WALLPAPER HAVING TEXTILE APPEARANCE EFFECT
    2.
    发明申请
    WALLPAPER HAVING TEXTILE APPEARANCE EFFECT 审中-公开
    具有纺织外观效果的壁纸

    公开(公告)号:WO2015064947A1

    公开(公告)日:2015-05-07

    申请号:PCT/KR2014/009908

    申请日:2014-10-21

    Abstract: The present invention relates to a wallpaper having a textile appearance effect which exhibits various outer appearances and texture on the surface thereof, thus providing an outer appearance like a textile woven with a warp and a weft after the weft is pre-dyed to finally forming the delicate textile-like appearance effect thereon. The wallpaper having a textile appearance effect includes: a base paper layer; a high magnification foam layer having a given pattern formed on top of the base paper layer; a low magnification foam layer laminated on top of the high magnification foam layer; a printed layer laminated on top of the low magnification foam layer; and a coloring coated layer laminated on top of the printed layer.

    Abstract translation: 本发明涉及一种具有纺织品外观效果的壁纸,其表面具有各种外观和质感,因此在纬纱预先染色之后提供外观,如经纱和纬纱织造的织物,以最终形成 细微的纺织样外观效果。 具有纺织品外观效果的壁纸包括:原纸层; 具有形成在原纸层顶部上的给定图案的高放大率泡沫层; 层叠在高倍率泡沫层顶部的低放大率泡沫层; 层叠在低倍率泡沫层的顶部的印刷层; 以及层叠在印刷层的顶部上的着色涂层。

    FLEXIBLE COPPER CLAD LAMINATE HAVING A BUFFER LAYER, AND METHOD FOR MANUFACTURING SAME
    5.
    发明申请
    FLEXIBLE COPPER CLAD LAMINATE HAVING A BUFFER LAYER, AND METHOD FOR MANUFACTURING SAME 审中-公开
    具有缓冲层的柔性铜箔层压板及其制造方法

    公开(公告)号:WO2010114222A2

    公开(公告)日:2010-10-07

    申请号:PCT/KR2010000756

    申请日:2010-02-08

    Abstract: The present invention relates to a flexible copper clad laminate (FCCL) having a buffer layer, and to a method for manufacturing same. The present invention provides a flexible copper clad laminate in which a buffer layer made of silicon compounds or silicon compound analogs is formed on at least one side of a base substrate made of polymer materials, and a copper foil layer is formed on the buffer layer, as well as a method for manufacturing same. As the flexible copper clad laminate according to the present invention has the buffer layer which is made of silicon compounds or silicon compound analogs, and formed between the base substrate and the copper foil layer, an etching process can be easily performed on the copper foil layer while maintaining excellent bonding force between the base substrate and the copper foil layer, and a degradation in the reliability of products caused by dielectric breakdown resulting from ion migration can be prevented.

    Abstract translation: 本发明涉及具有缓冲层的柔性覆铜层压板(FCCL)及其制造方法。 本发明提供了一种柔性覆铜层压板,其中由硅化合物或硅化合物类似物制成的缓冲层形成在由聚合物材料制成的基底的至少一侧上,并且在缓冲层上形成铜箔层, 以及其制造方法。 由于根据本发明的柔性覆铜层压板具有由硅化合物或硅化合物类似物制成并形成在基底基板和铜箔层之间的缓冲层,因此可以容易地对铜箔层进行蚀刻处理 同时保持基底基板和铜箔层之间的良好的结合力,并且可以防止由离子迁移引起的电介质击穿引起的产品的可靠性的劣化。

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