Abstract:
An active fuse includes an active fuse geometry (120) that is used to form both a variable resistor (106) and a select transistor (110). In one embodiment, the active fuse geometry is formed in a portion of an active region (160) of a semiconductor substrate (140), and a select gate (124) is disposed over an end portion (123) of the active fuse geometry to form an integral select transistor (110) for use in programming the active fuse. The use of a shared active fuse geometry within the active region allows for reduced area requirements and improved sensing margins.
Abstract:
A memory system (10) including a one time programmable (OTP) memory (16) is provided. The memory system (10) further includes a write enable verification circuit (14) including an asymmetric inverter stage (30) and a symmetric inverter stage (32) coupled at a node (34). The write enable verification circuit (14) is configured to receive a write enable signal. When the write enable signal changes from a first voltage level to a second voltage level, a voltage at the node (34) changes at a first rate and wherein when the write enable signal changes from the second voltage level to the first voltage level, the voltage at the node (34) changes at a second rate higher than the first rate. The write enable verification circuit (14) is further configured to generate a verified write enable signal for enabling programming of the OTP memory (16).
Abstract:
A memory system (10) including a one time programmable (OTP) memory (16) is provided. The memory system (10) further includes a write enable verification circuit (14) including an asymmetric inverter stage (30) and a symmetric inverter stage (32) coupled at a node (34). The write enable verification circuit (14) is configured to receive a write enable signal. When the write enable signal changes from a first voltage level to a second voltage level, a voltage at the node (34) changes at a first rate and wherein when the write enable signal changes from the second voltage level to the first voltage level, the voltage at the node (34) changes at a second rate higher than the first rate. The write enable verification circuit (14) is further configured to generate a verified write enable signal for enabling programming of the OTP memory (16).
Abstract:
The fuse array (40) described herein is very compact and uses little semiconductor area because of its crosspoint architecture. The disclosed crosspoint architecture reduces the number of conductors that must be run horizontally or vertically through each bit cell (for example, 50 and 60). As a result, the area required for each bit cell is significantly reduced. In one embodiment, a selected set of voltages on various wordlines (70, 72, 74) and bitlines (80, 82, 84) are used to program the fuses (60-68) to produce programmed fuses having a tighter distribution of impedances. Similarly, a selected set of voltages on various wordlines (70, 72, 74) and bitlines (80, 82, 84) are used to read the fuses (60-68).
Abstract:
A programmable fuse (120) and method of formation utilizing a layer of silicon germanium (SiGe) (e.g. monocrystalline) (105) as a thermal insulator to contain heat generated during programming. The programmable fuse, in some examples, may be devoid of any dielectric materials between a conductive layer (107) and a substrate (103). In one example, the conductive layer (107) serves as programmable material, that in a low impedance state, electrically couples conductive structures (119 and 117). A programming current is applied to the programmable material to modify the programmable material to place the fuse in a high impedance state.
Abstract:
A programmable fuse (120) and method of formation utilizing a layer of silicon germanium (SiGe) (e.g. monocrystalline) (105) as a thermal insulator to contain heat generated during programming. The programmable fuse, in some examples, may be devoid of any dielectric materials between a conductive layer (107) and a substrate (103). In one example, the conductive layer (107) serves as programmable material, that in a low impedance state, electrically couples conductive structures (119 and 117). A programming current is applied to the programmable material to modify the programmable material to place the fuse in a high impedance state.
Abstract:
A device having an OTP memory (100) is disclosed. A program state of the OTP device (100) is stored at a fuse (106) that is connected in series between a first node (120) and a latch (102). During a program mode, the first node (120) is electrically connected to a program voltage. During a read mode, the first node (120) is electrically connected to ground, whereby a first divided voltage is generated at a first node of the latch.
Abstract:
An active fuse includes an active fuse geometry (120) that is used to form both a variable resistor (106) and a select transistor (110). In one embodiment, the active fuse geometry is formed in a portion of an active region (160) of a semiconductor substrate (140), and a select gate (124) is disposed over an end portion (123) of the active fuse geometry to form an integral select transistor (110) for use in programming the active fuse. The use of a shared active fuse geometry within the active region allows for reduced area requirements and improved sensing margins.
Abstract:
A device having an OTP memory (100) is disclosed. A program state of the OTP device (100) is stored at a fuse (106) that is connected in series between a first node (120) and a latch (102). During a program mode, the first node (120) is electrically connected to a program voltage. During a read mode, the first node (120) is electrically connected to ground, whereby a first divided voltage is generated at a first node of the latch.
Abstract:
A memory ( 10) not only uses redundant cells (16, 18) but also redundant references (120, 122) to reduce the likelihood of a failure. In one approach a failure in a reference (20, 22) can cause both the primary cell (12, 14) as well as the redundant cell (16, 18) to be ineffective. To overcome this potential problem two references (20, 120) for each bit are employed. In one form, the primary cell (12) of a first bit is compared to one reference (20) and the redundant cell (16) of the first bit is compared to another reference (22). The primary (14) and redundant cell (18) of a second bit can use these two references (20, 22) as well.