SYSTEM AND METHOD FOR MANUFACTURING A THIN-FILM DEVICE
    1.
    发明申请
    SYSTEM AND METHOD FOR MANUFACTURING A THIN-FILM DEVICE 审中-公开
    制造薄膜器件的系统和方法

    公开(公告)号:WO2008016818A2

    公开(公告)日:2008-02-07

    申请号:PCT/US2007/074397

    申请日:2007-07-26

    CPC classification number: H01L29/7869 H01L27/1248 H01L27/1292 H01L29/78603

    Abstract: A thin-film device includes a plurality of circuit components defining an operational region of the thin-film device, an unpatterned channel portion (108, 340) disposed on the plurality of circuit components, and a patterned passivation dielectric (380,385) selectively disposed on the unpatterned channel portion (108, 340) to electrically pattern an active region of the unpatterned channel portion (108,340).

    Abstract translation: 薄膜器件包括限定薄膜器件的操作区域的多个电路元件,以及设置在该多个电路元件上的未图形化通道部分(108,340),以及选择性地设置在该薄膜器件上的图案化钝化电介质(380,385) 未图案化的通道部分(108,340),用于对未图案化的通道部分(108,340)的有源区域进行电图形化。

    THIN-FILM TRANSISTOR AND METHOD OF MAKING THE SAME
    2.
    发明申请
    THIN-FILM TRANSISTOR AND METHOD OF MAKING THE SAME 审中-公开
    薄膜晶体管及其制造方法

    公开(公告)号:WO2007040759A1

    公开(公告)日:2007-04-12

    申请号:PCT/US2006/029321

    申请日:2006-07-29

    CPC classification number: H01L29/6675 H01L29/41733 H01L29/78681

    Abstract: A thin-film transistor (10, 10', 10'') includes a substrate (12) having a substantially outwardly protruding support structure (14) formed thereon such that a portion (18, 20) adjacent to the structure (14) is exposed. The support structure (14) has opposed sidewalls (22, 24) sloped at an angle (theta ?1#191, theta ?2#191) relative to the substrate surface (16). A stack (26) is established over the portion (18, 20) and over a portion of an adjacent opposed sidewall (22, 24). The stack (26) includes an insulating layer (30). A channel material (46) is established on at least a portion of the stack (26), thus forming a channel (52) having a length (L) substantially determined by a thickness of the insulating layer (30) in relation to the adjacent opposed sidewall angle ( theta ?1#191, theta ?2#191).

    Abstract translation: 薄膜晶体管(10,10',10“)包括基板(12),其具有形成在其上的基本上向外突出的支撑结构(14),使得与结构(14)相邻的部分(18,20)是 裸露。 支撑结构(14)具有相对于衬底表面(16)以一定角度(θ1#191,θ2#191)倾斜的相对侧壁(22,24)。 在所述部分(18,20)之上和相邻的相对侧壁(22,24)的一部分上方建立堆叠(26)。 堆叠(26)包括绝缘层(30)。 在堆叠(26)的至少一部分上形成通道材料(46),从而形成通道(52),其具有基本上由绝缘层(30)的厚度相对于相邻的绝缘层(30)确定的长度(L) 相反的侧壁角(θ1#191,θ2#191)。

    DEPOSITING MATERIAL ON PHOTOSENSITIVE MATERIAL
    4.
    发明申请
    DEPOSITING MATERIAL ON PHOTOSENSITIVE MATERIAL 审中-公开
    沉积物对感光材料的沉积

    公开(公告)号:WO2006020349A1

    公开(公告)日:2006-02-23

    申请号:PCT/US2005/026033

    申请日:2005-07-22

    Abstract: Embodiments of methods, apparatuses, devices, and/or systems for forming a substrate with one or more conductive features formed above or thereon by depositing at least one material on or above at least a portion of at least one surface of a substrate and processing at least a portion of the at least one material, which may comprise patterning at least a portion of the deposited material and/or selectively removing at least a portion of the deposited material.

    Abstract translation: 用于形成具有一个或多个导电特征的衬底的方法,装置,器件和/或系统的实施方案,其通过在衬底的至少一个表面的至少一个表面的至少一部分上或之上沉积至少一种材料而形成在其上或上 所述至少一种材料的至少一部分,其可以包括图案化沉积材料的至少一部分和/或选择性地去除沉积材料的至少一部分。

    SYSTEM AND METHOD FOR MANUFACTURING A THIN-FILM DEVICE
    5.
    发明申请
    SYSTEM AND METHOD FOR MANUFACTURING A THIN-FILM DEVICE 审中-公开
    用于制造薄膜器件的系统和方法

    公开(公告)号:WO2008016818A3

    公开(公告)日:2008-04-10

    申请号:PCT/US2007074397

    申请日:2007-07-26

    CPC classification number: H01L29/7869 H01L27/1248 H01L27/1292 H01L29/78603

    Abstract: A thin-film device includes a plurality of circuit components defining an operational region of the thin-film device, an unpatterned channel portion (108, 340) disposed on the plurality of circuit components, and a patterned passivation dielectric (380,385) selectively disposed on the unpatterned channel portion (108, 340) to electrically pattern an active region of the unpatterned channel portion (108,340).

    Abstract translation: 薄膜器件包括限定薄膜器件的工作区域的多个电路元件,设置在多个电路元件上的未设计图案的沟道部分(108,340)以及选择性设置在图案化的钝化电介质(380,385)上的图案化钝化电介质 所述未图案化的沟道部分(108,340)用于电图案化所述未图案化的沟道部分(108,340)的有源区。

    SEMICONDUCTOR DEVICE HAVING AN OXIDE SEMICONDUCTOR CHANNEL
    6.
    发明申请
    SEMICONDUCTOR DEVICE HAVING AN OXIDE SEMICONDUCTOR CHANNEL 审中-公开
    具有氧化物半导体通道的半导体器件

    公开(公告)号:WO2006080962A1

    公开(公告)日:2006-08-03

    申请号:PCT/US2005/038814

    申请日:2005-10-25

    CPC classification number: H01L29/7869

    Abstract: An exemplary embodiment includes a semiconductor device. The semiconductor device can include a channel (108, 208) including one or more compounds of the formula A x B x O x , wherein each A is selected from the group of Cu, Ag, Sb, each B is selected from the group of Cu, Ag, Sb, Zn, Cd, Ga, In, Ge, Sn, and Pb, each O is atomic oxygen, each x is independently a non-zero integer, and each of A and B are different.

    Abstract translation: 示例性实施例包括半导体器件。 该半导体器件可以包括通道(108,208),其包括一种或多种下式的化合物:其中每个 A选自Cu,Ag,Sb组,每个B选自Cu,Ag,Sb,Zn,Cd,Ga,In,Ge,Sn和Pb中的每一个,每个O是原子氧,每个x 独立地为非零整数,A和B各自不同。

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