CUTTING ELEMENTS WITH RE-PROCESSED THERMALLY STABLE POLYCRYSTALLINE DIAMOND CUTTING LAYERS, BITS INCORPORATING THE SAME, AND METHODS OF MAKING THE SAME
    3.
    发明申请
    CUTTING ELEMENTS WITH RE-PROCESSED THERMALLY STABLE POLYCRYSTALLINE DIAMOND CUTTING LAYERS, BITS INCORPORATING THE SAME, AND METHODS OF MAKING THE SAME 审中-公开
    具有经过再处理的热稳定多晶体金刚石切削层的切削元件,包含该金刚石切削层的钻头以及制造该钻头的方法

    公开(公告)号:WO2010129811A3

    公开(公告)日:2010-11-11

    申请号:PCT/US2010/033933

    申请日:2010-05-06

    Abstract: A method of re-processing used TSP material layers to form cutting elements, bits with such cutting elements mounted on their bodies, and bits having re-processed TSP material layers attached to their bodies, as well as such cutting elements and bits are provided. The method includes providing a used TSP material cutting element having a TSP material layer and substrate, or a bit having a TSP material layer attached to the bit, removing the used TSP material layer from the cutting element or bit, cutting the used TSP material layer to a new shape, if necessary, optionally re-leaching the used TSP layer and re-using the TSP material layer to form a cutting element, or in forming a bit body. The formed cutting element may be mounted on a bit body.

    Abstract translation: 一种重新处理使用过的TSP材料层以形成切削元件,具有安装在它们的主体上的这种切削元件的钻头和重新处理的TSP材料层附接到它们的主体的钻头的方法,以及 提供这种切割元件和钻头。 该方法包括提供具有TSP材料层和衬底的使用过的TSP材料切削元件或具有附接到钻头的TSP材料层的钻头,从切削元件或钻头移除使用过的TSP材料层,切割使用过的TSP材料层 如果需要,可以选择性地重新浸出使用过的TSP层并重新使用TSP材料层以形成切割元件或形成钻头体。 成形的切割元件可以安装在钻头体上。

    METHOD OF DESIGNING A BOTTOM HOLE ASSEMBLY AND A BOTTOM HOLE ASSEMBLY
    4.
    发明申请
    METHOD OF DESIGNING A BOTTOM HOLE ASSEMBLY AND A BOTTOM HOLE ASSEMBLY 审中-公开
    设计底部孔组件和底部孔组件的方法

    公开(公告)号:WO2010080476A2

    公开(公告)日:2010-07-15

    申请号:PCT/US2009/068398

    申请日:2009-12-17

    CPC classification number: E21B10/36 C22C26/00 E21B10/43 E21B10/55 E21B10/567

    Abstract: A bottom hole assembly containing a drill bit. The drill bit additionally has a plurality of primary cutter elements mounted thereto. The plurality of cutter elements comprise one or more first cutter elements and one or more second cutter elements. The second cutter element differs from the first cutter element in at least one cutter element property. The first cutter element has a diamond body containing a first region comprising an infiltrant material disposed within the interstitial regions. The first region is located remote from the working surface of the diamond body. The first cutter element also contains a second region comprising interstitial regions that are substantially free of the infiltrant material. The second region is located along at least the working surface of the diamond body. Also included are a cutter element, method of designing a bottom hole assembly as well as method of designing a drill bit.

    Abstract translation:

    包含钻头的底部钻具组合。 钻头还具有安装在其上的多个主切割元件。 多个切割元件包括一个或多个第一切割元件和一个或多个第二切割元件。 第二刀具元件在至少一个刀具元件属性方面与第一刀具元件不同。 第一切割元件具有包含第一区域的金刚石主体,该第一区域包括设置在间隙区域内的浸渗材料。 第一个区域远离钻石体的工作表面。 第一切割元件还包含第二区域,该第二区域包括基本上不含浸渗材料的间隙区域。 第二区域至少沿着钻石体的工作表面定位。 还包括一个刀具元件,设计底部钻具组合的方法以及设计钻头的方法。

    CUTTING ELEMENTS WITH RE-PROCESSED THERMALLY STABLE POLYCRYSTALLINE DIAMOND CUTTING LAYERS, BITS INCORPORATING THE SAME, AND METHODS OF MAKING THE SAME
    7.
    发明申请
    CUTTING ELEMENTS WITH RE-PROCESSED THERMALLY STABLE POLYCRYSTALLINE DIAMOND CUTTING LAYERS, BITS INCORPORATING THE SAME, AND METHODS OF MAKING THE SAME 审中-公开
    具有再加工的热稳定的多晶金刚石切割层的切割元件,与其相同的部件及其制造方法

    公开(公告)号:WO2010129811A2

    公开(公告)日:2010-11-11

    申请号:PCT/US2010033933

    申请日:2010-05-06

    Abstract: A method of re-processing used TSP material layers to form cutting elements, bits with such cutting elements mounted on their bodies, and bits having re-processed TSP material layers attached to their bodies, as well as such cutting elements and bits are provided. The method includes providing a used TSP material cutting element having a TSP material layer and substrate, or a bit having a TSP material layer attached to the bit, removing the used TSP material layer from the cutting element or bit, cutting the used TSP material layer to a new shape, if necessary, optionally re-leaching the used TSP layer and re-using the TSP material layer to form a cutting element, or in forming a bit body. The formed cutting element may be mounted on a bit body.

    Abstract translation: 提供了一种重新处理使用的TSP材料层以形成切割元件的方法,具有安装在其主体上的这种切割元件的钻头以及连接到其主体上的具有重新处理的TSP材料层的钻头以及这些切割元件和钻头。 该方法包括提供具有TSP材料层和衬底的已使用的TSP材料切割元件,或者具有附接到该钻头的TSP材料层的钻头,从切割元件或钻头中去除所使用的TSP材料层,切割所使用的TSP材料层 如果需要,可选地再次浸出所使用的TSP层并重新使用TSP材料层以形成切割元件,或者形成钻头体。 成形的切割元件可以安装在钻头体上。

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