公开(公告)号：WO2010061311A1

公开(公告)日：2010-06-03

申请号：PCT/IB2009/054988

申请日：2009-11-10

Applicant: TRONIC'S MICROSYSTEMS ,  AZOLEY, Philippe ,  GILET, Jean-Michel ,  NICOLAS, Stéphane

Inventor： AZOLEY, Philippe ,  GILET, Jean-Michel ,  NICOLAS, Stéphane

IPC: B81B7/00 ,  G01P1/02 ,  H01L23/485

CPC classification number: B81B7/007 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2203/0118 ,  G01P1/023 ,  G01P15/0802 ,  H01L24/02 ,  H01L2224/04042 ,  H01L2224/48472 ,  H01L2924/01087 ,  H01L2924/10156 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A micro-electromechanical component (70) produced from a semiconductor substrate, comprising an internal moving portion (41) which includes conductive elements (44) and contacts (60) on its outer surface, said contacts (60) being electrically connected to said conductive elements (44), said electrical contacts (60) being capable of accommodating soldered interconnect wires (84) which are themselves designed to be connected to electrical contacts (81) provided on device (80) which accommodates said component (70), characterized in that electrical contacts (60) are arranged in an area which extends between upper face (12) of the component and lateral face(13), said contacts (60) having a concave shape and having two regions capable of accommodating soldered interconnect wires, said regions(61, 62) being substantially perpendicular to each other and parallel to said upper face (12) and said lateral face (13) respectively.

Abstract translation: 一种从半导体衬底产生的微机电部件（70），包括在其外表面上包括导电元件（44）和触点（60）的内部移动部分（41），所述触点（60）电连接到所述导电 元件（44），所述电触头（60）能够容纳焊接的互连线（84），所述焊接互连线本身设计成连接到设置在容纳所述部件（70）的器件（80）上的电触头（81），其特征在于 所述电触头（60）布置在在所述部件的上表面（12）和侧面（13）之间延伸的区域中，所述触头（60）具有凹形并且具有两个能够容纳焊接互连线的区域，所述 区域（61,62）分别基本上彼此垂直并且平行于所述上表面（12）和所述侧面（13）。