Abstract:
Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
Abstract:
Systems and methods of interconnecting devices may include an input/output (IO) connector assembly having a voltage regulator, one or more signaling circuits, a first set of contacts, a second set of contacts connected to the one or more signaling circuits, and logic to receive a configuration command. The logic may also connect the first set of contacts to the voltage regulator if the configuration command corresponds to a first protocol. If the configuration command corresponds to a second protocol, on the other hand, the logic can connect the first set of contacts to the one or more signaling circuits.
Abstract:
Systems and methods of interconnecting devices may include an input/output (IO) connector having a buffer with an integrated voltage regulator. The integrated voltage regulator may include a first supply output and a second supply output, wherein the IO connector includes an IO power contact coupled to the first supply output. The IO connector may also include a logic power contact coupled to the second supply output. In one example, a host device may issue power management commands to the buffer in order to scale the second supply output independently of the first supply output.
Abstract:
An all-digital delay measurement circuit (DMC) constructed on an integrated circuit (IC) die characterizes clocking circuits such as full phase rotation interpolators, also constructed on the IC die. The on-die all-digital DMC produces a digital output value proportional to the relative delay between two clocks, normalized to the clock period of the two clocks.
Abstract:
Systems and methods of interconnecting devices may include an input/output (IO) interface having one or more clock circuits, a power supply coupled to the one or more clock circuits, and logic to receive a rate adjustment command at the IO interface. The logic may also be configured to adjust a data rate of the IO interface in response to the rate adjustment command, and to adjust an output voltage of the power supply in response to the rate adjustment command.
Abstract:
Systems and methods of interconnecting devices may include a connector assembly having a substrate, a set of input/output (IO) contacts, an antenna structure and transceiver logic. In one example, the transceiver logic may process one or more IO signals associated with the antenna structure and process one or more IO signals associated with the set of IO contacts.
Abstract:
Systems and methods of interconnecting devices may include an input/output (10) interface having one or more device-side data lanes and transceiver logic to receive a bandwidth configuration command. The transceiver logic may also configure a transmit bandwidth of the one or more device- side data lanes based on the bandwidth configuration command. Additionally, the transceiver logic can configure a receive bandwidth of the one or more device- side data lanes based on the bandwidth configuration command.