Abstract:
The invention relates to a projection exposure apparatus (1) for microlithography for the production of semiconductor components, in which at least one optical assembly (9a) with at least one optical element (8a) which can be actuated in a mechanically controlled manner is mounted in a structure (6), wherein, for carrying out the mechanical actuation, a control signal transmission device (11) and/or an energy transmission device (12) are/is provided, which introduce(s) no parasitic mechanical effects into the optical assembly (9a) at least during specific operating states of the projection exposure apparatus (1).
Abstract:
A projection lens of a microlithographic projection exposure system comprises a number of optical elements (15, 16, 18, 20, L1 to L4). A selected optical element (20), e.g. a mirror, can be deformed by exerting a mechanical force generated by an actuator (30, 130, 330, 430, 530). With the aid of a manipulator (26a, 26b, 26c, 126a, 126b, 226a, 226b, 326a, 326b, 326c, 426a, 426b, 426c, 526b) the spatial position of one of the optical elements and, in particular, of the deformed optical element (20) can be altered depending on the force exerted y the actuator (30; 130, 330, 430, 530). This enables tipping movements or other changes in position, which occur due to the interaction of a mounting (22a, 22b, 22c, 122a, 122b, 222a, 222b) and the forces generated by the actuator (30, 130, 330, 430, 530), to be canceled once again at least in part.
Abstract:
The invention relates to the flip-chip mounting of semiconductor chips. In order to protect against mechanical stress or damage and to electrically insulate, a protective layer (7) is applied to the rear side of the semiconductor chip (2). This protective layer can also be provided on the flanks (8) of the semiconductor chip. The protective layer can be applied before starting the entire assembly process sequence or when the semiconductor is fixed upside down to a support (1).
Abstract:
Disclosed is an imaging device (7) in a projection exposure facility (1) used in microlithography, comprising at least one optical element (10, 33, 34) and at least one manipulator (9, 36, 41) provided with a linear drive (11) for manipulating the position of the optical element (10, 33, 34). The linear drive (11) encompasses a driven section (14) and a non-driven section (15) which are movable towards each other along an axis (17). The two sections (14, 15) are at least temporarily connected to each other at least approximately parallel to the axis of movement (17) via functional elements (18) operable along an axis (17) and via functional elements (19) operable in one direction.
Abstract:
An optical point-to-multipoint connection arrangement comprises a number of ONUs connected via an optical distribution network (ODN) to an OLT containing a main CTF (CTFA) and one or more redunctant CTFs (CTFR). The CTF (CTFA) carries out ranging on at least one of the ONUs (ONUA), then CTFR requests ONUA to transmit at a given time a signal burst which it expects to receive, taking ranging into account, at time t0, but receives instead at a time t0+ delta , delta being positive or negative. CTFR then alters its own time-reference in the same direction as the delta , i.e. where delta is positive, delaying its time-reference by that amount and where delta is negative, advancing its time-reference by the same amount. The result is that, when operation is switched from the main to the redundant path, a major interruption in service is avoided.
Abstract:
A method of controlling an apparatus comprising a plurality of features and adapted to receive messages via a first network interface, wherein said method is implemented in a filter superposed on the top of an existing architecture of the apparatus. The method comprises the following steps: receiving network management message via said first network interface; interrogating said message in order to identify a feature said network management message relates to and filtering the received management message such that said management message is rejected if the identified feature is classified as disabled and said management message is allowed top go through if said feature is classified as enabled.
Abstract:
Electroplating electrolyte compositions including CA•(nA1(C 3 H 7 ) 3 (2-n)A1R 3 ) where n is 0 and less than or equal to 2; C is Li, Na, K, Rb, Cs, NR' 4 , or mixtures thereof wherein R' is H, CH 3 , C 2 H 5 , C 3 H 7 , C 4 H 9 , C 5 H 11 , C 6 H 13 , C 7 H 15 , C 8 H 17 , or mixtures thereof; A is H, F, Cl, Br, or mixtures thereof; R is H, halogen, CH 3 , C 2 H 5 , C 3 H 7 , C 4 H 9 , C 5 H 11 , C 6 H 13 , C 7 H 15 , C 8 H 17 , or mixtures thereof; and an aromatic hydrocarbon, aliphatic hydrocarbon, or mixtures thereof are described. Aluminum and magnesium/aluminum electroplating compositions including C•(nA1(C 3 H 7 ) 4 (1-n)A1R 4 ) where n is 0 and less than or equal to 1, where C is a cation such as, li, Na, K, Rb, Cs, or mixtures thereof; R is H or an alkyl such as, CH 3 , C 2 H 5 , C 3 H 7 , C 4 H 9 , C 5 H 11 , C 6 H 13 , C 7 H 15 , C 8 H 17 , or mixtures thereof are also described. The aluminum and magnesium/aluminum electroplating compositions formulation can include a solvent such as, an aromatic hydrocarbon, aliphatic hydrocarbon, or mixtures thereof.
Abstract translation:包括CA·(nA1(C3H7)3(2-n)A1R3)的电镀电解质组合物,其中n为0且小于或等于2; C是Li,Na,K,Rb,Cs,NR'4或其混合物,其中R'是H,CH 3,C 2 H 5,C 3 H 7,C 4 H 9,C 5 H 11,C 6 H 13,C 7 H 15,C 8 H 17或其混合物; A是H,F,Cl,Br或其混合物; R是H,卤素,CH 3,C 2 H 5,C 3 H 7,C 4 H 9,C 5 H 11,C 6 H 13,C 7 H 15,C 8 H 17或其混合物; 和芳烃,脂族烃或其混合物。 包括C·(nAl(C 3 H 7)4(1-n)AlR 4)的铝和镁/铝电镀组合物,其中n为0且小于或等于1,其中C为阳离子,例如,Li,Na,K,Rb ,Cs或其混合物; 还描述了R是H或诸如CH 3,C 2 H 5,C 3 H 7,C 4 H 9,C 5 H 11,C 6 H 13,C 7 H 15,C 8 H 17的烷基或其混合物的烷基。 铝和镁/铝电镀组合物制剂可以包括溶剂如芳族烃,脂族烃或其混合物。
Abstract:
The invention concerns a mould (1; 101) having a cavity (14; 114) provided with mobile surface zones (9; 107, 109) which, in order to prevent entrapped air bubble while the material to be moulded (119) is being injected, are maintained in such a way as to provide the material to be moulded with a regular linear flow surface (120). In closed position, said surface zones (208, 209) can also divide the cavity (204) into two zones (210, 211) separated from each other. After injecting the material to be moulded (206), the surface zones (208, 209) which were at first opened are brought into closed position. A mould (301), designed for making an electrical component consisting of a box in thermosetting plastic enclosing a circuit, has a cavity (303) and an injection zone connected to the cavity (303) by a runner (305, 306). The invention is characterised in that the mould has at least two runners (305, 306) for one single cavity (303), thereby enabling to optimise the flow of the material to be moulded. Moreover, filling the cavity (303) is facilitated by shortening the circulation channels.
Abstract:
The invention relates to an implement for processing, particularly sealing, ground surfaces under water, particularly bottoms and embankments of waterways, particularly canals, to a method for setting up the same, to a method for moving the same and to uses thereof. The implement comprises a plurality of parallel, polygonal hollow tubes (10, 12, 32, 34, 38), disposed next to each other at least substantially joint-free, the upper ends of which form a horizontal, at least substantially planar work platform (26), wherein each hollow tube on the outside wall thereof comprises at least one substantially horizontally extending appendage (14) having a vertically extending flange (16), disposed at the outer end thereof and at least one corresponding flange insertion opening (18) having a vertically extending longitudinal slot (20) connecting thereto at the top, the slot extending to the upper end of the hollow tube, wherein the flange insertion opening at the upper end of the hollow tube is disposed further away than the appendage having the flange and has a larger horizontal dimension than the longitudinal slot, and wherein adjoining hollow tubes by way of the respective appendage on one of the hollow tubes having a corresponding longitudinal slot are engaged in each other in the other one of the hollow tubes such that the hollow tubes cannot be moved relative to each other in the horizontal direction and that only at the outer edge of the work platform at least one hollow tube can be pulled out individually vertically upward.
Abstract:
The invention relates to a projection exposure apparatus (1) for microlithography for the production of semiconductor components, in which at least one optical assembly (9a) with at least one optical element (8a) which can be actuated in a mechanically controlled manner is mounted in a structure (6), wherein, for carrying out the mechanical actuation, a control signal transmission device (11) and/or an energy transmission device (12) are/is provided, which introduce(s) no parasitic mechanical effects into the optical assembly (9a) at least during specific operating states of the projection exposure apparatus (1).