Abstract:
A YUKAI NAND array comprising multiple strings associated with hierarchical global/local bit lines (GBL/LBL) and each string being associated with one LBL and having adjacent LBL as a dedicated local source line (LSL) without a common source line to connect all strings. Each of the LBLs is interleavingly associated with either an Odd or Even string selected via one pair of dummy cells inserted in each string and is used as one on-chip PCACHE register with full BL-shielding without wasting extra silicon area to allow batch- based multiple concurrent MLC All-BL, All-Vtn-Program and Alternative-WL program, Odd/Even read and verify operations with options of providing individual and common VSL-based Vt-compensation and VLBL compensations to mitigate high WL-WL and BL-BL coupling effects. Bias conditions in each string are provided to correctly sense highly-negative erase-verify voltage, multiple negative program-verify voltages and without VDS punch-through, breakdown and body-effect in both boundary and non-boundary WLs cells.
Abstract:
This invention provides a 2-level BL-hierarchical NAND memory architecture and associated concurrent operations applicable to both 2D and 3D HiNAND2 memory arrays. New Latch designs in Block-decoder and Segment-decoder with one common dedicated metal0 power line per one 2N-bit dynamic page buffer (DPB) formed in corresponding 2N broken-LBL metal1 line capacitors for Program and per one 2N-bit Segment DPB formed in corresponding 2N local LBL metal 1 line capacitors for Read are provided for performing concurrent and pipeline operations of multiple-WL Program, Read, Erase-Verify, and Program- Verify in dispersed Blocks in a same or multiple different NAND planes with much enhanced array flexibility and multiple-fold performance improvements.
Abstract:
Several 2D and 3D HiNAND flash memory arrays with 1 -level or 2-level broken BL- hierarchical structures are provided for Multiple Whole- WL and All-BL simultaneous operations in Dispersed Blocks. The global bit line (GBL) is divided to multiple l(top)-level broken metal2 GBLs plus optional lower-level broken metal 1 local bit lines (LBLs). A preferred Vinhibit supply higher than Vdd can be selectively supplied via horizontal metalO power line LBLps to charge selected broken GBLs/LBLs which can also be selectively discharged via a String source line. Charge-sharing technique for precharging and discharging of broken GBL/LBL capacitors for NAND cell data sensing is used in Read and Verify operations with reduced power consumption and latency. Recall technique to restore the desired Program Data stored in the broken GBL/LBL capacitors is used for Multiple- WL and All-BL Program and Program- Verify operation with reduced program current for highest program yield superior P/E cycles.
Abstract:
This invention discloses a HiNAND array scheme with multiple-level of bit lines (BLs) including metal3 global bit lines (GBLs), divided metal2 Segment bit lines (SBLs), and divided metal1block bit lines (BBLs) laid out in parallel to each other respectively for a plurality of NAND Strings. All other source lines or power lines connected to bottoms of corresponding String capacitances of GBLs, SBLs, and BBLs are associated with metal0 line laid out perpendicular to those BLs. Under the HiNAND array scheme, conventional one-WL Read and Program- Verify operations are replaced by multiple- WL and All-BL Read and Program- Verify operations executed with charge capacitance of SBLs being reduced to 1/10-1/20 of capacitance of GBLs to achieve DRAM-like faster operation, less operation stress, and lower power consumption. A preferred set of program biased voltages on the selected WL and remaining non-selected WLs associated with a Multiplier and a DRAM-like charge-sharing Latch Sensing Amplifier is proposed.
Abstract:
A low-current FN channel for Erase, Program, Program-Inhibit and Read operations is disclosed for any non-volatile memory using FN-tunneling scheme for program and erase operation, regardless NAND, NOR, and EEPROM and regardless PMOS or NMOS non-volatile cell type. As a result, all above NMV memories can use the disclosed LV, compact PGM buffer to replace the traditional HV PGM buffer for saving in the silicon area and power consumption. The page buffer is used to store new loaded data for new writing and to convert the stored data into the required BL HV voltage for either Erase or Program operations according to the stored data. In addition, the simpler on-chip State-machine design can be achieved with the superior quality of NVMs of this disclosure.
Abstract:
A memory access apparatus that controls access to at least one memory array has an array of programmable comparison cells that retain a programmed pass code and compare it with an access pass code. When there is a match between the access pass code and the programmed pass code, the memory access apparatus generates a match signal for allowing access to the at least one memory array. If there is no match, the data within the at least one memory array may be corrupted or destroyed. Each nonvolatile comparison cell has a pair of series connected charge retaining transistors. The programmed pass code is stored in the charge retaining transistors. Primary and complementary query pass codes are applied to the charge retaining transistors and are logically compared with the stored pass code and based on the programmed threshold voltage levels determine if the query pass code is correct.
Abstract:
A semiconductor chip contains four different memory types, EEPROM, NAND Flash, NOR Flash and SRAM, and a plurality of major serial/parallel interfaces such as l 2 C, SPI, SDI and SQI in one memory chip. The memory chip features write- while-write and read-while-write operations as well as read-while-transfer and write- while-transfer operations. The memory chip provides for eight pins of which two are for power and up to four pins have no connection for specific interfaces and uses a novel unified nonvolatile memory design that allow the integration together of the aforementioned memory types integrated together into the same semiconductor memory chip.
Abstract:
Disclosed is a low-cost hybrid storage solution that allows Code like sectoralterable NOR and Data like block-alterable NAND and byte-alterable EEPROM being integrated on a same die. The disclosed combo NVM design of the present invention is a truly Data-oriented NVM design that allows 2T-EEPROM to integrate both O ST-NAND and 1 T -NOR without sacrificing any EEPROM's byte-write performance in the same die. The invention provides several new embodiment sets of preferable bias conditions of Program, Program-Inhibit, Erase and Erase-lnhibit for operating bit-write, byte-write, sector-write and page-write for several preferable Flotox-based EEPROM, NOR and NAND or combo NVM arrays that include types of shared SL, 8-pair BLs and SLS, with or without GBL, normally Erased Vt and Programmed Vt, or the reversed Erased-Vt or Programmed-Vt, etc. Further disclosed is a flexible X-decoder design to allow the flexible selection of pages to be erased to save erase time.
Abstract:
An apparatus and method for operating an array of NOR connected flash nonvolatile memory cells erases the array in increments of a page, block, sector, or the entire array while minimizing operational disturbances and providing bias operating conditions to prevent gate to source breakdown in peripheral devices. The apparatus has a row decoder circuit and a source decoder circuit for selecting the nonvolatile memory cells for providing biasing conditions for reading, programming, verifying, and erasing the selected nonvolatile memory cells while minimizing operational disturbances and preventing gate to source breakdown in peripheral devices.
Abstract:
The device of the invention includes a plurality of isolation layers formed at predetermined regions of a semiconductor substrate and running parallel with each other. The devices of the present invention also include a high voltage PMOS placed on top of a deep N- well and NMOS placed above a triple P-well inside the deep N- well in the peripheral area to pass both positive and negative high voltage of around +20V and -20V to the cell area. In one embodiment, the cell array, source lines and bit lines are all placed on top of the P-substrate without a deep N-well or Triple P- well. In other embodiments, the cell array, source lines and bit lines are placed on top of the deep N-well and triple P-well.