公开(公告)号：WO2012072671A1

公开(公告)日：2012-06-07

申请号：PCT/EP2011/071361

申请日：2011-11-30

Applicant: O'BRIEN, Maurice ,  O'BRIEN, Anne ,  NOLAN, Terry

Inventor： O'BRIEN, Maurice ,  O'BRIEN, Anne ,  NOLAN, Terry

IPC: E04B1/24 ,  E04B5/36

CPC classification number: E04B1/24 ,  E04B5/36 ,  E04B2001/2484

Abstract: A concrete flooring system (10) for use in the construction of floor/roof levels within framed buildings and which provides improved levels of stiffness for a relatively shallow depth when using prefabricated slabs or steel decking with in situ concrete in the construction of the floor/roof levels, the system comprising at least a pair of prefabricated slabs (12); a pair of beams (14) in parallel spaced relationship such as to define a inter-beam space (20) therebetween, each beam supporting a respective slab at an edge of the slab, an array of reinforcing members (22) located within and/or overlying the inter-beam space, and concrete filling the inter-beam space and encasing the array of reinforcing members and covering the prefabricated slabs.

Abstract translation: 一种混凝土地板系统（10），用于建筑框架式建筑物内的地板/屋顶水平，并且在使用预制板或钢板铺设现场混凝土时，在相对较浅的深度上提供改善的刚度， 屋顶水平，该系统包括至少一对预制板坯（12）; 一对平行间隔的梁（14），以便在其间限定一个梁间空间（20），每个梁在板坯的边缘处支撑相应的板坯，一组加强构件（22）位于和/ 或覆盖横梁间的空间，混凝土填充梁间空间并包围加固构件阵列并覆盖预制板。

公开(公告)号：WO2004053898A3

公开(公告)日：2004-06-24

申请号：PCT/US2003/002339

申请日：2003-01-24

Applicant: BOURNS, INC. ,  BURKE, Ray ,  O'BRIEN, Maurice ,  AHEARNE, Brian ,  KELLY, John ,  BOURNS, Gordon, L.

Inventor： BURKE, Ray ,  O'BRIEN, Maurice ,  AHEARNE, Brian ,  KELLY, John ,  BOURNS, Gordon, L.

IPC: H01C1/14

Abstract: The present invention relates to encapsulated or insulated devices. In certain environments and applications, it is necessary to protect devices from external agents. The present invention achieves this by providing a device comprising a segment of insulating material having an aperture defined therein. An element of active, for example positive temperature coefficient (PTC), material is received within the defined aperture. The element is substantially covered by a first metal layer on one side and a second metal layer on the opposing side. A first layer of insulating material substantially covers the first metal layer and a second layer of insulating material substantially covers the second layer of metal. A first terminal provides an external electrical connection to the first metal layer and a second terminal provides an external electrical connection to the second metal layer. The first terminal is connected to the first metal layer by a conductive interconnect which passes through the first insulating layer and the second terminal is connected to the second metal layer by a conductive interconnect passes through the second insulating layer. Moreover, the invention provides a method for manufacturing devices in a matrix form using conventional PCB techniques to facilitate the mass production of encapsulated devices. Additionally, the resulting components may be used as either leaded or SMT components in either single device or multiple device configurations in both SIP and DIP packages.

公开(公告)号：WO2010122177A2

公开(公告)日：2010-10-28

申请号：PCT/EP2010055569

申请日：2010-04-26

Applicant: O'BRIEN MAURICE ,  O'BRIEN ANNE

Inventor： O'BRIEN MAURICE ,  O'BRIEN ANNE

IPC: E04B5/43

CPC classification number: E04B5/43 ,  E04C5/0604 ,  E04C5/0645

Abstract: A reinforcing structure is described for use in supporting a floor at a junction thereof with a structural column. The structure has several generally elongate, preassembled frame structures, each frame structure are disposed in rows parallel to one another. The frame structures incorporate the main top and bottom reinforcement bars for the reinforced floor with integral shear connectors forming part of the frame structures and the shear connectors tying the top and bottom reinforcement together. Transverse internal reinforcing bars are disposed parallel to one another and connected across the top or bottom reinforcing bars of each frame structure to connect the preassembled frame structures into a cagework of spaced-apart, rigidly connected frame structures.

Abstract translation: 描述了用于在与结构柱的接合处支撑地板的加强结构。 该结构具有几个大体上细长的预组装的框架结构，每个框架结构彼此平行设置。 框架结构包括用于加强地板的主顶部和底部加强筋，其具有形成框架结构的一部分的整体剪切连接件和将顶部和底部加强件捆绑在一起的剪切连接器。 横向内部加强筋彼此平行地设置并且跨越每个框架结构的顶部或底部加强筋连接，以将预组装的框架结构连接成间隔开的，刚性连接的框架结构的框架结构。

公开(公告)号：WO2004053898A2

公开(公告)日：2004-06-24

申请号：PCT/US0302339

申请日：2003-01-24

Applicant: BOURNS INC ,  BURKE RAY ,  O'BRIEN MAURICE ,  AHEARNE BRIAN ,  KELLY JOHN ,  BOURNS GORDON L

Inventor： BURKE RAY ,  O'BRIEN MAURICE ,  AHEARNE BRIAN ,  KELLY JOHN ,  BOURNS GORDON L

IPC: H01C1/028 ,  H01C1/14 ,  H01C1/142 ,  H01C17/00 ,  H01C17/02 ,  H01C

CPC classification number: H01C1/14 ,  H01C1/028 ,  H01C1/1406 ,  H01C1/142 ,  H01C17/006 ,  H01C17/02 ,  H01C17/281

Abstract: The present invention relates to encapsulated or insulated devices. In certain environments and applications, it is necessary to protect devices from external agents. The present invention achieves this by providing a device comprising a segment of insulating material having an aperture defined therein. An element of active, for example positive temperature coefficient (PTC), material is received within the defined aperture. The element is substantially covered by a first metal layer on one side and a second metal layer on the opposing side. A first layer of insulating material substantially covers the first metal layer and a second layer of insulating material substantially covers the second layer of metal. A first terminal provides an external electrical connection to the first metal layer and a second terminal provides an external electrical connection to the second metal layer. The first terminal is connected to the first metal layer by a conductive interconnect which passes through the first insulating layer and the second terminal is connected to the second metal layer by a conductive interconnect passes through the second insulating layer. Moreover, the invention provides a method for manufacturing devices in a matrix form using conventional PCB techniques to facilitate the mass production of encapsulated devices. Additionally, the resulting components may be used as either leaded or SMT components in either single device or multiple device configurations in both SIP and DIP packages.

Abstract translation: 本发明涉及封装或绝缘装置。 在某些环境和应用中，有必要保护设备免受外部代理的影响。 本发明通过提供一种包括具有限定在其中的孔的绝缘材料的部分来实现这一点。 活动的元件，例如正温度系数（PTC）的材料被接收在限定的孔内。 元件基本上被一侧上的第一金属层和相对侧上的第二金属层覆盖。 第一绝缘材料层基本上覆盖第一金属层，第二绝缘材料层基本上覆盖第二金属层。 第一端子提供到第一金属层的外部电连接，而第二端子提供到第二金属层的外部电连接。 第一端子通过导电布线连接到第一金属层，导电布线穿过第一绝缘层，第二端子通过导电布线连接到第二金属层，穿过第二绝缘层。 此外，本发明提供了一种使用常规PCB技术制造矩阵形式的器件的方法，以便于大量生产封装器件。 另外，所得到的组件可以用作单一设备中的含铅或SMT组件或SIP和DIP封装中的多个器件配置。

公开(公告)号：WO2010122177A3

公开(公告)日：2010-10-28

申请号：PCT/EP2010/055569

申请日：2010-04-26

Applicant: O'BRIEN, Maurice ,  O'BRIEN, Anne

Inventor： O'BRIEN, Maurice ,  O'BRIEN, Anne

IPC: E04B5/43 ,  E04C5/06

Abstract: A reinforcing structure is described for use in supporting a floor at a junction thereof with a structural column. The structure has several generally elongate, preassembled frame structures, each frame structure are disposed in rows parallel to one another. The frame structures incorporate the main top and bottom reinforcement bars for the reinforced floor with integral shear connectors forming part of the frame structures and the shear connectors tying the top and bottom reinforcement together. Transverse internal reinforcing bars are disposed parallel to one another and connected across the top or bottom reinforcing bars of each frame structure to connect the preassembled frame structures into a cagework of spaced-apart, rigidly connected frame structures.

公开(公告)号：WO2004053899A1

公开(公告)日：2004-06-24

申请号：PCT/US2003/007875

申请日：2003-03-14

Applicant: BOURNS, INC. ,  BURKE, Ray ,  O'BRIEN, Maurice ,  LAN, Poting ,  CHU, Stelar

Inventor： BURKE, Ray ,  O'BRIEN, Maurice ,  LAN, Poting ,  CHU, Stelar

IPC: H01C1/14

CPC classification number: H01C7/027 ,  H01C1/1406 ,  H01C1/148 ,  H01C7/02 ,  H01C17/28 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/09181 ,  H05K2201/09554 ,  H05K2201/09845

Abstract: An electronic device is manufactured using printed circuit board manufacturing processes. In particular, a laminar device comprises a first metal layer (12), a second metal layer (14), at least one layer of device material sandwiched between the first and second metal layers. A first layer of insulating material (40) substantially covers the first metal layer (12). A third metal layer (48) is provided on the first layer of insulating material (40). This third metal layer (48) is divided to provide a first terminal (90) and a second terminal (92). The first terminal (90) is electrically connected to the first metal layer (12) by a conductive interconnect (84) formed through said first layer of insulating material (40), and the second terminal (92) is electrically connected to said second metal layer (14) by a conductive path (68) comprising an insulated conductive channel which passes through and is insulated from said first metal layer (12) and said at least one layer of device material (16). The use of an insulated channel provides a cost effective method of manufacture and maximizes the effective area of device material used. A PTC component is built through this method.

Abstract translation: 使用印刷电路板制造工艺制造电子设备。 特别地，层状器件包括第一金属层（12），第二金属层（14），夹在第一和第二金属层之间的至少一层器件材料。 第一层绝缘材料（40）基本上覆盖第一金属层（12）。 第三金属层（48）设置在第一绝缘材料层（40）上。 该第三金属层（48）被分割以提供第一端子（90）和第二端子（92）。 第一端子（90）通过通过所述第一绝缘材料层（40）形成的导电互连（84）与第一金属层（12）电连接，并且第二端子（92）电连接到所述第二金属 层（14）由包括绝缘导电通道的导电路径（68）穿过并与所述第一金属层（12）和所述至少一层装置材料（16）绝缘。 使用绝缘通道提供了一种成本有效的制造方法，并使所使用的器件材料的有效面积最大化。 通过此方法构建PTC组件。