公开(公告)号：WO2010091222A3

公开(公告)日：2010-11-18

申请号：PCT/US2010023273

申请日：2010-02-05

申请人： ORTHODYNE ELECTRONICS CORP ,  DELSMAN MARK ARNOLD ,  COPPERTHITE THEODORE J ,  JONES GARRETT WILSON ,  WALKER TODD JAMES ,  LOH TICK-KWANG ,  MCCANDLESS JAY CLARK

发明人： DELSMAN MARK ARNOLD ,  COPPERTHITE THEODORE J ,  JONES GARRETT WILSON ,  WALKER TODD JAMES ,  LOH TICK-KWANG ,  MCCANDLESS JAY CLARK

IPC分类号： H01L21/60

CPC分类号： B23K20/10 ,  B23K20/007 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.

摘要翻译： 提供了包括主体部分的带式焊接工具。 主体部分包括尖端部分。 尖端部分包括尖端部分的前边缘和尖端部分的后边缘之间的工作表面。 工作表面包括限定多个凹部和多个凸部中的至少一个的区域。 所述工作表面还限定（1）所述区域与所述尖端部分的所述前边缘之间的第一平面部分，以及（2）所述尖端部分的所述区域与所述后边缘之间的第二平面部分中的至少一个。

公开(公告)号：WO2011130205A3

公开(公告)日：2011-10-20

申请号：PCT/US2011/032028

申请日：2011-04-12

申请人： ORTHODYNE ELECTRONICS CORPORATION ,  BYARS, Jonathan, M. ,  COPPERTHITE, Theodore, J. ,  VON TRESCKOW, H., Henry

发明人： BYARS, Jonathan, M. ,  COPPERTHITE, Theodore, J. ,  VON TRESCKOW, H., Henry

IPC分类号： H01L21/60

摘要： A support system for a semiconductor device during a wire or ribbon bonding operation is provided. The support system includes a body portion defining an upper surface. The upper surface has an upper surface contact region configured to support at least a portion of a lower surface of a semiconductor device at a lower surface contact region during a wire or ribbon bonding operation. The support system also includes a plurality of protrusions on the upper surface contact region.

公开(公告)号：WO2008039634A2

公开(公告)日：2008-04-03

申请号：PCT/US2007/077779

申请日：2007-09-06

申请人： ORTHODYNE ELECTRONICS CORPORATION ,  COPPERTHITE, Theodore J.

发明人： COPPERTHITE, Theodore J.

IPC分类号： A47J36/02

CPC分类号： B23K1/06 ,  B23K20/004 ,  B23K20/10 ,  B23K20/106 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2224/48

摘要： A ribbon bond head capable of deep access bonding is configured to pass the bonding ribbon outside the transducer, e.g., in front of the transducer, instead of through the transducer. A clamping mechanism includes a stationary flat clamp base and a movable clamp arm with an opening, where the bonding ribbon passes through, not around, the clamp arm. The ribbon is clamped between the movable clamp and the stationary clamp and held securely during looping.

摘要翻译： 能够进行深度接合的带状结合头被配置成使得接合带在换能器外部例如传感器前方通过，而不是通过换能器。 夹紧机构包括固定平夹具基座和具有开口的可移动夹臂，粘结带不夹在夹臂上。 色带被夹在可动夹和固定夹之间，并在环形过程中保持牢固。

公开(公告)号：WO2011130205A2

公开(公告)日：2011-10-20

申请号：PCT/US2011032028

申请日：2011-04-12

申请人： ORTHODYNE ELECTRONICS CORP ,  BYARS JONATHAN M ,  COPPERTHITE THEODORE J ,  VON TRESCKOW H HENRY

发明人： BYARS JONATHAN M ,  COPPERTHITE THEODORE J ,  VON TRESCKOW H HENRY

IPC分类号： H01L21/60

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L2224/45014 ,  H01L2224/48247 ,  H01L2224/78703 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15747 ,  Y10T29/49998 ,  H01L2924/00 ,  H01L2224/45099

摘要： A support system for a semiconductor device during a wire or ribbon bonding operation is provided. The support system includes a body portion defining an upper surface. The upper surface has an upper surface contact region configured to support at least a portion of a lower surface of a semiconductor device at a lower surface contact region during a wire or ribbon bonding operation. The support system also includes a plurality of protrusions on the upper surface contact region.

摘要翻译： 提供了一种在线或带状接合操作期间用于半导体器件的支撑系统。 支撑系统包括限定上表面的主体部分。 上表面具有上表面接触区域，其被配置为在线或带状接合操作期间在下表面接触区域处支撑半导体器件的下表面的至少一部分。 支撑系统还包括在上表面接触区域上的多个突起。

公开(公告)号：WO2010090778A2

公开(公告)日：2010-08-12

申请号：PCT/US2010/020024

申请日：2010-01-04

申请人： ORTHODYNE ELECTRONICS CORPORATION ,  COPPERTHITE, Theodore, J.

发明人： COPPERTHITE, Theodore, J.

IPC分类号： H01L21/60

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/26 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/7855 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15747 ,  Y10T83/0237 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a conductive material The end portion further includes a stepped portion proximate the blade tip that is configured to limit penetration of the blade tip during use thereof.

摘要翻译： 提供了一种用于引线接合系统的切割刀片。 切割刀片包括具有端部的主体部分。 端部包括构造成穿透导电材料的叶片尖端。端部部分还包括邻近叶片尖端的台阶部分，其构造成在使用时限制叶片尖端的穿透。

公开(公告)号：WO2010057016A3

公开(公告)日：2010-05-20

申请号：PCT/US2009/064422

申请日：2009-11-19

申请人： ORTHODYNE ELECTRONICS CORPORATION ,  BYARS, Jonathan ,  COPPERTHITE, Theodore, J.

发明人： BYARS, Jonathan ,  COPPERTHITE, Theodore, J.

IPC分类号： H01L21/60

摘要： In one embodiment, a support structure comprises a base, a compliant layer, and a protective layer which is used to secure a semiconductor device, such as a lead-frame, to a window clamp during a bonding process. The compliant layer distributes even loading over the surface of the semiconductor device while clamped. In other embodiments, the compliant layer may be segmented into individual portions corresponding with openings in the window clamp. The window clamp may also have a compliant layer and a protective layer and may be used with or without a compliant layer on the support structure. Features on the protective layer may be included to support structures of the semiconductor device.

公开(公告)号：WO2008039634A3

公开(公告)日：2008-10-16

申请号：PCT/US2007077779

申请日：2007-09-06

申请人： ORTHODYNE ELECTRONICS CORP ,  COPPERTHITE THEODORE J

发明人： COPPERTHITE THEODORE J

IPC分类号： B23K1/06 ,  B23K31/02 ,  B23K37/04

CPC分类号： B23K1/06 ,  B23K20/004 ,  B23K20/10 ,  B23K20/106 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2224/48

摘要： A ribbon bond head (100) capable of deep access bonding is configured to pass the bonding ribbon outside the transducer (106), e. in front of the transducer, instead of through the transducer. A clamping ( 104) mechanism includes a stationary flat clamp base an movable clamp arm with an opening, where the bonding ribbon passes through, not around, the clamp arm. The ribbon is clamped between the movable clamp and the stationary clamp and held securely during looping.

摘要翻译： 能够进行深度接合的带状接合头（100）被配置为使接合带在换能器（106）外部通过， 在传感器的前面，而不是通过传感器。 夹紧（104）机构包括具有开口的可移动夹紧臂的固定平夹具基座，粘结带不在夹紧臂周围。 色带被夹在可动夹和固定夹之间，并在环形过程中保持牢固。

公开(公告)号：WO2010090778A3

公开(公告)日：2010-09-30

申请号：PCT/US2010020024

申请日：2010-01-04

申请人： ORTHODYNE ELECTRONICS CORP ,  COPPERTHITE THEODORE J

发明人： COPPERTHITE THEODORE J

IPC分类号： H01L21/60

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/26 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/7855 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15747 ,  Y10T83/0237 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a conductive material The end portion further includes a stepped portion proximate the blade tip that is configured to limit penetration of the blade tip during use thereof.

摘要翻译： 提供了用于引线接合系统的切割刀片。 切割刀片包括具有端部的主体部分。 末端部分包括构造成穿透进入导电材料的叶片末端。末端部分还包括接近叶片末端的台阶部分，该台阶部分构造成限制叶片末端在其使用期间的穿透。

公开(公告)号：WO2010091222A2

公开(公告)日：2010-08-12

申请号：PCT/US2010/023273

申请日：2010-02-05

申请人： ORTHODYNE ELECTRONICS CORPORATION ,  DELSMAN, Mark, Arnold ,  COPPERTHITE, Theodore, J. ,  JONES, Garrett, Wilson ,  WALKER, Todd, James ,  LOH, Tick-kwang ,  MCCANDLESS, Jay, Clark

发明人： DELSMAN, Mark, Arnold ,  COPPERTHITE, Theodore, J. ,  JONES, Garrett, Wilson ,  WALKER, Todd, James ,  LOH, Tick-kwang ,  MCCANDLESS, Jay, Clark

IPC分类号： H01L21/60

CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K20/007 ,  B23K20/10 ,  B23K20/106 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/78316 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.

摘要翻译： 提供了包括主体部分的带状粘合工具。 主体部分包括尖端部分。 尖端部分包括在尖端部分的前边缘和尖端部分的后边缘之间的工作表面。 工作表面包括限定多个凹部和多个突起中的至少一个的区域。 工作表面还限定了（1）尖端部分的区域和前边缘之间的第一平面部分和（2）尖端部分的区域和后边缘之间的第二平面部分中的至少一个。

公开(公告)号：WO2010057016A2

公开(公告)日：2010-05-20

申请号：PCT/US2009064422

申请日：2009-11-19

申请人： ORTHODYNE ELECTRONICS CORP ,  BYARS JONATHAN ,  COPPERTHITE THEODORE J

发明人： BYARS JONATHAN ,  COPPERTHITE THEODORE J

IPC分类号： H01L21/60

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/78703 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  Y10T428/269 ,  Y10T428/31551 ,  Y10T428/31605 ,  H01L2924/00 ,  H01L2224/45099

摘要： In one embodiment, a support structure comprises a base, a compliant layer, and a protective layer which is used to secure a semiconductor device, such as a lead-frame, to a window clamp during a bonding process. The compliant layer distributes even loading over the surface of the semiconductor device while clamped. In other embodiments, the compliant layer may be segmented into individual portions corresponding with openings in the window clamp. The window clamp may also have a compliant layer and a protective layer and may be used with or without a compliant layer on the support structure. Features on the protective layer may be included to support structures of the semiconductor device.

摘要翻译： 在一个实施例中，支撑结构包括基座，柔性层和保护层，其用于在接合过程期间将半导体器件（例如引线框架）固定到窗口夹具。 柔性层在夹持时在半导体器件的表面上均匀分布。 在其它实施例中，顺应层可以被分段成对应于窗夹中的开口的单独部分。 窗夹具还可以具有柔顺层和保护层，并且可以在支撑结构上具有或不具有柔性层。 可以包括保护层上的特征以支持半导体器件的结构。