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    HIGH-SPEED ROUTER WITH BACKPLANE USING MULTI-DIAMETER DRILLED THRU-HOLES AND VIAS
    2.
    发明申请
    HIGH-SPEED ROUTER WITH BACKPLANE USING MULTI-DIAMETER DRILLED THRU-HOLES AND VIAS 审中-公开
    使用多直径钻孔螺栓和六角柱的背板高速路由器

    公开(公告)号：WO2009023238A1

    公开(公告)日：2009-02-19

    申请号：PCT/US2008009713

    申请日：2008-08-13

    Applicant: FORCE10 NETWORKS INC

    Inventor： GOERGEN JOEL R ,  HUNT GREG

    IPC: H05K3/42 ,  H05K1/02

    CPC classification number: H05K3/429 ,  H05K1/0216 ,  H05K1/0237 ,  H05K3/0047 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165

    Abstract: A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru- holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.

    Abstract translation: 公开了一种高速路由器背板。 路由器背板在多个信号层上使用差分信号对，每个信号对夹在一对数字接地层之间。 通孔用于将差分信号对连接到外部组件。 为了降低路由复杂度，差分信号对中的至少一些在其路径的某处沿着不同的信号层路由通路对。 钻出至少一些通孔和通孔以减少孔的导电短截线长度部分。 孔的钻孔部分包括从第一轮廓到第二轮廓的转变，以减少从钻孔的端部的射频反射。

    CLOSED LOOP BACKDRILLING SYSTEM
    3.
    发明申请
    CLOSED LOOP BACKDRILLING SYSTEM 审中-公开
    闭环回弹系统

    公开(公告)号：WO2005029928A3

    公开(公告)日：2005-12-29

    申请号：PCT/US2004030490

    申请日：2004-09-17

    Applicant: VIASYSTEM GROUP INC ,  TOURNE JOSEPH A A M ,  LEBENS PATRICK P P

    Inventor： TOURNE JOSEPH A A M ,  LEBENS PATRICK P P

    IPC: H02H1/04 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  B23P19/04 ,  H01R12/04

    CPC classification number: H05K3/0047 ,  H05K1/0237 ,  H05K1/0268 ,  H05K3/429 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T29/49718 ,  Y10T29/49726 ,  Y10T408/03 ,  Y10T408/173 ,  Y10T408/175

    Abstract: A multilayer circuit board (16) is provided with at least one signasl layer (20), at least one feedback layer (22), ans at least one dielectric layer (24) positioned between the signal layer (20) and the feedback layer (22). The signal layer (20) is connected to at least one plated hole (12). The feedback layer (22) has a contact pad (26), which is positioned adjacent to the plated hole (12), but is electrically isolated from the plated hole (12). The contact pad (26) is connected to a measurement unit (48). The dielectric layer (22) is positioned between the signal layer (20) and the contact pad (26) of the feedback layer (22). A portion of the plated hole (12) forms a stub portion (18), which extends a distance away from the signal layer (20) and typically extends a distance away from the contact pad (26) of the feedback layer (22). To remove the stub portion (18), a hole is bored or routed into the multilayer circuit board (16) until electrical feedback is received by the measurement unit (48) upon contact of a portion of the boring device (40) with the contact pad (26) Upon receipt of the electrical feedback by the measurement unit (48), theboring device (40) is retracted from the hole, and the hole formed by the borijng device (40) is filled with an epoxy, or other filler material.

    Abstract translation: 多层电路板（16）设置有至少一个信号层（20），至少一个反馈层（22）和至少一个位于信号层（20）和反馈层（20）之间的介电层（24） 22）。 信号层（20）连接到至少一个电镀孔（12）。 反馈层（22）具有接触焊盘（26），其位于邻近电镀孔（12）的位置，但与电镀孔（12）电隔离。 接触垫（26）连接到测量单元（48）。 电介质层（22）位于信号层（20）和反馈层（22）的接触焊盘（26）之间。 电镀孔（12）的一部分形成短路部分（18），该短截线部分（18）延伸离开信号层（20）一定距离，并且通常距离反馈层（22）的接触焊盘（26）一定距离。 为了去除短截线部分（18），孔被钻孔或布线到多层电路板（16）中，直到当钻孔装置（40）的一部分与触点接触时由测量单元（48）接收到电反馈 垫（26）当由测量单元（48）接收到电反馈时，钻孔装置（40）从孔中缩回，由钻孔装置（40）形成的孔填充有环氧树脂或其它填充材料 。

    APPARATUS AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARDS
    4.
    发明申请
    APPARATUS AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARDS 审中-公开
    制造印刷电路板的装置和方法

    公开(公告)号：WO2003065510A1

    公开(公告)日：2003-08-07

    申请号：PCT/US2003/000175

    申请日：2003-01-02

    Applicant: ANAREN MICROWAVE, INC.

    Inventor： VAN DER WINDT, Leendert, J.

    IPC: H01R12/04

    CPC classification number: H05K3/44 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/0047 ,  H05K3/0061 ,  H05K3/429 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/09618 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/175

    Abstract: A printed circuit board through- hole connection that includes an assembled layout of a printed circuit board (10) and formed through holes (20a) by material removed from the first side of the printed circuit board up to the backing (11) and then slightly into the top portion (11a) of the backing. It further includes plated through-holes that connect the backing (11), a ground layer (19) and a signal layer (16), removed plating from the signal layer without the connection removed from the ground layer to the backing and filled through holes from the first side with a non conductive filler (17).

    Abstract translation: 一种印刷电路板通孔连接，其包括印刷电路板（10）的组装布局，并且通过从印刷电路板的第一侧直到背衬（11）去除的材料形成通孔（20a），然后稍微 进入背衬的顶部（11a）。 它还包括连接背衬（11），接地层（19）和信号层（16）的电镀通孔，从信号层移除镀层，而不将连接从接地层移除到背衬并填充通孔 从第一侧用非导电填料（17）。

    METHODS OF SEGMENTED THROUGH HOLE FORMATION USING DUAL DIAMETER THROUGH HOLE EDGE TRIMMING
    7.
    发明申请
    METHODS OF SEGMENTED THROUGH HOLE FORMATION USING DUAL DIAMETER THROUGH HOLE EDGE TRIMMING 审中-公开
    通过孔边缘修剪使用双直径的孔形成方法

    公开(公告)号：WO2015026871A1

    公开(公告)日：2015-02-26

    申请号：PCT/US2014/051759

    申请日：2014-08-19

    Applicant: SANMINA CORPORATION

    Inventor： THOMAS, Douglas Ward ,  IKETANI, Shinichi Steve

    IPC: H05K3/40 ,  H05K3/42

    CPC classification number: H05K3/427 ,  H05K3/0026 ,  H05K3/0047 ,  H05K2201/09845 ,  H05K2203/0207 ,  Y10T29/49165

    Abstract: Cost effective and efficient methods to maximize printed circuit board (PCB) utilization with minimized signal degradation are provided. The methods include electrically isolating a segmented via structure by controlling the formation of a conductive material within a plated via structure by utilizing different diameter drills within a via structure for trimming the conductive material at the via shoulder (i.e., the rim of a drilled two diameter hole boundary). The trimmed portion may be voided in the via structure for allowing electrically isolated plated through-hole (PTH) segments. One or more areas of trimmed rims within the via structure are used to form multiple stair like diameter holes to create one or more voids in the via structure. As a result, the formation of conductive material within the via structure may be limited to those areas necessary for the transmission of electrical signals.

    Abstract translation: 提供了以最小的信号劣化来最大化印刷电路板（PCB）利用率的成本有效和高效的方法。 所述方法包括通过在通孔结构内利用不同直径的钻头来控制在通孔结构内的导电材料的形成来控制电镀过孔结构内的导电材料的形成来电隔离分段通孔结构，以便在通孔肩部（即，钻孔两个直径的边缘 孔边界）。 修整部分可以在通孔结构中被排除，以允许电隔离的电镀通孔（PTH）段。 通孔结构内的一个或多个修剪边缘的区域用于形成多个阶梯状直径孔，以在通孔结构中产生一个或多个空隙。 结果，通孔结构内的导电材料的形成可以限于传输电信号所需的那些区域。

    一种PCB板背钻方法和系统
    8.
    发明申请
    一种PCB板背钻方法和系统 审中-公开

    公开(公告)号：WO2015021775A1

    公开(公告)日：2015-02-19

    申请号：PCT/CN2014/073252

    申请日：2014-03-11

    Applicant: 华为技术有限公司

    Inventor： 杨永星 ,  高峰 ,  黄明利

    IPC: H05K3/42

    CPC classification number: H05K3/0047 ,  H05K3/429 ,  H05K2203/0207

    Abstract: 一种PCB板背钻方法和系统，在金属化孔PTH用于背钻一侧的印制电路板PCB板表面与所述PCB板的目标信号层之间设置一层导电层，所述导电层与所述PTH相连，所述目标信号层为对应当前背钻任务的信号层，以第一预设深度从所述PTH用于背钻一侧的PCB板表面开始对所述PTH进行所述第一次背钻，使得第一次背钻的钻孔钻穿导电层且不钻穿目标信号层；完成所述第一次背钻后回退背钻钻针，直到背钻钻针与所述导电层脱离电连接；控制所述背钻钻针从第一次背钻形成的钻孔向所述目标信号层移动，并检测背钻钻针是否接触到所述导电层；当所述背钻钻针接触到所述导电层时，以第二预设深度从所述导电层开始完成第二次背钻，使得第二次背钻不钻穿目标信号层。

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