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公开(公告)号：WO2011014281A1
公开(公告)日：2011-02-03
申请号：PCT/US2010/032658
申请日：2010-04-28
申请人： MACDERMID, INCORPORATED , LETIZE, Adam , KROL, Andrew, M. , LONG, Ernest , CASTALDI, Steven, A.
IPC分类号： H01L21/44
CPC分类号： H01L31/02168 , H01L21/3105 , H01L21/31144 , H01L31/022425 , Y02E10/50
摘要： A method of forming a resist pattern on a silicon semiconductor substrate having an anti-reflective layer thereon is described. The method includes the steps of a) modifying surface energy of the anti-reflective surface with a chemical treatment composition, b) applying a UV etch resist to the treated anti -reflective surface, and c) exposing the anti-reflective surface to a wet chemical etchant composition to remove exposed areas of the anti -reflective surface. Thereafter, the substrate can be metallized to provide a conductor pattern. The method may be used to produce silicon solar cells.
摘要翻译： 描述了在其上具有抗反射层的硅半导体衬底上形成抗蚀剂图案的方法。 该方法包括以下步骤：a）用化学处理组合物改性抗反射表面的表面能，b）对经处理的抗反射表面施加UV蚀刻抗蚀剂，和c）将抗反射表面暴露于湿 化学蚀刻剂组合物以去除防反射表面的暴露区域。 此后，可以将衬底金属化以提供导体图案。 该方法可用于生产硅太阳能电池。
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公开(公告)号：WO2010147695A1
公开(公告)日：2010-12-23
申请号：PCT/US2010/030313
申请日：2010-04-08
发明人： HAMILTON, Robert , WOJTASZEK, Mark
IPC分类号： C25D5/02
CPC分类号： C23C18/1607 , C23C18/1608 , C23C18/1641 , C23C18/1653 , C23C18/166 , C23C18/2046 , C23C18/2086 , C23C18/30 , C23C18/36 , C23C18/40
摘要： The present invention relates to a method of selectively plating a plastic article comprising a first polymer resin portion and a second polymer resin portion, wherein said first polymer resin portion is not rendered plateable by sulfonation and said second polymer resin portion is rendered plateable by sulfonation. The method comprises the steps of sulfonating the plastic article, activating the sulfonated plastic article to accept plating thereon, and plating the sulfonated and activated article in an electroless plating bath. The plastic article is selectively plated such that the first polymer resin portion does not have plating thereon and the second polymer resin portion is elecrolessly plated.
摘要翻译： 本发明涉及一种选择性地镀覆包含第一聚合物树脂部分和第二聚合物树脂部分的塑料制品的方法，其中所述第一聚合物树脂部分不能通过磺化而使其平版化，并且所述第二聚合物树脂部分通过磺化使其平版化。 该方法包括以下步骤：将塑料制品磺化，活化磺化塑料制品以在其上接受电镀，并将磺化和活化的物品镀在化学镀浴中。 选择性地对塑料制品进行电镀，使得第一聚合物树脂部分不具有电镀，并且第二聚合物树脂部分被无电镀。
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公开(公告)号：WO2010044957A1
公开(公告)日：2010-04-22
申请号：PCT/US2009/055317
申请日：2009-08-28
IPC分类号： C25D3/56
CPC分类号： C25D3/565
摘要： The present invention relates to the electrodeposition of zinc nickel alloy on a variety of electrically conducting substrates in a medium which seeks to provide improved deposit distribution and operable current density range. This is achieved through a bath comprising zinc ions, nickel metal ions, and a suitable combination of one or more urea based polymers and non-polymeric complexing agents capable of holding nickel metal ions in alkaline solution and an electrolytic process whereby the bath is used to electrodeposit zinc nickel alloy on electrically conducting substrates.
摘要翻译： 本发明涉及锌镍合金在介质中的各种导电衬底上的电沉积，其寻求提供改善的沉积物分布和可操作的电流密度范围。 这通过包含锌离子，镍金属离子和能够在碱性溶液中保持镍金属离子的一种或多种尿素基聚合物和非聚合物络合剂的合适的组合以及电解方法来实现，由此将浴用于 在导电基板上电沉积锌镍合金。
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公开(公告)号：WO2009117187A1
公开(公告)日：2009-09-24
申请号：PCT/US2009/033641
申请日：2009-02-10
发明人： WOJTASZEK, Mark , HAMILTON, Robert
IPC分类号： C23C18/54
CPC分类号： H05K3/182 , C23C18/1607 , C23C18/1608 , C23C18/1641 , C23C18/24 , C23C18/31 , H05K1/0373 , H05K2201/09118 , H05K2203/0713 , Y10T428/31504
摘要： The present invention relates to a method of incorporating a catalytic poison into a non-plating grade resin portion of a double shot molded plastic part, to retard the tendency of any electroless plating chemistry to be deposited on that portion that contains the catalytic poison. After surface treatment, only one portion of the molded part becomes receptive to electroless plating while the other portion does not.
摘要翻译： 本发明涉及一种将催化毒物掺入双注射成型塑料部件的非电镀级树脂部分中的方法，以阻止任何化学镀化学沉积在含有催化毒物的部分上的倾向。 在表面处理之后，只有一部分成型部件接受化学镀，而另一部分不成型。
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5.发明申请
公开(公告)号：WO2008020910A2
公开(公告)日：2008-02-21
申请号：PCT/US2007/013935
申请日：2007-06-14
IPC分类号： B05D1/18
CPC分类号： H05K3/385 , C23C18/1831 , C23C18/24 , C23C18/31 , C23C18/32 , C23C22/362 , C23C28/00 , C23C28/04 , H05K3/383 , H05K3/384 , H05K2203/072 , H05K2203/073
摘要： A process is disclosed for the purpose of increasing the adhesion of a polymeric material to a metal surface. The process comprises plating the metal surface with a layer of electroless nickel, electroless cobalt or electroless (or immersion) tin followed by phosphating the plated layer prior to bonding the polymeric material thereto. The process is particularly suited to treating printed circuit board inner-layers and lead frames.
摘要翻译： 公开了一种用于增加聚合物材料对金属表面的粘附性的方法。 该方法包括用化学镀镍，无电解钴或无电镀（或浸渍）锡层镀金属表面，然后在将聚合材料粘合到其之前使镀层磷化。 该方法特别适用于处理印刷电路板内层和引线框架。
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公开(公告)号：WO2007126516A2
公开(公告)日：2007-11-08
申请号：PCT/US2007/005105
申请日：2007-02-27
CPC分类号： H05K3/061 , B41M5/0047 , B41M5/0058 , C23F1/18 , H05K3/383 , H05K2203/013 , H05K2203/1173
摘要： A process for printing inks or organic resists using a droplet discharge printing mechanism onto a copper or copper alloy surface with increased resolution is described. The increased resolution is achieved by first preferably microetching the surface and then treating the copper surface with an organic substance which is capable of lowering the surface energy of the copper surface or capable of making the copper surface more hydrophobic prior to printing thereon. The process is useful in the manufacture of electronic circuits.
摘要翻译： 描述了使用液滴喷射印刷机构将印刷油墨或有机抗蚀剂印刷到铜或铜合金表面上的分辨率提高的方法。 通过首先优选对表面进行微蚀刻，然后用能够降低铜表面的能量或能够使铜表面在其上印刷之前更具疏水性的有机物质来处理铜表面来实现增加的分辨率。 该方法在电子电路的制造中是有用的。
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7.发明申请POLYIMIDE SUBSTRATE AND METHOD OF MANUFACTURING PRINTED WIRING BOARD USING THE SAME 审中-公开聚酰亚胺基板和使用该基板制造印刷线路板的方法
公开(公告)号：WO2007111671A1
公开(公告)日：2007-10-04
申请号：PCT/US2006/049016
申请日：2006-12-21
CPC分类号： H05K3/181 , C08J7/12 , C08J7/123 , C08J2379/08 , C23C18/1651 , C23C18/1653 , C23C18/2006 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/32 , H05K1/0346 , H05K3/381 , H05K2201/0344 , H05K2203/0793 , H05K2203/095 , H05K2203/097
摘要： The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, arid plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.
摘要翻译： 本发明涉及用于金属化聚合物基材如聚酰亚胺的改进方法。 本发明包括以下步骤：用等离子体喷射或电晕放电表面处理对聚合物基材进行表面处理，用包含氢氧化物和离子钯的蚀刻溶液调节和蚀刻聚合物基材，用离子钯活化聚合物基材，还原钯 在聚合物基底上，将化学镀镍层镀在制备的聚合物基底上，并在化学镀镍层上镀敷无电镀铜层。 本发明的方法提供了一种改进的制备聚合物基材的方法，用于随后的电解电镀。
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公开(公告)号：WO2007078355A2
公开(公告)日：2007-07-12
申请号：PCT/US2006/036185
申请日：2006-09-15
CPC分类号： C23F1/18 , C23F1/16 , H01L21/32134 , H05K3/383 , H05K2203/122
摘要： The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.
摘要翻译： 本发明涉及包含铜离子源，酸，腈化合物和卤化物离子源的微蚀刻组合物。 其他添加剂，包括有机溶剂，钼离子源，胺，聚胺和丙烯酰胺也可包括在本发明的组合物中。 本发明还涉及一种对铜或铜合金表面进行微蚀刻以增加铜表面与聚合物材料的粘合性的方法，该方法包括以下步骤：使铜或铜合金表面与本发明的组合物接触，然后键合 聚合物材料到铜或铜合金表面。
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公开(公告)号：WO2006084064A3
公开(公告)日：2006-08-10
申请号：PCT/US2006/003730
申请日：2006-02-02
发明人： CROUSE, Kenneth
IPC分类号： C25D5/02
摘要： A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles, for creating circuitry for smart cards, such as phone cards, and for providing electromagnetic shielding of electronic devices is provided. The method comprises the steps of catalyzing the non-conductive substrate by applying a catalytic ink, reducing a source of catalytic metal ions in the catalytic ink to its associated metal, depositing electroless metal on the pattern of catalytic ink on the surface of the substrate; and plating electrolytic metal on the electroless metal layer to produce the desired pattern of metal on the non-conductive substrate. The catalytic ink typically comprises one or more solvents, a source of catalytic metal ions, a crosslinking agent, one or more copolymers, a polyurethane polymer, and, optionally, one or more fillers.
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公开(公告)号：WO2006043994A2
公开(公告)日：2006-04-27
申请号：PCT/US2005/020635
申请日：2005-06-10
CPC分类号： C25D3/38 , C25D5/34 , H05K3/0055 , H05K3/383 , H05K3/424 , H05K3/427 , H05K2201/0323
摘要： A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after desmear, with a combined neutralization/sacrificial coating solution followed by treatment with a carbon dispersion solution. The combined neutralization/sacrificial coating solution neutralizes permanganate residues from the desmear step and applies a sacrificial coating to metallic surfaces on the substrate. The sacrificial coating allows for easy and reliable removal of unwanted carbon residues from the metallic surfaces prior to electroplating.
摘要翻译： 提出了制备用于电镀的非导电衬底的方法。 所提出的方法包括在脱胶后将基底与组合的中和/牺牲涂层溶液接触，然后用碳分散溶液处理。 组合的中和/牺牲涂层溶液中和去污步骤中的高锰酸盐残留物，并在基材上的金属表面施加牺牲涂层。 牺牲涂层允许在电镀之前从金属表面容易且可靠地去除不需要的碳残余物。
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