公开(公告)号：WO2004053898A3

公开(公告)日：2004-06-24

申请号：PCT/US2003/002339

申请日：2003-01-24

Applicant: BOURNS, INC. ,  BURKE, Ray ,  O'BRIEN, Maurice ,  AHEARNE, Brian ,  KELLY, John ,  BOURNS, Gordon, L.

Inventor： BURKE, Ray ,  O'BRIEN, Maurice ,  AHEARNE, Brian ,  KELLY, John ,  BOURNS, Gordon, L.

IPC: H01C1/14

Abstract: The present invention relates to encapsulated or insulated devices. In certain environments and applications, it is necessary to protect devices from external agents. The present invention achieves this by providing a device comprising a segment of insulating material having an aperture defined therein. An element of active, for example positive temperature coefficient (PTC), material is received within the defined aperture. The element is substantially covered by a first metal layer on one side and a second metal layer on the opposing side. A first layer of insulating material substantially covers the first metal layer and a second layer of insulating material substantially covers the second layer of metal. A first terminal provides an external electrical connection to the first metal layer and a second terminal provides an external electrical connection to the second metal layer. The first terminal is connected to the first metal layer by a conductive interconnect which passes through the first insulating layer and the second terminal is connected to the second metal layer by a conductive interconnect passes through the second insulating layer. Moreover, the invention provides a method for manufacturing devices in a matrix form using conventional PCB techniques to facilitate the mass production of encapsulated devices. Additionally, the resulting components may be used as either leaded or SMT components in either single device or multiple device configurations in both SIP and DIP packages.

公开(公告)号：WO2007121412A3

公开(公告)日：2007-10-25

申请号：PCT/US2007/066729

申请日：2007-04-16

Applicant: BOURNS, INC. ,  BOURNS, Gordon L. ,  CHU, Stelar ,  GRINDELL, Daniel E. ,  HUANG, David ,  KELLY, John ,  MEIJER, Erik

Inventor： BOURNS, Gordon L. ,  CHU, Stelar ,  GRINDELL, Daniel E. ,  HUANG, David ,  KELLY, John ,  MEIJER, Erik

IPC: H05K1/00

Abstract: Surface-mountable conductive polymer electronic devices include at least one conductive polymer active layer laminated between upper and lower electrodes. Upper and lower insulation layers, respectively, sandwich the upper and lower electrodes. First and second planar conductive terminals are formed on the lower insulation layer. First and second cross-conductors are provided by plated through-hole vias, whereby the cross-conductors connect each of the electrodes to one of the terminals. Certain embodiments include two or more active layers, arranged in a vertically-stacked configuration and electrically connected by the cross-conductors and electrodes in parallel. Several embodiments include at least one cross-conductor having a chamfered or beveled entry hole through the upper insulation layer to provide enhanced adhesion between the cross-conductor and the insulation layer. Several methods for manufacturing the present surface-mountable conductive polymer electronic devices are also provided.

公开(公告)号：WO2004053898A2

公开(公告)日：2004-06-24

申请号：PCT/US0302339

申请日：2003-01-24

Applicant: BOURNS INC ,  BURKE RAY ,  O'BRIEN MAURICE ,  AHEARNE BRIAN ,  KELLY JOHN ,  BOURNS GORDON L

Inventor： BURKE RAY ,  O'BRIEN MAURICE ,  AHEARNE BRIAN ,  KELLY JOHN ,  BOURNS GORDON L

IPC: H01C1/028 ,  H01C1/14 ,  H01C1/142 ,  H01C17/00 ,  H01C17/02 ,  H01C

CPC classification number: H01C1/14 ,  H01C1/028 ,  H01C1/1406 ,  H01C1/142 ,  H01C17/006 ,  H01C17/02 ,  H01C17/281

Abstract: The present invention relates to encapsulated or insulated devices. In certain environments and applications, it is necessary to protect devices from external agents. The present invention achieves this by providing a device comprising a segment of insulating material having an aperture defined therein. An element of active, for example positive temperature coefficient (PTC), material is received within the defined aperture. The element is substantially covered by a first metal layer on one side and a second metal layer on the opposing side. A first layer of insulating material substantially covers the first metal layer and a second layer of insulating material substantially covers the second layer of metal. A first terminal provides an external electrical connection to the first metal layer and a second terminal provides an external electrical connection to the second metal layer. The first terminal is connected to the first metal layer by a conductive interconnect which passes through the first insulating layer and the second terminal is connected to the second metal layer by a conductive interconnect passes through the second insulating layer. Moreover, the invention provides a method for manufacturing devices in a matrix form using conventional PCB techniques to facilitate the mass production of encapsulated devices. Additionally, the resulting components may be used as either leaded or SMT components in either single device or multiple device configurations in both SIP and DIP packages.

Abstract translation: 本发明涉及封装或绝缘装置。 在某些环境和应用中，有必要保护设备免受外部代理的影响。 本发明通过提供一种包括具有限定在其中的孔的绝缘材料的部分来实现这一点。 活动的元件，例如正温度系数（PTC）的材料被接收在限定的孔内。 元件基本上被一侧上的第一金属层和相对侧上的第二金属层覆盖。 第一绝缘材料层基本上覆盖第一金属层，第二绝缘材料层基本上覆盖第二金属层。 第一端子提供到第一金属层的外部电连接，而第二端子提供到第二金属层的外部电连接。 第一端子通过导电布线连接到第一金属层，导电布线穿过第一绝缘层，第二端子通过导电布线连接到第二金属层，穿过第二绝缘层。 此外，本发明提供了一种使用常规PCB技术制造矩阵形式的器件的方法，以便于大量生产封装器件。 另外，所得到的组件可以用作单一设备中的含铅或SMT组件或SIP和DIP封装中的多个器件配置。

公开(公告)号：WO2007121412B1

公开(公告)日：2008-08-07

申请号：PCT/US2007066729

申请日：2007-04-16

Applicant: BOURNS INC ,  BOURNS GORDON L ,  CHU STELAR ,  GRINDELL DANIEL E ,  HUANG DAVID ,  KELLY JOHN ,  MEIJER ERIK

Inventor： BOURNS GORDON L ,  CHU STELAR ,  GRINDELL DANIEL E ,  HUANG DAVID ,  KELLY JOHN ,  MEIJER ERIK

IPC: H05K1/00

CPC classification number: H01C7/021 ,  H01C1/016 ,  H01C1/1406 ,  H01C1/1413 ,  H01C7/005 ,  H01C7/028 ,  H01C7/041 ,  H01C7/049 ,  H01C7/18 ,  H01C17/02 ,  H01C17/281 ,  Y10T29/49165

Abstract: Surface-mountable conductive polymer electronic devices include at least one conductive polymer active layer laminated between upper and lower electrodes. Upper and lower insulation layers, respectively, sandwich the upper and lower electrodes. First and second planar conductive terminals are formed on the lower insulation layer. First and second cross-conductors are provided by plated through-hole vias, whereby the cross-conductors connect each of the electrodes to one of the terminals. Certain embodiments include two or more active layers, arranged in a vertically-stacked configuration and electrically connected by the cross-conductors and electrodes in parallel. Several embodiments include at least one cross-conductor having a chamfered or beveled entry hole through the upper insulation layer to provide enhanced adhesion between the cross-conductor and the insulation layer. Several methods for manufacturing the present surface-mountable conductive polymer electronic devices are also provided.

Abstract translation: 表面可安装的导电聚合物电子器件包括至少一个层压在上电极和下电极之间的导电聚合物活性层。 上部和下部绝缘层分别夹住上部和下部电极。 第一和第二平面导电端子形成在下绝缘层上。 第一和第二交叉导体由电镀的通孔通路提供，由此交叉导体将每个电极连接到其中一个端子。 某些实施例包括两个或更多个有源层，以垂直堆叠配置布置并且通过平行于横向导体和电极电连接。 几个实施例包括至少一个横向导体，该横向导体具有穿过上部绝缘层的倒角或斜面入口孔，以提供横向导体与绝缘层之间的增强的粘合。 还提供了制造本发明表面可安装导电聚合物电子器件的几种方法。

公开(公告)号：WO2007121412A2

公开(公告)日：2007-10-25

申请号：PCT/US2007066729

申请日：2007-04-16

Applicant: BOURNS INC ,  BOURNS GORDON L ,  CHU STELAR ,  GRINDELL DANIEL E ,  HUANG DAVID ,  KELLY JOHN ,  MEIJER ERIK

Inventor： BOURNS GORDON L ,  CHU STELAR ,  GRINDELL DANIEL E ,  HUANG DAVID ,  KELLY JOHN ,  MEIJER ERIK

IPC: H02B1/044

CPC classification number: H01C7/021 ,  H01C1/016 ,  H01C1/1406 ,  H01C1/1413 ,  H01C7/005 ,  H01C7/028 ,  H01C7/041 ,  H01C7/049 ,  H01C7/18 ,  H01C17/02 ,  H01C17/281 ,  Y10T29/49165

Abstract: Surface-mountable conductive polymer electronic devices include at least one conductive polymer active layer laminated between upper and lower electrodes. Upper and lower insulation layers, respectively, sandwich the upper and lower electrodes. First and second planar conductive terminals are formed on the lower insulation layer. First and second cross-conductors are provided by plated through-hole vias, whereby the cross-conductors connect each of the electrodes to one of the terminals. Certain embodiments include two or more active layers, arranged in a vertically-stacked configuration and electrically connected by the cross-conductors and electrodes in parallel. Several embodiments include at least one cross-conductor having a chamfered or beveled entry hole through the upper insulation layer to provide enhanced adhesion between the cross-conductor and the insulation layer. Several methods for manufacturing the present surface-mountable conductive polymer electronic devices are also provided.

Abstract translation: 表面安装导电聚合物电子器件包括层压在上电极和下电极之间的至少一个导电聚合物有源层。 上下绝缘层分别夹着上下电极。 第一和第二平面导电端子形成在下绝缘层上。 第一和第二导体由电镀通孔通孔提供，由此将导体将每个电极连接到其中一个端子。 某些实施方案包括两个或更多个有源层，其被布置成垂直堆叠的构造并且由交叉导体和电极并联电连接。 几个实施例包括至少一个具有通过上绝缘层的倒角或斜面进入孔的交叉导体，以在交叉导体和绝缘层之间提供增强的粘合。 还提供了用于制造本表面安装导电聚合物电子器件的几种方法。