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    DURABLE IN-MOLD DECORATION LAMINATES USING SEMI-CRYSTALLINE POLYMER AS TOP FILM
    1.
    发明申请
    DURABLE IN-MOLD DECORATION LAMINATES USING SEMI-CRYSTALLINE POLYMER AS TOP FILM 审中-公开
    使用半结晶聚合物作为顶层膜的耐用模内装饰层压材料

    公开(公告)号：WO2010083534A9

    公开(公告)日：2010-11-04

    申请号：PCT/US2010021433

    申请日：2010-01-19

    Applicant: AVERY DENNISON CORP ,  SHI MING KUN ,  DANG CHRISTINE U ,  MARKEY JOHN J

    Inventor： SHI MING KUN ,  DANG CHRISTINE U ,  MARKEY JOHN J

    IPC: B32B27/34 ,  B32B27/36

    CPC classification number: B32B27/34 ,  B32B5/147 ,  B32B7/12 ,  B32B27/08 ,  B32B27/16 ,  B32B27/302 ,  B32B27/304 ,  B32B27/308 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2255/10 ,  B32B2307/306 ,  B32B2307/554 ,  B32B2307/584 ,  B32B2307/702 ,  B32B2307/714 ,  B32B2307/738 ,  B32B2307/75 ,  B32B2439/00 ,  B32B2457/00 ,  B32B2605/08 ,  Y10T428/24802

    Abstract: This specification discloses durable In-MoId Decoration (IMD) laminates made by using semi- crystalline polymers as top films. The crystalline structure or content of the semi-crystalline polymer can be optimized with a post process treatment process, which leads to improved chemical resistance and scratch resistance. The post process treatment can be conducted after the making of the film, during the in-mold processing of the laminate or after the in-mold processing of the laminate. The treatment can be applied over the entire film surface or in discrete areas with the treatment depth ranging from the top surface up to the bottom surface of the film. The post process treatment can be accompanied by changes in the appearance of the top film which makes IMD products tunable in decoration luster appearance. Durable IMD laminates with 60 degree gloss value of greater than 90 and process of making such laminates are also disclosed.

    Abstract translation: 该说明书公开了通过使用半结晶聚合物作为顶部膜制造的耐用的In-MoId装饰（IMD）层合物。 半结晶聚合物的晶体结构或含量可以通过后处理工艺来优化，这导致改进的耐化学性和耐刮擦性。 后处理可以在制造膜之后，在层压体的模内加工期间或在层压体的模内加工之后进行。 可以在整个薄膜表面上或在离散区域施加处理，处理深度范围从薄膜的顶部表面到底部表面。 后处理可以伴随着顶部膜的外观变化，这使得IMD产品可以在装饰光泽外观中调节。 也公开了60度光泽度值大于90的耐用IMD层压板和制造这种层压板的方法。

    RFID DEVICE AND METHOD OF MAKING
    3.
    发明申请
    RFID DEVICE AND METHOD OF MAKING 审中-公开
    RFID设备和制造方法

    公开(公告)号：WO2005041121A2

    公开(公告)日：2005-05-06

    申请号：PCT/US2004/025087

    申请日：2004-08-04

    Applicant: AVERY DENNISON CORPORATION ,  LIU, Peikang ,  KENNEDY, Stephen, C. ,  DANG, Christine, U. ,  FERGUSON, Scott, Wayne ,  MUNN, Jason

    Inventor： LIU, Peikang ,  KENNEDY, Stephen, C. ,  DANG, Christine, U. ,  FERGUSON, Scott, Wayne ,  MUNN, Jason

    IPC: G06K19/077

    CPC classification number: G06K19/077 ,  G06K19/07749 ,  G06K19/07752 ,  H01L23/49855 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913 ,  H01L2924/00

    Abstract: A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.

    Abstract translation: 射频识别（RFID）设备包括在基板的一侧上的导电图案（诸如天线）以及电耦合到导电图案的诸如条带的一部分的芯片 并且或者在基板的相对侧上或者在与基板相同的基板侧上。 制造RFID器件的方法可以包括将带卷曲到衬底上，与种子层接触，随后通过电镀形成天线或其他导电图案。 种子层可以是图案化的导电墨水层。 或者，种子层可以是沉积在衬底上的导电材料层，例如通过真空沉积。 为了形成导电图案的所需构型，可以用图案化掩模覆盖部分沉积层。

    RFID DEVICE AND METHOD OF MAKING
    4.
    发明申请
    RFID DEVICE AND METHOD OF MAKING 审中-公开
    RFID设备及其制造方法

    公开(公告)号：WO2005041121B1

    公开(公告)日：2005-09-29

    申请号：PCT/US2004025087

    申请日：2004-08-04

    Applicant: AVERY DENNISON CORP ,  LIU PEIKANG ,  KENNEDY STEPHEN C ,  DANG CHRISTINE U ,  FERGUSON SCOTT WAYNE ,  MUNN JASON

    Inventor： LIU PEIKANG ,  KENNEDY STEPHEN C ,  DANG CHRISTINE U ,  FERGUSON SCOTT WAYNE ,  MUNN JASON

    IPC: G06K19/077 ,  H01L23/498

    CPC classification number: G06K19/077 ,  G06K19/07749 ,  G06K19/07752 ,  H01L23/49855 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913 ,  H01L2924/00

    Abstract: A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.

    Abstract translation: 射频识别（RFID）装置包括在衬底的一侧上的诸如天线的导电图案，以及电耦合到导电图案的芯片，例如带的一部分，以及与导电图案相反的一侧 衬底或与衬底相同的一侧作为天线。 制造RFID装置的方法可以包括将带绑在衬底上，与种子层接触，接种层随后用于通过电镀形成天线或其它导电图案。 种子层可以是图案化的导电油墨层。 或者，种子层可以是沉积在基底上的导电材料层，例如通过真空沉积。 沉积层的一部分可以用图案化掩模覆盖，以便形成导电图案的所需结构。

    RFID DEVICE AND METHOD OF MAKING
    5.
    发明申请
    RFID DEVICE AND METHOD OF MAKING 审中-公开
    RFID设备和制造方法

    公开(公告)号：WO2005041121A3

    公开(公告)日：2005-07-28

    申请号：PCT/US2004025087

    申请日：2004-08-04

    Applicant: AVERY DENNISON CORP ,  LIU PEIKANG ,  KENNEDY STEPHEN C ,  DANG CHRISTINE U ,  FERGUSON SCOTT WAYNE ,  MUNN JASON

    Inventor： LIU PEIKANG ,  KENNEDY STEPHEN C ,  DANG CHRISTINE U ,  FERGUSON SCOTT WAYNE ,  MUNN JASON

    IPC: G06K19/077 ,  H01L23/498

    CPC classification number: G06K19/077 ,  G06K19/07749 ,  G06K19/07752 ,  H01L23/49855 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913 ,  H01L2924/00

    Abstract: A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.

    Abstract translation: 射频识别（RFID）设备包括在基板的一侧上的导电图案（例如天线）以及电耦合到导电图案的芯片（诸如带的一部分），并且在芯片的相对侧 衬底上或与天线在衬底的同一侧上。 制造RFID器件的方法可以包括将带卷曲到衬底上，与种子层接触，随后通过电镀形成天线或其他导电图案。 种子层可以是图案化的导电墨水层。 或者，种子层可以是沉积在衬底上的导电材料层，例如通过真空沉积。 沉积层的部分可以用图案化掩模覆盖以形成导电图案的期望构造。

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