公开(公告)号：WO2010132181A2

公开(公告)日：2010-11-18

申请号：PCT/US2010031802

申请日：2010-04-20

申请人： APPLIED MATERIALS INC ,  CHEN HUNG CHIH ,  HSU SAMUEL CHU-CHIANG ,  DANDAVATE GAUTAM ,  KOOSAU DENIS M

发明人： CHEN HUNG CHIH ,  HSU SAMUEL CHU-CHIANG ,  DANDAVATE GAUTAM ,  KOOSAU DENIS M

IPC分类号： H01L21/304 ,  B24B41/06 ,  H01L21/683

CPC分类号： B24B37/30 ,  B24B41/06

摘要： A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. In one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly having a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided.

摘要翻译： 提供了一种用于化学机械抛光的方法和装置，更具体地涉及一种用于化学机械抛光的载体的方法和装置。 在一个实施例中，所述承载头组件包括用于向所述基底提供支撑的基座组件，安装在所述基座组件上的柔性膜，所述基座组件具有大致圆形的中心部分，所述中心部分具有提供衬底安装表面的下表面，以及多个可独立加压的腔室 形成在基部组件和柔性膜之间，包括环形外室和非圆形内腔。

公开(公告)号：WO2012012056A3

公开(公告)日：2012-04-12

申请号：PCT/US2011040745

申请日：2011-06-16

申请人： APPLIED MATERIALS INC ,  CHEN HUNG CHIH ,  HSU SAMUEL CHU-CHIANG ,  SHASHANK GAUTAM ,  KOOSAU DENIS M

发明人： CHEN HUNG CHIH ,  HSU SAMUEL CHU-CHIANG ,  SHASHANK GAUTAM ,  KOOSAU DENIS M

IPC分类号： H01L21/304

CPC分类号： B24B37/32

摘要： Embodiments of the present invention generally relate to methods for chemical mechanical polishing a substrate. The methods generally include coupling a first substrate to be polished to a dummy substrate, and removing a portion of the backside of the first substrate to reduce the thickness of the first substrate. The first substrate and the dummy substrate are positioned in a carrier head assembly comprising an inflatable membrane and a support ring. The first substrate is placed in contact with a polishing pad to reduce the surface roughness of the backside of the first substrate. The support ring restricts lateral movement of the inflatable membrane to prevent the first substrate from contacting an interior surface of the carrier head assembly. The support ring is sized to allow vertical movement of the inflatable membrane within the carrier head assembly.

摘要翻译： 本发明的实施例总体上涉及用于化学机械抛光基板的方法。 该方法通常包括将要被抛光的第一衬底耦合到虚拟衬底，并且去除第一衬底的背面的一部分以减小第一衬底的厚度。 第一衬底和虚拟衬底位于包括可膨胀膜和支撑环的载体头组件中。 将第一衬底放置成与抛光垫接触以降低第一衬底的背面的表面粗糙度。 支撑环限制可膨胀膜的横向移动，以防止第一基板接触载体头组件的内表面。 支撑环的尺寸设定为允许可充气膜在载体头组件内垂直移动。

公开(公告)号：WO2012019144A3

公开(公告)日：2012-06-07

申请号：PCT/US2011046828

申请日：2011-08-05

申请人： APPLIED MATERIALS INC ,  CHEN HUNG CHIH ,  HSU SAMUEL CHU-CHIANG ,  YUAN YIN ,  ZHANG HUANBO ,  DANDAVATE GAUTAM SHASHANK ,  SILVETTI MARIO DAVID

发明人： CHEN HUNG CHIH ,  HSU SAMUEL CHU-CHIANG ,  YUAN YIN ,  ZHANG HUANBO ,  DANDAVATE GAUTAM SHASHANK ,  SILVETTI MARIO DAVID

IPC分类号： H01L21/304

CPC分类号： B24B41/06 ,  B24B37/32 ,  B24B41/067

摘要： A carrier head for a chemical mechanical polisher includes base, a substrate mounting surface, an annular inner ring, and an annular outer ring. The inner ring has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. The inner ring is vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad. The outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. The lower surface of the inner ring has a first width, and the lower surface of the outer ring has a second width greater than the first width.

摘要翻译： 用于化学机械抛光机的载具头包括基座，基板安装表面，环形内环和环形外环。 内环具有构造为沿周向环绕定位在基板安装表面上的基板的边缘，外表面和接触抛光垫的下表面的内表面。 内环相对于基板安装表面可垂直移动。 外环具有周向围绕内环的内表面，外表面和接触抛光垫的下表面。 外环相对于并独立于基板安装表面和内环可垂直移动。 内圈的下表面具有第一宽度，并且外圈的下表面具有大于第一宽度的第二宽度。

公开(公告)号：WO2012012056A2

公开(公告)日：2012-01-26

申请号：PCT/US2011/040745

申请日：2011-06-16

申请人： APPLIED MATERIALS, INC. ,  CHEN, Hung Chih ,  HSU, Samuel Chu-Chiang ,  SHASHANK, Gautam ,  KOOSAU, Denis M.

发明人： CHEN, Hung Chih ,  HSU, Samuel Chu-Chiang ,  SHASHANK, Gautam ,  KOOSAU, Denis M.

IPC分类号： H01L21/304

CPC分类号： B24B37/32

摘要： Embodiments of the present invention generally relate to methods for chemical mechanical polishing a substrate. The methods generally include coupling a first substrate to be polished to a dummy substrate, and removing a portion of the backside of the first substrate to reduce the thickness of the first substrate. The first substrate and the dummy substrate are positioned in a carrier head assembly comprising an inflatable membrane and a support ring. The first substrate is placed in contact with a polishing pad to reduce the surface roughness of the backside of the first substrate. The support ring restricts lateral movement of the inflatable membrane to prevent the first substrate from contacting an interior surface of the carrier head assembly. The support ring is sized to allow vertical movement of the inflatable membrane within the carrier head assembly.

摘要翻译： 本发明的实施方案通常涉及用于化学机械抛光衬底的方法。 所述方法通常包括将要抛光的第一衬底耦合到虚设衬底，以及去除第一衬底的背面的一部分以减小第一衬底的厚度。 第一基板和虚设基板被定位在包括可充气膜和支撑环的载体头组件中。 将第一基板放置成与抛光垫接触以减小第一基板的背面的表面粗糙度。 支撑环限制可膨胀膜的横向移动，以防止第一基底接触载体头部组件的内表面。 支撑环的尺寸设置成允许可充气膜在承载头组件内的垂直运动。

公开(公告)号：WO2010132181A3

公开(公告)日：2010-11-18

申请号：PCT/US2010/031802

申请日：2010-04-20

申请人： APPLIED MATERIALS, INC. ,  CHEN, Hung Chih ,  HSU, Samuel Chu-Chiang ,  DANDAVATE, Gautam ,  KOOSAU, Denis M.

发明人： CHEN, Hung Chih ,  HSU, Samuel Chu-Chiang ,  DANDAVATE, Gautam ,  KOOSAU, Denis M.

IPC分类号： H01L21/304 ,  H01L21/683

摘要： A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. In one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly having a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided.

公开(公告)号：WO2015074239A1

公开(公告)日：2015-05-28

申请号：PCT/CN2013/087664

申请日：2013-11-22

申请人： INTEL CORPORATION ,  CHEN, Weike ,  TANG, Li-An ,  LUEH, Guei-Yuan ,  YUAN, Hao ,  HSU, Samuel

发明人： CHEN, Weike ,  TANG, Li-An ,  LUEH, Guei-Yuan ,  YUAN, Hao ,  HSU, Samuel

IPC分类号： G06F9/46

CPC分类号： G06T1/20 ,  G06F9/4843 ,  G06F9/5016 ,  G06T2200/28

摘要： In an embodiment, at least one computer readable storage medium has instructions stored thereon for causing a system to send, from a processor to a task execution device, a first call to execute a first subroutine of a set of chained subroutines. The first subroutine may have a first subroutine output argument that includes a first token to indicate that first output data from execution of the first subroutine is intermediate data of the set of chained subroutines. The instructions are also for causing the system, responsive to inclusion of the first token in the first subroutine output argument, to enable the processor to execute one or more operations while the task execution device executes the first subroutine. Other embodiments are described and claimed.

摘要翻译： 在一个实施例中，至少一个计算机可读存储介质具有存储在其上的指令，用于使系统从处理器向任务执行装置发送执行一组链接子例程的第一子例程的第一调用。 第一子程序可以具有包括第一令牌的第一子程序输出参数，以指示来自第一子例程的执行的第一输出数据是该组链接子程序的中间数据。 所述指令还用于使所述系统响应于将所述第一令牌包括在所述第一子程序输出参数中，以使得所述处理器在所述任务执行装置执行所述第一子程序时执行一个或多个操作。 描述和要求保护其他实施例。

公开(公告)号：WO2012021215A3

公开(公告)日：2012-04-12

申请号：PCT/US2011040630

申请日：2011-06-16

申请人： APPLIED MATERIALS INC ,  CHEN HUNG CHIH ,  HSU SAMUEL CHU-CHIANG ,  DANDAVATE GAUTAM SHASHANK ,  KOOSAU DENIS M

发明人： CHEN HUNG CHIH ,  HSU SAMUEL CHU-CHIANG ,  DANDAVATE GAUTAM SHASHANK ,  KOOSAU DENIS M

IPC分类号： H01L21/304

CPC分类号： B24B37/30 ,  B24B37/015

摘要： Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.

摘要翻译： 本发明的实施例涉及用于改善抛光工艺的均匀性的设备和方法。 本发明的实施例提供了一种加热机构，该加热机构被配置为在抛光期间将热能施加到基板的周边，或者被配置为在抛光期间冷却基板的中心区域的冷却机构，或者被配置为产生温度阶跃的偏置加热机构 抛光垫给定半径上的差异。

公开(公告)号：WO2012021215A2

公开(公告)日：2012-02-16

申请号：PCT/US2011/040630

申请日：2011-06-16

申请人： APPLIED MATERIALS, INC. ,  CHEN, Hung Chih ,  HSU, Samuel Chu-Chiang ,  DANDAVATE, Gautam Shashank ,  KOOSAU, Denis M.

发明人： CHEN, Hung Chih ,  HSU, Samuel Chu-Chiang ,  DANDAVATE, Gautam Shashank ,  KOOSAU, Denis M.

IPC分类号： H01L21/304

CPC分类号： B24B37/30 ,  B24B37/015

摘要： Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.

摘要翻译： 本发明的实施例涉及用于提高抛光工艺的均匀性的装置和方法。 本发明的实施例提供了一种加热机构，其被配置为在抛光期间将热能施加到基板的周边，或者构造成在抛光期间冷却基板的中心区域的冷却机构，或者构造成产生温度步长的偏置加热机构 抛光垫的给定半径上的微分。

公开(公告)号：WO2012019144A2

公开(公告)日：2012-02-09

申请号：PCT/US2011/046828

申请日：2011-08-05

申请人： APPLIED MATERIALS, INC. ,  CHEN, Hung Chih ,  HSU, Samuel Chu-Chiang ,  YUAN, Yin ,  ZHANG, Huanbo ,  DANDAVATE, Gautam Shashank ,  SILVETTI, Mario David

发明人： CHEN, Hung Chih ,  HSU, Samuel Chu-Chiang ,  YUAN, Yin ,  ZHANG, Huanbo ,  DANDAVATE, Gautam Shashank ,  SILVETTI, Mario David

IPC分类号： H01L21/304

CPC分类号： B24B41/06 ,  B24B37/32 ,  B24B41/067

摘要： A carrier head for a chemical mechanical polisher includes base, a substrate mounting surface, an annular inner ring, and an annular outer ring. The inner ring has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. The inner ring is vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad. The outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. The lower surface of the inner ring has a first width, and the lower surface of the outer ring has a second width greater than the first width.

摘要翻译： 用于化学机械抛光机的载体头包括基底，基底安装表面，环形内环和环形外环。 所述内圈具有内表面，所述内表面被构造为围绕位于所述基板安装表面上的基板的边缘，外表面和与所述抛光垫接触的下表面。 内环可相对于基板安装表面垂直移动。 外环具有周向包围内环的内表面，外表面和与抛光垫接触的下表面。 外环可以相对于衬底安装表面和内环独立地上下移动。 内圈的下表面具有第一宽度，并且外环的下表面具有大于第一宽度的第二宽度。