Abstract:
In a transistor including an oxide semiconductor, a variation in electrical characteristics is suppressed and reliability is improved. A semiconductor device includes a transistor. The transistor includes a first gate electrode, a first insulating film over the first gate electrode, an oxide semiconductor film over the first insulating film, a second insulating film over the oxide semiconductor film, a second gate electrode over the second insulating film, and a third insulating film over the oxide semiconductor film and the second gate electrode. The oxide semiconductor film includes a channel region overlapping with the second gate electrode, a source region in contact with the third insulating film, and a drain region in contact with the third insulating film. The first gate electrode and the second gate electrode are electrically connected to each other. A difference between a minimum value and a maximum value of the field-effect mobility in the case where the field-effect mobility in a saturation region of the transistor is measured.
Abstract:
A method of providing a conducting structure over a substrate, which comprises: disposing a lower sub-layer over a substrate, the lower sub-layer comprising a conductive metal oxide material that includes indium and zinc, wherein the indium and zinc content in the bottom sub-layer substantially defines a first indium to zinc content ratio; performing a first hydrogen treatment over an exposed surface of the lower sub-layer for introducing hydrogen content therein; disposing a middle sub-layer over the lower sub-layer, the middle sub-layer comprising a metal material; disposing an upper sub-layer over the middle sub-layer, the upper sub-layer comprising a conductive metal oxide material that includes indium and zinc, wherein the indium and the zinc content in the upper sub-layer substantially defines a second indium to zinc content ratio smaller than the first indium to zinc content ratio; and patterning the multi-layered conductive structure to generate a composite lateral etch profile.
Abstract:
Field effect transistor stacks include a first field-effect transistor having a source finger, a drain finger, and a gate finger interposed therebetween, the source finger and the drain finger of the first field-effect transistor being separated by a first drain-to- source distance, and a second field-effect transistor in a series connection with the first field-effect transistor, the second field-effect transistor having a source finger, a drain finger, and a gate finger interposed therebetween, the source finger and the drain finger of the second field-effect transistor being separated by a second drain-to-source distance that is different than the first drain-to-source distance.
Abstract:
Provided is a thin film transistor. The thin film transistor includes an active layer (6), and a source electrode (4) and a drain electrode (5) on the active layer (6). Each of the source electrode (4) and the drain electrode (5) includes a metal electrode sub-layer (1) and a diffusion barrier sub-layer (2) made of a material comprising M1O a N b , wherein M1 is single metal or a combination of metals, a≥0, and b>0, between the metal electrode sub-layer (1) and the active layer (6) for preventing diffusion of metal electrode material into the active layer (6).
Abstract translation:提供一种薄膜晶体管。 薄膜晶体管包括有源层(6),以及在有源层(6)上的源电极(4)和漏电极(5)。 源电极(4)和漏电极(5)中的每一个包括金属电极子层(1)和由包含M1O aN b的材料制成的扩散阻挡子层(2),其中M1是单金属或 金属电极子层(1)和有源层(6)之间的金属a≥0和b> 0的组合,用于防止金属电极材料扩散到有源层(6)中。
Abstract:
The present disclosure provides a thin-film transistor. The thin-film transistor includes a substrate including at least one trench; at least one electrode in each of the at least one trench, the at least one electrode being one or more of a gate electrode, a source electrode, and a drain electrode; and an active layer over the at least one electrode.