476

公开(公告)号：WO2009052761A1

公开(公告)日：2009-04-30

申请号：PCT/CN2008/072745

申请日：2008-10-17

Applicant: 华为技术有限公司 ,  李松林 ,  李洪彩 ,  黄雄飞 ,  张希坤 ,  王传余 ,  李继厚

Inventor： 李松林 ,  李洪彩 ,  黄雄飞 ,  张希坤 ,  王传余 ,  李继厚

IPC: H05K1/14 ,  H05K3/36 ,  H05K7/20 ,  H05K3/42

CPC classification number: H05K1/0204 ,  H01L2224/48091 ,  H01L2924/19107 ,  H05K1/021 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/3421 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416 ,  H01L2924/00014

Abstract: A PCB device and a method of manufacture thereof. The PCB device includes: a first PCB (301), a second PCB (302), a power tube (305) and a heat sink (303). The second PCB (302) is a PCB of the high frequency and high power device. The SMT soldering side of the side end of the second PCB (302) is soldered with and fixed on the first PCB (301). The power tube (305) is connected with the hest sink (303) through an open window of the first PCB (301) and the second PCB (302). The pin of the power tube (305) is soldering with the second PCB (302). The heat sink (303) is connected with the lower surface of the first PCB (301).